JPS57210990A - Plating solution injection type electroplating method - Google Patents
Plating solution injection type electroplating methodInfo
- Publication number
- JPS57210990A JPS57210990A JP9436281A JP9436281A JPS57210990A JP S57210990 A JPS57210990 A JP S57210990A JP 9436281 A JP9436281 A JP 9436281A JP 9436281 A JP9436281 A JP 9436281A JP S57210990 A JPS57210990 A JP S57210990A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- soln
- anode
- plating solution
- injection type
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
PURPOSE: To form a metallic plating layer of a uniform thickness in a short time with high efficiency in the stage of forming said plating layer on the surface of an object to be plated by injecting a plating soln. from an injection pipe as the anode to said object.
CONSTITUTION: An object 4 to be plated is immersed as the cathode in a plating soln. 2 in a plating cell 1 and an anode plate 3 of a plating metal is immersed thereon. An injection pipe 8 is used as the anode like the plate 3, and the soln. 2 pressurized by a pump 5 is injected through many holes or slits at the leading end thereof to the surface of the object 4. The cations of the plating metal in the plating soln. is energized forcibly to the surface of the object 4, whereby the uniform metallic plating layer is formed in a short time. The pipe 8 may be used also as an insoluble anode and the plating soln. may be injected to the object on the outside of the plating bath.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9436281A JPS57210990A (en) | 1981-06-18 | 1981-06-18 | Plating solution injection type electroplating method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9436281A JPS57210990A (en) | 1981-06-18 | 1981-06-18 | Plating solution injection type electroplating method |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS57210990A true JPS57210990A (en) | 1982-12-24 |
Family
ID=14108186
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9436281A Pending JPS57210990A (en) | 1981-06-18 | 1981-06-18 | Plating solution injection type electroplating method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57210990A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102321898A (en) * | 2011-08-22 | 2012-01-18 | 无锡鼎亚电子材料有限公司 | Electrolytic coating is crossed thin solution equipment in the direct insertion led support cup bowl |
CN103290446A (en) * | 2013-06-18 | 2013-09-11 | 长沙岱勒新材料科技有限公司 | Diamond surface electroplating device and electroplating method |
-
1981
- 1981-06-18 JP JP9436281A patent/JPS57210990A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102321898A (en) * | 2011-08-22 | 2012-01-18 | 无锡鼎亚电子材料有限公司 | Electrolytic coating is crossed thin solution equipment in the direct insertion led support cup bowl |
CN102321898B (en) * | 2011-08-22 | 2015-01-14 | 无锡鼎亚电子材料有限公司 | Equipment for solving problem of too small thickness of galvanized coating in in-line type light-emitting diode (LED) support cup |
CN103290446A (en) * | 2013-06-18 | 2013-09-11 | 长沙岱勒新材料科技有限公司 | Diamond surface electroplating device and electroplating method |
CN103290446B (en) * | 2013-06-18 | 2015-08-19 | 长沙岱勒新材料科技股份有限公司 | Diamond surface electroplating device and electro-plating method |
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