JPS5712522A - Forming method of pattern - Google Patents

Forming method of pattern

Info

Publication number
JPS5712522A
JPS5712522A JP8662680A JP8662680A JPS5712522A JP S5712522 A JPS5712522 A JP S5712522A JP 8662680 A JP8662680 A JP 8662680A JP 8662680 A JP8662680 A JP 8662680A JP S5712522 A JPS5712522 A JP S5712522A
Authority
JP
Japan
Prior art keywords
region
pattern
resist
film
ultraviolet rays
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8662680A
Other languages
English (en)
Other versions
JPS6156867B2 (ja
Inventor
Yoji Maruyama
Kozo Mochiji
Shinji Okazaki
Fumio Murai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP8662680A priority Critical patent/JPS5712522A/ja
Priority to DE8181301422T priority patent/DE3175019D1/de
Priority to EP81301422A priority patent/EP0037708B1/en
Priority to US06/250,217 priority patent/US4403151A/en
Publication of JPS5712522A publication Critical patent/JPS5712522A/ja
Publication of JPS6156867B2 publication Critical patent/JPS6156867B2/ja
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
    • G03F7/7045—Hybrid exposures, i.e. multiple exposures of the same area using different types of exposure apparatus, e.g. combining projection, proximity, direct write, interferometric, UV, x-ray or particle beam
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0082—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the exposure method of radiation-sensitive masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Electron Beam Exposure (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP8662680A 1980-04-02 1980-06-27 Forming method of pattern Granted JPS5712522A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP8662680A JPS5712522A (en) 1980-06-27 1980-06-27 Forming method of pattern
DE8181301422T DE3175019D1 (en) 1980-04-02 1981-04-01 Method of forming patterns
EP81301422A EP0037708B1 (en) 1980-04-02 1981-04-01 Method of forming patterns
US06/250,217 US4403151A (en) 1980-04-02 1981-04-02 Method of forming patterns

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8662680A JPS5712522A (en) 1980-06-27 1980-06-27 Forming method of pattern

Publications (2)

Publication Number Publication Date
JPS5712522A true JPS5712522A (en) 1982-01-22
JPS6156867B2 JPS6156867B2 (ja) 1986-12-04

Family

ID=13892228

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8662680A Granted JPS5712522A (en) 1980-04-02 1980-06-27 Forming method of pattern

Country Status (1)

Country Link
JP (1) JPS5712522A (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59141230A (ja) * 1983-02-02 1984-08-13 Mitsubishi Electric Corp パタ−ン形成方法
US6143473A (en) * 1998-05-20 2000-11-07 Fujitsu Limited Film patterning method utilizing post-development residue remover

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0194042U (ja) * 1987-12-15 1989-06-21

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59141230A (ja) * 1983-02-02 1984-08-13 Mitsubishi Electric Corp パタ−ン形成方法
JPH0544169B2 (ja) * 1983-02-02 1993-07-05 Mitsubishi Electric Corp
US6143473A (en) * 1998-05-20 2000-11-07 Fujitsu Limited Film patterning method utilizing post-development residue remover

Also Published As

Publication number Publication date
JPS6156867B2 (ja) 1986-12-04

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