JPS57111052A - Cooler for semiconductor - Google Patents

Cooler for semiconductor

Info

Publication number
JPS57111052A
JPS57111052A JP18603780A JP18603780A JPS57111052A JP S57111052 A JPS57111052 A JP S57111052A JP 18603780 A JP18603780 A JP 18603780A JP 18603780 A JP18603780 A JP 18603780A JP S57111052 A JPS57111052 A JP S57111052A
Authority
JP
Japan
Prior art keywords
cooling conductor
cooling
conductor
semiconductor elements
pressing plates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18603780A
Other languages
Japanese (ja)
Inventor
Motoi Takeuchi
Kazuaki Akaboshi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Co Ltd
Fuji Electric Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Co Ltd, Fuji Electric Manufacturing Co Ltd filed Critical Fuji Electric Co Ltd
Priority to JP18603780A priority Critical patent/JPS57111052A/en
Publication of JPS57111052A publication Critical patent/JPS57111052A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE:To reduce the number of parts and to contrive to simplify connection and to form a cooler for semiconductor in small size by a method wherein semiconductor elements and pressing means are provided at both sides of a cooling conductor arranged at the center part. CONSTITUTION:The cooling conductor 15 is arranged at the center part, and the semiconductor elements 13 are provided at the symmetrical positions on both the sides thereof facing to the outsides and being adhered to the cooling conductor 15. Cooling bodies 1 are adhered with pressure to the other faces of the semiconductor elements 13, and pressing metal fittings 3 thereof are fixed to pressing plates 14 with nuts 8 through insulating bases 2, Belleville springs 4, set screws 6. Penetrating holes 16 are formed in the cooling conductor 15 interposing an interval between them, bolts 7 covered with insulating pipes 5 are made to penetrate in the penetrating holes 16, and the pressing plates 14 are connected with nuts 9. Moreover, insulating bushings 17 are arranged on the other places of the cooling conductor 15, and the prescribed intervals are held between the cooling conductor 15 and the pressing plates 14. Because the cooling conductor is arranged symmetrically like this, the number of component parts is reduced.
JP18603780A 1980-12-27 1980-12-27 Cooler for semiconductor Pending JPS57111052A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18603780A JPS57111052A (en) 1980-12-27 1980-12-27 Cooler for semiconductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18603780A JPS57111052A (en) 1980-12-27 1980-12-27 Cooler for semiconductor

Publications (1)

Publication Number Publication Date
JPS57111052A true JPS57111052A (en) 1982-07-10

Family

ID=16181288

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18603780A Pending JPS57111052A (en) 1980-12-27 1980-12-27 Cooler for semiconductor

Country Status (1)

Country Link
JP (1) JPS57111052A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014112583A (en) * 2012-12-05 2014-06-19 Toyota Motor Corp Semiconductor module with cooler

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014112583A (en) * 2012-12-05 2014-06-19 Toyota Motor Corp Semiconductor module with cooler

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