JPS57118635A - Manufacture of semiconductor device - Google Patents
Manufacture of semiconductor deviceInfo
- Publication number
- JPS57118635A JPS57118635A JP528781A JP528781A JPS57118635A JP S57118635 A JPS57118635 A JP S57118635A JP 528781 A JP528781 A JP 528781A JP 528781 A JP528781 A JP 528781A JP S57118635 A JPS57118635 A JP S57118635A
- Authority
- JP
- Japan
- Prior art keywords
- reaction tube
- hydrogen ion
- electrodes
- hydrogen
- plasma generator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title abstract 3
- 238000004519 manufacturing process Methods 0.000 title 1
- GPRLSGONYQIRFK-UHFFFAOYSA-N hydron Chemical compound [H+] GPRLSGONYQIRFK-UHFFFAOYSA-N 0.000 abstract 4
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 abstract 3
- 238000000137 annealing Methods 0.000 abstract 2
- 239000001257 hydrogen Substances 0.000 abstract 1
- 229910052739 hydrogen Inorganic materials 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
- 238000007669 thermal treatment Methods 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electrodes Of Semiconductors (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP528781A JPS57118635A (en) | 1981-01-16 | 1981-01-16 | Manufacture of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP528781A JPS57118635A (en) | 1981-01-16 | 1981-01-16 | Manufacture of semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS57118635A true JPS57118635A (en) | 1982-07-23 |
JPS6230686B2 JPS6230686B2 (enrdf_load_stackoverflow) | 1987-07-03 |
Family
ID=11607016
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP528781A Granted JPS57118635A (en) | 1981-01-16 | 1981-01-16 | Manufacture of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57118635A (enrdf_load_stackoverflow) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5910320A (ja) * | 1982-07-09 | 1984-01-19 | Asahi Chem Ind Co Ltd | 「ろ」材 |
JPH02219225A (ja) * | 1989-02-20 | 1990-08-31 | Matsushita Electric Ind Co Ltd | 膜堆積装置および膜堆積方法 |
US5543336A (en) * | 1993-11-30 | 1996-08-06 | Hitachi, Ltd. | Removing damage caused by plasma etching and high energy implantation using hydrogen |
JP2003151917A (ja) * | 2001-11-09 | 2003-05-23 | Sanyo Electric Co Ltd | 半導体装置の製造方法 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5534431A (en) * | 1978-08-31 | 1980-03-11 | Fujitsu Ltd | Method of treating semiconductor element |
-
1981
- 1981-01-16 JP JP528781A patent/JPS57118635A/ja active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5534431A (en) * | 1978-08-31 | 1980-03-11 | Fujitsu Ltd | Method of treating semiconductor element |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5910320A (ja) * | 1982-07-09 | 1984-01-19 | Asahi Chem Ind Co Ltd | 「ろ」材 |
JPH02219225A (ja) * | 1989-02-20 | 1990-08-31 | Matsushita Electric Ind Co Ltd | 膜堆積装置および膜堆積方法 |
US5543336A (en) * | 1993-11-30 | 1996-08-06 | Hitachi, Ltd. | Removing damage caused by plasma etching and high energy implantation using hydrogen |
JP2003151917A (ja) * | 2001-11-09 | 2003-05-23 | Sanyo Electric Co Ltd | 半導体装置の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JPS6230686B2 (enrdf_load_stackoverflow) | 1987-07-03 |
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