JPS57116738A - Copper alloy for lead material of semiconductor apparatus - Google Patents
Copper alloy for lead material of semiconductor apparatusInfo
- Publication number
- JPS57116738A JPS57116738A JP163081A JP163081A JPS57116738A JP S57116738 A JPS57116738 A JP S57116738A JP 163081 A JP163081 A JP 163081A JP 163081 A JP163081 A JP 163081A JP S57116738 A JPS57116738 A JP S57116738A
- Authority
- JP
- Japan
- Prior art keywords
- alloy
- semiconductor apparatus
- lead material
- deteriorates
- reason
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Conductive Materials (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP163081A JPS594493B2 (ja) | 1981-01-10 | 1981-01-10 | 半導体機器のリ−ド材用銅合金 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP163081A JPS594493B2 (ja) | 1981-01-10 | 1981-01-10 | 半導体機器のリ−ド材用銅合金 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS57116738A true JPS57116738A (en) | 1982-07-20 |
JPS594493B2 JPS594493B2 (ja) | 1984-01-30 |
Family
ID=11506847
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP163081A Expired JPS594493B2 (ja) | 1981-01-10 | 1981-01-10 | 半導体機器のリ−ド材用銅合金 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS594493B2 (ja) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4466939A (en) * | 1982-10-20 | 1984-08-21 | Poong San Metal Corporation | Process of producing copper-alloy and copper alloy plate used for making electrical or electronic parts |
JPS59153853A (ja) * | 1983-02-21 | 1984-09-01 | Hitachi Metals Ltd | リ−ドフレ−ム材 |
JPS60215723A (ja) * | 1985-03-19 | 1985-10-29 | Nippon Mining Co Ltd | 半導体機器のリード材用銅合金 |
US4591484A (en) * | 1984-04-07 | 1986-05-27 | Kabushiki Kaisha Kobe Seiko Sho | Lead materials for semiconductor devices |
JPS63310933A (ja) * | 1987-06-12 | 1988-12-19 | Furukawa Electric Co Ltd:The | 電子機器用パッケ−ジのリ−ド材 |
US5248351A (en) * | 1988-04-12 | 1993-09-28 | Mitsubishi Denki Kabushiki Kaisha | Copper Ni-Si-P alloy for an electronic device |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08314598A (ja) * | 1995-05-23 | 1996-11-29 | Nec Gumma Ltd | キーボード |
-
1981
- 1981-01-10 JP JP163081A patent/JPS594493B2/ja not_active Expired
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4466939A (en) * | 1982-10-20 | 1984-08-21 | Poong San Metal Corporation | Process of producing copper-alloy and copper alloy plate used for making electrical or electronic parts |
JPS59153853A (ja) * | 1983-02-21 | 1984-09-01 | Hitachi Metals Ltd | リ−ドフレ−ム材 |
JPS6140290B2 (ja) * | 1983-02-21 | 1986-09-08 | Hitachi Metals Ltd | |
US4591484A (en) * | 1984-04-07 | 1986-05-27 | Kabushiki Kaisha Kobe Seiko Sho | Lead materials for semiconductor devices |
JPS60215723A (ja) * | 1985-03-19 | 1985-10-29 | Nippon Mining Co Ltd | 半導体機器のリード材用銅合金 |
JPH0218376B2 (ja) * | 1985-03-19 | 1990-04-25 | Nippon Mining Co | |
JPS63310933A (ja) * | 1987-06-12 | 1988-12-19 | Furukawa Electric Co Ltd:The | 電子機器用パッケ−ジのリ−ド材 |
JPH0788550B2 (ja) * | 1987-06-12 | 1995-09-27 | 古河電気工業株式会社 | 電子機器用パッケ−ジのリ−ド材 |
US5248351A (en) * | 1988-04-12 | 1993-09-28 | Mitsubishi Denki Kabushiki Kaisha | Copper Ni-Si-P alloy for an electronic device |
Also Published As
Publication number | Publication date |
---|---|
JPS594493B2 (ja) | 1984-01-30 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS572851A (en) | Copper alloy for lead material of semiconductor device | |
EP0122160A3 (en) | Composition suitable for inert electrode | |
JPS57116738A (en) | Copper alloy for lead material of semiconductor apparatus | |
JPS5751233A (en) | Special brass with dezincification corrosion resistance | |
JPS6425929A (en) | Copper alloy for electronic equipment | |
JPS572849A (en) | Copper alloy for electronic parts | |
JPS5789448A (en) | Copper alloy for conducting electricity | |
JPS57108235A (en) | Copper alloy for lead frame | |
JPS57155353A (en) | Fe-ni alloy good in hot workability | |
JPS57169047A (en) | Copper alloy for lead material of semiconductor device | |
JPS5521530A (en) | High tensile copper alloy with superior heat resistance and conductivity | |
JPS56166352A (en) | Functional copper alloy | |
JPS57145955A (en) | Thin copper alloy wire with high strength and flexibility | |
JPS57145956A (en) | Thin copper alloy wire with high strength and flexibility | |
JPS572850A (en) | Copper alloy for lead material of semiconductor device | |
JPS5690946A (en) | High strength copper alloy with high electric conductivity | |
JPS5763653A (en) | Wear resistant brass alloy | |
JPS56105645A (en) | Copper alloy for lead and lead frame of semiconductor apparatus | |
JPS53103926A (en) | Copper alloy for electric conductor of stable contact resistance and its manufacture | |
JPS5785949A (en) | Corrosion resistant copper alloy | |
JPS57109357A (en) | Copper alloy for semiconductor device lead | |
JPS5760092A (en) | Copper-tin alloy plating bath | |
JPS5782455A (en) | Low expansive alloy | |
JPS56142840A (en) | Copper alloy having minute crystal grain | |
JPS56156732A (en) | Heat resistant copper alloy with high electrical conductivity |