JPS571237A - Combined integrared circuit device - Google Patents

Combined integrared circuit device

Info

Publication number
JPS571237A
JPS571237A JP7457280A JP7457280A JPS571237A JP S571237 A JPS571237 A JP S571237A JP 7457280 A JP7457280 A JP 7457280A JP 7457280 A JP7457280 A JP 7457280A JP S571237 A JPS571237 A JP S571237A
Authority
JP
Japan
Prior art keywords
lead
circuit device
power transistor
integrared
combined
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7457280A
Other languages
English (en)
Inventor
Kenji Nagashima
Masataka Tanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP7457280A priority Critical patent/JPS571237A/ja
Publication of JPS571237A publication Critical patent/JPS571237A/ja
Pending legal-status Critical Current

Links

Classifications

    • H10W72/50—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H10W72/07551—
    • H10W72/5363—
    • H10W72/884—
    • H10W90/734—
    • H10W90/753—
    • H10W90/754—

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Wire Bonding (AREA)
JP7457280A 1980-06-03 1980-06-03 Combined integrared circuit device Pending JPS571237A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7457280A JPS571237A (en) 1980-06-03 1980-06-03 Combined integrared circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7457280A JPS571237A (en) 1980-06-03 1980-06-03 Combined integrared circuit device

Publications (1)

Publication Number Publication Date
JPS571237A true JPS571237A (en) 1982-01-06

Family

ID=13551041

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7457280A Pending JPS571237A (en) 1980-06-03 1980-06-03 Combined integrared circuit device

Country Status (1)

Country Link
JP (1) JPS571237A (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7588755B1 (en) 1980-04-03 2009-09-15 Biogen Idec Ma Inc. DNA sequences, recombinant DNA molecules and processes for producing human fibroblast interferon-like polypeptides

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7588755B1 (en) 1980-04-03 2009-09-15 Biogen Idec Ma Inc. DNA sequences, recombinant DNA molecules and processes for producing human fibroblast interferon-like polypeptides

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