JPS57124441A - Control of semiconductor surface reaction - Google Patents
Control of semiconductor surface reactionInfo
- Publication number
- JPS57124441A JPS57124441A JP908481A JP908481A JPS57124441A JP S57124441 A JPS57124441 A JP S57124441A JP 908481 A JP908481 A JP 908481A JP 908481 A JP908481 A JP 908481A JP S57124441 A JPS57124441 A JP S57124441A
- Authority
- JP
- Japan
- Prior art keywords
- chemical
- semiconductor
- semiconductor surface
- wafer
- treatment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title abstract 6
- 238000006557 surface reaction Methods 0.000 title 1
- 239000000126 substance Substances 0.000 abstract 3
- 238000004140 cleaning Methods 0.000 abstract 2
- 239000000463 material Substances 0.000 abstract 2
- 239000007779 soft material Substances 0.000 abstract 2
- 238000005406 washing Methods 0.000 abstract 2
- 238000000034 method Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
- H01L21/3046—Mechanical treatment, e.g. grinding, polishing, cutting using blasting, e.g. sand-blasting
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Weting (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP908481A JPS57124441A (en) | 1981-01-26 | 1981-01-26 | Control of semiconductor surface reaction |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP908481A JPS57124441A (en) | 1981-01-26 | 1981-01-26 | Control of semiconductor surface reaction |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57124441A true JPS57124441A (en) | 1982-08-03 |
| JPH0136248B2 JPH0136248B2 (enrdf_load_stackoverflow) | 1989-07-31 |
Family
ID=11710746
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP908481A Granted JPS57124441A (en) | 1981-01-26 | 1981-01-26 | Control of semiconductor surface reaction |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57124441A (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59127838A (ja) * | 1983-01-11 | 1984-07-23 | Sumitomo Electric Ind Ltd | ミラ−ウエハの連続エツチング装置 |
| JPS60121777A (ja) * | 1983-12-06 | 1985-06-29 | Toshiba Corp | シリコン結晶体の接合方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5184371U (enrdf_load_stackoverflow) * | 1974-12-26 | 1976-07-06 | ||
| JPS54145980A (en) * | 1978-05-09 | 1979-11-14 | Omron Tateisi Electronics Co | Twoowire contactless microswitch |
-
1981
- 1981-01-26 JP JP908481A patent/JPS57124441A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5184371U (enrdf_load_stackoverflow) * | 1974-12-26 | 1976-07-06 | ||
| JPS54145980A (en) * | 1978-05-09 | 1979-11-14 | Omron Tateisi Electronics Co | Twoowire contactless microswitch |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59127838A (ja) * | 1983-01-11 | 1984-07-23 | Sumitomo Electric Ind Ltd | ミラ−ウエハの連続エツチング装置 |
| JPS60121777A (ja) * | 1983-12-06 | 1985-06-29 | Toshiba Corp | シリコン結晶体の接合方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0136248B2 (enrdf_load_stackoverflow) | 1989-07-31 |
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