JPS57104669A - Multistage chemical vessel treating device - Google Patents
Multistage chemical vessel treating deviceInfo
- Publication number
- JPS57104669A JPS57104669A JP17886780A JP17886780A JPS57104669A JP S57104669 A JPS57104669 A JP S57104669A JP 17886780 A JP17886780 A JP 17886780A JP 17886780 A JP17886780 A JP 17886780A JP S57104669 A JPS57104669 A JP S57104669A
- Authority
- JP
- Japan
- Prior art keywords
- vessel
- wafers
- rinsing
- immersed
- shifted
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE: To provide a multistage chemical vessel treating device which prevents mixing of chemicals (gases) in each chemical chamber and permits good treatment by providing a pair of partition walls between different chemical chambers to form buffer chambers, and terminating the bottom ends of the respective partition chambers within respectively different rinsing vessels.
CONSTITUTION: Wafers 25 contained in a cartridge 24 are immersed in a liquid vessel 12 and is thereby subjected to org. etching, after which they are immersed in a rinsing vessel 16 by the operation of a transfer device 21, thence they are placed on a plate 26b. Next, an underwater bus arm 26 is moved downward and in the uppermost position an arm 26a is turned laterally, by which the wafers 25 are passed under the partition wall 18, and are shifted to the right side of the vessel 16. The arm 26a is next moved upward to shift the wafers 25 to the upper part of the vessel 16 facing a buffer chamber 20, after which they are moved from the vessel 16 into a rinsing vessel 17. In the vessel 17, the wafers 25 are passed under the partition wall 19 and are moved to the right side by the operation similar to the above, whereby they are fed into an inorg. etching chamber 11, thence the wafers 25 are shifted from the vessel 17 into a liquid vessel 13, where they are immersed in the liquid and are thereby etched. The wafers 25 completed of the etching are shifted into a rinsing vessel 28 of the post process, where they are rinsed.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17886780A JPS57104669A (en) | 1980-12-19 | 1980-12-19 | Multistage chemical vessel treating device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17886780A JPS57104669A (en) | 1980-12-19 | 1980-12-19 | Multistage chemical vessel treating device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS57104669A true JPS57104669A (en) | 1982-06-29 |
Family
ID=16056066
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP17886780A Pending JPS57104669A (en) | 1980-12-19 | 1980-12-19 | Multistage chemical vessel treating device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57104669A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AT383147B (en) * | 1985-08-28 | 1987-05-25 | Voest Alpine Ag | DEVICE FOR PLASMING PCBS OR THE LIKE. |
CN103409752A (en) * | 2013-07-18 | 2013-11-27 | 新奥光伏能源有限公司 | Wet etching apparatus and wet etching method |
-
1980
- 1980-12-19 JP JP17886780A patent/JPS57104669A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AT383147B (en) * | 1985-08-28 | 1987-05-25 | Voest Alpine Ag | DEVICE FOR PLASMING PCBS OR THE LIKE. |
CN103409752A (en) * | 2013-07-18 | 2013-11-27 | 新奥光伏能源有限公司 | Wet etching apparatus and wet etching method |
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