JPS57210990A - Plating solution injection type electroplating method - Google Patents

Plating solution injection type electroplating method

Info

Publication number
JPS57210990A
JPS57210990A JP9436281A JP9436281A JPS57210990A JP S57210990 A JPS57210990 A JP S57210990A JP 9436281 A JP9436281 A JP 9436281A JP 9436281 A JP9436281 A JP 9436281A JP S57210990 A JPS57210990 A JP S57210990A
Authority
JP
Japan
Prior art keywords
plating
soln
anode
plating solution
injection type
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9436281A
Other languages
Japanese (ja)
Inventor
Koichi Kaneda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KANEDA RIKA KOGYOSHO KK
Original Assignee
KANEDA RIKA KOGYOSHO KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KANEDA RIKA KOGYOSHO KK filed Critical KANEDA RIKA KOGYOSHO KK
Priority to JP9436281A priority Critical patent/JPS57210990A/en
Publication of JPS57210990A publication Critical patent/JPS57210990A/en
Pending legal-status Critical Current

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  • Electroplating Methods And Accessories (AREA)

Abstract

PURPOSE: To form a metallic plating layer of a uniform thickness in a short time with high efficiency in the stage of forming said plating layer on the surface of an object to be plated by injecting a plating soln. from an injection pipe as the anode to said object.
CONSTITUTION: An object 4 to be plated is immersed as the cathode in a plating soln. 2 in a plating cell 1 and an anode plate 3 of a plating metal is immersed thereon. An injection pipe 8 is used as the anode like the plate 3, and the soln. 2 pressurized by a pump 5 is injected through many holes or slits at the leading end thereof to the surface of the object 4. The cations of the plating metal in the plating soln. is energized forcibly to the surface of the object 4, whereby the uniform metallic plating layer is formed in a short time. The pipe 8 may be used also as an insoluble anode and the plating soln. may be injected to the object on the outside of the plating bath.
COPYRIGHT: (C)1982,JPO&Japio
JP9436281A 1981-06-18 1981-06-18 Plating solution injection type electroplating method Pending JPS57210990A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9436281A JPS57210990A (en) 1981-06-18 1981-06-18 Plating solution injection type electroplating method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9436281A JPS57210990A (en) 1981-06-18 1981-06-18 Plating solution injection type electroplating method

Publications (1)

Publication Number Publication Date
JPS57210990A true JPS57210990A (en) 1982-12-24

Family

ID=14108186

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9436281A Pending JPS57210990A (en) 1981-06-18 1981-06-18 Plating solution injection type electroplating method

Country Status (1)

Country Link
JP (1) JPS57210990A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102321898A (en) * 2011-08-22 2012-01-18 无锡鼎亚电子材料有限公司 Electrolytic coating is crossed thin solution equipment in the direct insertion led support cup bowl
CN103290446A (en) * 2013-06-18 2013-09-11 长沙岱勒新材料科技有限公司 Diamond surface electroplating device and electroplating method

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102321898A (en) * 2011-08-22 2012-01-18 无锡鼎亚电子材料有限公司 Electrolytic coating is crossed thin solution equipment in the direct insertion led support cup bowl
CN102321898B (en) * 2011-08-22 2015-01-14 无锡鼎亚电子材料有限公司 Equipment for solving problem of too small thickness of galvanized coating in in-line type light-emitting diode (LED) support cup
CN103290446A (en) * 2013-06-18 2013-09-11 长沙岱勒新材料科技有限公司 Diamond surface electroplating device and electroplating method
CN103290446B (en) * 2013-06-18 2015-08-19 长沙岱勒新材料科技股份有限公司 Diamond surface electroplating device and electro-plating method

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