JPS57101691A - Partial plating method and apparatus - Google Patents

Partial plating method and apparatus

Info

Publication number
JPS57101691A
JPS57101691A JP17708580A JP17708580A JPS57101691A JP S57101691 A JPS57101691 A JP S57101691A JP 17708580 A JP17708580 A JP 17708580A JP 17708580 A JP17708580 A JP 17708580A JP S57101691 A JPS57101691 A JP S57101691A
Authority
JP
Japan
Prior art keywords
opening
plating
nozzle
treated
plating liquid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP17708580A
Other languages
Japanese (ja)
Other versions
JPH0151556B2 (en
Inventor
Tetsuo Matsushita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyo Giken Kogyo KK
Original Assignee
Toyo Giken Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyo Giken Kogyo KK filed Critical Toyo Giken Kogyo KK
Priority to JP17708580A priority Critical patent/JPS57101691A/en
Publication of JPS57101691A publication Critical patent/JPS57101691A/en
Publication of JPH0151556B2 publication Critical patent/JPH0151556B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Electroplating Methods And Accessories (AREA)

Abstract

PURPOSE: To carry out plating at a high speed and lower generation ratio of faulty product by a method wherein an anode nozzle for injecting a plating liquid to an object to be treated of a cathode is widely faced to the cathode and an opening of a plating liquid retreating passage is held therebetween.
CONSTITUTION: On a lower support member 6 having an upper surface opening with the size same to a partial plating area communicated with an opening 7 into which an anode 2 is inserted, an elastic mask 1 through which a bore with a size same to the partial plating area is pierced is placed. Then, the surface to be plated of an object 4 to be treated such as an IC or the like is contacted with the bore of the mask 1 and pushed down and fixed by an elastic plate 9. When six numbers of the objects 4 to be treated are simultaneously fixed in the manner as described above and a pump 13 is started, from a terminal end nozzle 2 of an arranged pipe 14, a plating liquid 3 is injected. Because a part of a nozzle opening 2a is opened to a wide flat surface faced to the surface to be plated, the plating liquid is stayed in an opening inner part 7a and flowed out from the narrow opening 7 by a stagnating pressure to be fallen through a nozzle box 12 and recovered in a storage tank 1 to be recirculated and used. Thereby, uniform plating can be carried out.
COPYRIGHT: (C)1982,JPO&Japio
JP17708580A 1980-12-17 1980-12-17 Partial plating method and apparatus Granted JPS57101691A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17708580A JPS57101691A (en) 1980-12-17 1980-12-17 Partial plating method and apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17708580A JPS57101691A (en) 1980-12-17 1980-12-17 Partial plating method and apparatus

Publications (2)

Publication Number Publication Date
JPS57101691A true JPS57101691A (en) 1982-06-24
JPH0151556B2 JPH0151556B2 (en) 1989-11-06

Family

ID=16024857

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17708580A Granted JPS57101691A (en) 1980-12-17 1980-12-17 Partial plating method and apparatus

Country Status (1)

Country Link
JP (1) JPS57101691A (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5320505U (en) * 1976-07-29 1978-02-21

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5320505U (en) * 1976-07-29 1978-02-21

Also Published As

Publication number Publication date
JPH0151556B2 (en) 1989-11-06

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