JPS57115997A - Low melting point cu-ag alloy brazing filler metal of good wettability - Google Patents

Low melting point cu-ag alloy brazing filler metal of good wettability

Info

Publication number
JPS57115997A
JPS57115997A JP174181A JP174181A JPS57115997A JP S57115997 A JPS57115997 A JP S57115997A JP 174181 A JP174181 A JP 174181A JP 174181 A JP174181 A JP 174181A JP S57115997 A JPS57115997 A JP S57115997A
Authority
JP
Japan
Prior art keywords
brazing filler
filler metal
good wettability
alloy brazing
melting point
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP174181A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6116239B2 (enrdf_load_stackoverflow
Inventor
Hideaki Yoshida
Masaki Morikawa
Kunio Kishida
Tadaharu Tanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Metal Corp
Original Assignee
Mitsubishi Metal Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Metal Corp filed Critical Mitsubishi Metal Corp
Priority to JP174181A priority Critical patent/JPS57115997A/ja
Publication of JPS57115997A publication Critical patent/JPS57115997A/ja
Publication of JPS6116239B2 publication Critical patent/JPS6116239B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/302—Cu as the principal constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Ceramic Products (AREA)
JP174181A 1981-01-09 1981-01-09 Low melting point cu-ag alloy brazing filler metal of good wettability Granted JPS57115997A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP174181A JPS57115997A (en) 1981-01-09 1981-01-09 Low melting point cu-ag alloy brazing filler metal of good wettability

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP174181A JPS57115997A (en) 1981-01-09 1981-01-09 Low melting point cu-ag alloy brazing filler metal of good wettability

Publications (2)

Publication Number Publication Date
JPS57115997A true JPS57115997A (en) 1982-07-19
JPS6116239B2 JPS6116239B2 (enrdf_load_stackoverflow) 1986-04-28

Family

ID=11509983

Family Applications (1)

Application Number Title Priority Date Filing Date
JP174181A Granted JPS57115997A (en) 1981-01-09 1981-01-09 Low melting point cu-ag alloy brazing filler metal of good wettability

Country Status (1)

Country Link
JP (1) JPS57115997A (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5961593A (ja) * 1982-09-25 1984-04-07 デグツサ・アクチエンゲゼルシヤフト 酸化物含有銀接点材料を直接ハンダ付けするためのハンダ合金
US4459264A (en) * 1983-03-14 1984-07-10 Gte Products Corporation Reactive metal-palladium-silver brazing alloys
CN110317969A (zh) * 2018-03-28 2019-10-11 住友金属矿山株式会社 焊料接合电极以及焊料接合电极的覆膜形成用铜合金靶

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5961593A (ja) * 1982-09-25 1984-04-07 デグツサ・アクチエンゲゼルシヤフト 酸化物含有銀接点材料を直接ハンダ付けするためのハンダ合金
US4459264A (en) * 1983-03-14 1984-07-10 Gte Products Corporation Reactive metal-palladium-silver brazing alloys
CN110317969A (zh) * 2018-03-28 2019-10-11 住友金属矿山株式会社 焊料接合电极以及焊料接合电极的覆膜形成用铜合金靶
CN110317969B (zh) * 2018-03-28 2022-01-14 住友金属矿山株式会社 焊料接合电极以及焊料接合电极的覆膜形成用铜合金靶

Also Published As

Publication number Publication date
JPS6116239B2 (enrdf_load_stackoverflow) 1986-04-28

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