JPS57109356A - Copper alloy for semiconductor device lead - Google Patents

Copper alloy for semiconductor device lead

Info

Publication number
JPS57109356A
JPS57109356A JP18396680A JP18396680A JPS57109356A JP S57109356 A JPS57109356 A JP S57109356A JP 18396680 A JP18396680 A JP 18396680A JP 18396680 A JP18396680 A JP 18396680A JP S57109356 A JPS57109356 A JP S57109356A
Authority
JP
Japan
Prior art keywords
alloy
base
semiconductor device
copper alloy
strength
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP18396680A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6218617B2 (enrdf_load_stackoverflow
Inventor
Akira Kano
Masahiro Tsuji
Susumu Kawauchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nihon Kogyo KK
Eneos Corp
Original Assignee
Nihon Kogyo KK
Nippon Mining Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nihon Kogyo KK, Nippon Mining Co Ltd filed Critical Nihon Kogyo KK
Priority to JP18396680A priority Critical patent/JPS57109356A/ja
Publication of JPS57109356A publication Critical patent/JPS57109356A/ja
Publication of JPS6218617B2 publication Critical patent/JPS6218617B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495Lead-frames or other flat leads
    • H01L23/49579Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Conductive Materials (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP18396680A 1980-12-26 1980-12-26 Copper alloy for semiconductor device lead Granted JPS57109356A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18396680A JPS57109356A (en) 1980-12-26 1980-12-26 Copper alloy for semiconductor device lead

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18396680A JPS57109356A (en) 1980-12-26 1980-12-26 Copper alloy for semiconductor device lead

Publications (2)

Publication Number Publication Date
JPS57109356A true JPS57109356A (en) 1982-07-07
JPS6218617B2 JPS6218617B2 (enrdf_load_stackoverflow) 1987-04-23

Family

ID=16144930

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18396680A Granted JPS57109356A (en) 1980-12-26 1980-12-26 Copper alloy for semiconductor device lead

Country Status (1)

Country Link
JP (1) JPS57109356A (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58104148A (ja) * 1981-12-14 1983-06-21 Furukawa Electric Co Ltd:The 半導体機器のリ−ド材用銅合金
NL8303605A (nl) * 1982-10-20 1984-05-16 Poong San Metal Corp Koper-nikkellegering en werkwijze voor het vervaardigen hiervan.
US4591484A (en) * 1984-04-07 1986-05-27 Kabushiki Kaisha Kobe Seiko Sho Lead materials for semiconductor devices

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58104148A (ja) * 1981-12-14 1983-06-21 Furukawa Electric Co Ltd:The 半導体機器のリ−ド材用銅合金
NL8303605A (nl) * 1982-10-20 1984-05-16 Poong San Metal Corp Koper-nikkellegering en werkwijze voor het vervaardigen hiervan.
US4466939A (en) * 1982-10-20 1984-08-21 Poong San Metal Corporation Process of producing copper-alloy and copper alloy plate used for making electrical or electronic parts
US4591484A (en) * 1984-04-07 1986-05-27 Kabushiki Kaisha Kobe Seiko Sho Lead materials for semiconductor devices

Also Published As

Publication number Publication date
JPS6218617B2 (enrdf_load_stackoverflow) 1987-04-23

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