JPS57102061A - Cooling device for semiconductor - Google Patents

Cooling device for semiconductor

Info

Publication number
JPS57102061A
JPS57102061A JP17724680A JP17724680A JPS57102061A JP S57102061 A JPS57102061 A JP S57102061A JP 17724680 A JP17724680 A JP 17724680A JP 17724680 A JP17724680 A JP 17724680A JP S57102061 A JPS57102061 A JP S57102061A
Authority
JP
Japan
Prior art keywords
potential
cooling
water
electrodes
currents
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17724680A
Other languages
Japanese (ja)
Inventor
Shigeo Kobayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP17724680A priority Critical patent/JPS57102061A/en
Publication of JPS57102061A publication Critical patent/JPS57102061A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Rectifiers (AREA)

Abstract

PURPOSE:To limit currents supplied into cooling water from a cooling fin, and to decrease the electrolytic etching of the cooling fin by mounting at least one pair of electrodes giving the cooling water potential to a water feed pipe and affording the potential of the cooling fin to the electrodes. CONSTITUTION:The potential controlling electrode 16(16-1-16-4) for giving water in the water feed pipes 5, 6 potential are mounted, and the potential of the cooling fins 14 at both ends pressure-welded to thyristor elements 9 is afforded to the potential controlling electrodes 16 by lead wires 18 and potential drawing terminals 17. Accordingly, currents are not supplied into the cooling water from the cooling fins 14, and the electrolytic etching of the cooling fins 14 generated through the feed of currents into the cooling water from the cooling fins 14 is removed.
JP17724680A 1980-12-17 1980-12-17 Cooling device for semiconductor Pending JPS57102061A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17724680A JPS57102061A (en) 1980-12-17 1980-12-17 Cooling device for semiconductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17724680A JPS57102061A (en) 1980-12-17 1980-12-17 Cooling device for semiconductor

Publications (1)

Publication Number Publication Date
JPS57102061A true JPS57102061A (en) 1982-06-24

Family

ID=16027703

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17724680A Pending JPS57102061A (en) 1980-12-17 1980-12-17 Cooling device for semiconductor

Country Status (1)

Country Link
JP (1) JPS57102061A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102016202748A1 (en) * 2016-02-04 2017-08-10 Siemens Aktiengesellschaft Series circuit arrangement of power semiconductors

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102016202748A1 (en) * 2016-02-04 2017-08-10 Siemens Aktiengesellschaft Series circuit arrangement of power semiconductors
WO2017133881A1 (en) * 2016-02-04 2017-08-10 Siemens Aktiengesellschaft Series circuit arrangement of power semiconductors
US10559519B2 (en) 2016-02-04 2020-02-11 Siemens Aktiengesellschaft Series circuit arrangement of power semiconductors

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