JPS57101691A - Partial plating method and apparatus - Google Patents
Partial plating method and apparatusInfo
- Publication number
- JPS57101691A JPS57101691A JP17708580A JP17708580A JPS57101691A JP S57101691 A JPS57101691 A JP S57101691A JP 17708580 A JP17708580 A JP 17708580A JP 17708580 A JP17708580 A JP 17708580A JP S57101691 A JPS57101691 A JP S57101691A
- Authority
- JP
- Japan
- Prior art keywords
- opening
- plating
- nozzle
- treated
- plating liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
PURPOSE: To carry out plating at a high speed and lower generation ratio of faulty product by a method wherein an anode nozzle for injecting a plating liquid to an object to be treated of a cathode is widely faced to the cathode and an opening of a plating liquid retreating passage is held therebetween.
CONSTITUTION: On a lower support member 6 having an upper surface opening with the size same to a partial plating area communicated with an opening 7 into which an anode 2 is inserted, an elastic mask 1 through which a bore with a size same to the partial plating area is pierced is placed. Then, the surface to be plated of an object 4 to be treated such as an IC or the like is contacted with the bore of the mask 1 and pushed down and fixed by an elastic plate 9. When six numbers of the objects 4 to be treated are simultaneously fixed in the manner as described above and a pump 13 is started, from a terminal end nozzle 2 of an arranged pipe 14, a plating liquid 3 is injected. Because a part of a nozzle opening 2a is opened to a wide flat surface faced to the surface to be plated, the plating liquid is stayed in an opening inner part 7a and flowed out from the narrow opening 7 by a stagnating pressure to be fallen through a nozzle box 12 and recovered in a storage tank 1 to be recirculated and used. Thereby, uniform plating can be carried out.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17708580A JPS57101691A (en) | 1980-12-17 | 1980-12-17 | Partial plating method and apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17708580A JPS57101691A (en) | 1980-12-17 | 1980-12-17 | Partial plating method and apparatus |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS57101691A true JPS57101691A (en) | 1982-06-24 |
JPH0151556B2 JPH0151556B2 (en) | 1989-11-06 |
Family
ID=16024857
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP17708580A Granted JPS57101691A (en) | 1980-12-17 | 1980-12-17 | Partial plating method and apparatus |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57101691A (en) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5320505U (en) * | 1976-07-29 | 1978-02-21 |
-
1980
- 1980-12-17 JP JP17708580A patent/JPS57101691A/en active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5320505U (en) * | 1976-07-29 | 1978-02-21 |
Also Published As
Publication number | Publication date |
---|---|
JPH0151556B2 (en) | 1989-11-06 |
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