JPS57109356A - Copper alloy for semiconductor device lead - Google Patents
Copper alloy for semiconductor device leadInfo
- Publication number
- JPS57109356A JPS57109356A JP18396680A JP18396680A JPS57109356A JP S57109356 A JPS57109356 A JP S57109356A JP 18396680 A JP18396680 A JP 18396680A JP 18396680 A JP18396680 A JP 18396680A JP S57109356 A JPS57109356 A JP S57109356A
- Authority
- JP
- Japan
- Prior art keywords
- alloy
- base
- semiconductor device
- copper alloy
- strength
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Conductive Materials (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18396680A JPS57109356A (en) | 1980-12-26 | 1980-12-26 | Copper alloy for semiconductor device lead |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18396680A JPS57109356A (en) | 1980-12-26 | 1980-12-26 | Copper alloy for semiconductor device lead |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS57109356A true JPS57109356A (en) | 1982-07-07 |
JPS6218617B2 JPS6218617B2 (enrdf_load_stackoverflow) | 1987-04-23 |
Family
ID=16144930
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP18396680A Granted JPS57109356A (en) | 1980-12-26 | 1980-12-26 | Copper alloy for semiconductor device lead |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57109356A (enrdf_load_stackoverflow) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58104148A (ja) * | 1981-12-14 | 1983-06-21 | Furukawa Electric Co Ltd:The | 半導体機器のリ−ド材用銅合金 |
NL8303605A (nl) * | 1982-10-20 | 1984-05-16 | Poong San Metal Corp | Koper-nikkellegering en werkwijze voor het vervaardigen hiervan. |
US4591484A (en) * | 1984-04-07 | 1986-05-27 | Kabushiki Kaisha Kobe Seiko Sho | Lead materials for semiconductor devices |
-
1980
- 1980-12-26 JP JP18396680A patent/JPS57109356A/ja active Granted
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58104148A (ja) * | 1981-12-14 | 1983-06-21 | Furukawa Electric Co Ltd:The | 半導体機器のリ−ド材用銅合金 |
NL8303605A (nl) * | 1982-10-20 | 1984-05-16 | Poong San Metal Corp | Koper-nikkellegering en werkwijze voor het vervaardigen hiervan. |
US4466939A (en) * | 1982-10-20 | 1984-08-21 | Poong San Metal Corporation | Process of producing copper-alloy and copper alloy plate used for making electrical or electronic parts |
US4591484A (en) * | 1984-04-07 | 1986-05-27 | Kabushiki Kaisha Kobe Seiko Sho | Lead materials for semiconductor devices |
Also Published As
Publication number | Publication date |
---|---|
JPS6218617B2 (enrdf_load_stackoverflow) | 1987-04-23 |
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