JPS57103319A - Hermetically sealing method for electronic part - Google Patents
Hermetically sealing method for electronic partInfo
- Publication number
- JPS57103319A JPS57103319A JP17980780A JP17980780A JPS57103319A JP S57103319 A JPS57103319 A JP S57103319A JP 17980780 A JP17980780 A JP 17980780A JP 17980780 A JP17980780 A JP 17980780A JP S57103319 A JPS57103319 A JP S57103319A
- Authority
- JP
- Japan
- Prior art keywords
- case
- resin
- bonded
- base
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17980780A JPS57103319A (en) | 1980-12-19 | 1980-12-19 | Hermetically sealing method for electronic part |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17980780A JPS57103319A (en) | 1980-12-19 | 1980-12-19 | Hermetically sealing method for electronic part |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57103319A true JPS57103319A (en) | 1982-06-26 |
| JPS632147B2 JPS632147B2 (enrdf_load_stackoverflow) | 1988-01-18 |
Family
ID=16072229
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17980780A Granted JPS57103319A (en) | 1980-12-19 | 1980-12-19 | Hermetically sealing method for electronic part |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57103319A (enrdf_load_stackoverflow) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5111571A (en) * | 1974-07-19 | 1976-01-29 | Nitto Electric Ind Co | Denkikairososhino patsukeejihoho |
-
1980
- 1980-12-19 JP JP17980780A patent/JPS57103319A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5111571A (en) * | 1974-07-19 | 1976-01-29 | Nitto Electric Ind Co | Denkikairososhino patsukeejihoho |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS632147B2 (enrdf_load_stackoverflow) | 1988-01-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| IE792037L (en) | Semiconductor package | |
| GB1296629A (enrdf_load_stackoverflow) | ||
| US3178506A (en) | Sealed functional molecular electronic device | |
| JPS57103319A (en) | Hermetically sealing method for electronic part | |
| GB1035219A (en) | Electronic device package and method of making same | |
| JPS5543878A (en) | Circuit unit | |
| US4190735A (en) | Semiconductor device package | |
| JPS642399A (en) | Semiconductor device | |
| JPS6468098A (en) | Remote control device | |
| JPS55158653A (en) | Hybrid integrated circuit device | |
| JPS56167337A (en) | Manufacture of resin-sealed type module | |
| JPS5623755A (en) | Assembly of semiconductor device | |
| JPS55163855A (en) | Method of opening sealed electronic part sealed by epoxy resin | |
| JPS57159032A (en) | Forming method for package of electronic timepiece | |
| JPH02211705A (ja) | 圧電発振器 | |
| JPS5710253A (en) | Semiconductor device | |
| KR910015037A (ko) | 금속전자 패키지 및 그 제조공정 | |
| JPS6333463Y2 (enrdf_load_stackoverflow) | ||
| JPS572537A (en) | Semiconductor device | |
| JPS6489356A (en) | Hybrid integrated circuit | |
| JPS5772413A (en) | Surface acoustic wave filter | |
| JPS57187955A (en) | Sealing structure of semiconductor element | |
| FR2271740A1 (en) | Combined semiconductor device-printed circuit board - with semiconductor device requiring fewer connections and less space in layout of board | |
| JPS5768054A (en) | Hermetically sealed container | |
| JPS56104454A (en) | Sealing method of semiconductor element |