JPS57103337A - Heat transfer connecting device and manufacture thereof - Google Patents

Heat transfer connecting device and manufacture thereof

Info

Publication number
JPS57103337A
JPS57103337A JP17888580A JP17888580A JPS57103337A JP S57103337 A JPS57103337 A JP S57103337A JP 17888580 A JP17888580 A JP 17888580A JP 17888580 A JP17888580 A JP 17888580A JP S57103337 A JPS57103337 A JP S57103337A
Authority
JP
Japan
Prior art keywords
fins
heat transfer
cap
chip
many
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP17888580A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6132819B2 (enrdf_load_stackoverflow
Inventor
Takahiro Oguro
Noriyuki Ashiwake
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP17888580A priority Critical patent/JPS57103337A/ja
Publication of JPS57103337A publication Critical patent/JPS57103337A/ja
Publication of JPS6132819B2 publication Critical patent/JPS6132819B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4338—Pistons, e.g. spring-loaded members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP17888580A 1980-12-19 1980-12-19 Heat transfer connecting device and manufacture thereof Granted JPS57103337A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17888580A JPS57103337A (en) 1980-12-19 1980-12-19 Heat transfer connecting device and manufacture thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17888580A JPS57103337A (en) 1980-12-19 1980-12-19 Heat transfer connecting device and manufacture thereof

Publications (2)

Publication Number Publication Date
JPS57103337A true JPS57103337A (en) 1982-06-26
JPS6132819B2 JPS6132819B2 (enrdf_load_stackoverflow) 1986-07-29

Family

ID=16056393

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17888580A Granted JPS57103337A (en) 1980-12-19 1980-12-19 Heat transfer connecting device and manufacture thereof

Country Status (1)

Country Link
JP (1) JPS57103337A (enrdf_load_stackoverflow)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59144153A (ja) * 1983-02-07 1984-08-18 Nec Corp 集積回路パツケ−ジ冷却構造
JPS60126853A (ja) * 1983-12-14 1985-07-06 Hitachi Ltd 半導体デバイス冷却装置
JPS62269345A (ja) * 1986-05-12 1987-11-21 インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション 半導体パツケ−ジ構造体
US5133403A (en) * 1988-10-19 1992-07-28 Hitachi, Ltd. Cooling arrangement for semiconductor devices and method of making the same
US5177667A (en) * 1991-10-25 1993-01-05 International Business Machines Corporation Thermal conduction module with integral impingement cooling
US5239200A (en) * 1991-08-21 1993-08-24 International Business Machines Corporation Apparatus for cooling integrated circuit chips
US5402004A (en) * 1990-08-14 1995-03-28 Texas Instruments Incorporated Heat transfer module for ultra high density and silicon on silicon packaging applications
US5705850A (en) * 1993-09-20 1998-01-06 Hitachi, Ltd. Semiconductor module
EP0848469A1 (fr) * 1996-12-10 1998-06-17 Barat S.A. Dispositif de dissipateur thermique pour armoire de distribution électrique ou analogue, contenue dans un ouvrage souterrain
KR20050079962A (ko) * 2005-06-22 2005-08-11 박재석 압축가스를 이용한 발열체의 냉각방법 및 그 장치
CN105118811A (zh) * 2015-07-27 2015-12-02 电子科技大学 一种采用均热板及微通道对多热源器件散热的均温装置
JP2016122864A (ja) * 2016-03-22 2016-07-07 株式会社日立製作所 発熱体の冷却構造
US9807913B2 (en) 2014-09-29 2017-10-31 Hitachi, Ltd. Cooling structure of heating element and power conversion device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3524479A (en) * 1968-07-19 1970-08-18 Scovill Manufacturing Co Woven zipper stringer and method of making the same

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3524479A (en) * 1968-07-19 1970-08-18 Scovill Manufacturing Co Woven zipper stringer and method of making the same

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59144153A (ja) * 1983-02-07 1984-08-18 Nec Corp 集積回路パツケ−ジ冷却構造
JPS60126853A (ja) * 1983-12-14 1985-07-06 Hitachi Ltd 半導体デバイス冷却装置
JPS62269345A (ja) * 1986-05-12 1987-11-21 インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション 半導体パツケ−ジ構造体
US5133403A (en) * 1988-10-19 1992-07-28 Hitachi, Ltd. Cooling arrangement for semiconductor devices and method of making the same
US5402004A (en) * 1990-08-14 1995-03-28 Texas Instruments Incorporated Heat transfer module for ultra high density and silicon on silicon packaging applications
US5239200A (en) * 1991-08-21 1993-08-24 International Business Machines Corporation Apparatus for cooling integrated circuit chips
US5177667A (en) * 1991-10-25 1993-01-05 International Business Machines Corporation Thermal conduction module with integral impingement cooling
US5705850A (en) * 1993-09-20 1998-01-06 Hitachi, Ltd. Semiconductor module
EP0848469A1 (fr) * 1996-12-10 1998-06-17 Barat S.A. Dispositif de dissipateur thermique pour armoire de distribution électrique ou analogue, contenue dans un ouvrage souterrain
KR20050079962A (ko) * 2005-06-22 2005-08-11 박재석 압축가스를 이용한 발열체의 냉각방법 및 그 장치
US9807913B2 (en) 2014-09-29 2017-10-31 Hitachi, Ltd. Cooling structure of heating element and power conversion device
CN105118811A (zh) * 2015-07-27 2015-12-02 电子科技大学 一种采用均热板及微通道对多热源器件散热的均温装置
JP2016122864A (ja) * 2016-03-22 2016-07-07 株式会社日立製作所 発熱体の冷却構造

Also Published As

Publication number Publication date
JPS6132819B2 (enrdf_load_stackoverflow) 1986-07-29

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