JPS569095A - Low melting point hard solder material - Google Patents
Low melting point hard solder materialInfo
- Publication number
- JPS569095A JPS569095A JP8497179A JP8497179A JPS569095A JP S569095 A JPS569095 A JP S569095A JP 8497179 A JP8497179 A JP 8497179A JP 8497179 A JP8497179 A JP 8497179A JP S569095 A JPS569095 A JP S569095A
- Authority
- JP
- Japan
- Prior art keywords
- melting point
- low melting
- solder material
- copper
- hard solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/302—Cu as the principal constituent
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8497179A JPS569095A (en) | 1979-07-06 | 1979-07-06 | Low melting point hard solder material |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8497179A JPS569095A (en) | 1979-07-06 | 1979-07-06 | Low melting point hard solder material |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS569095A true JPS569095A (en) | 1981-01-29 |
Family
ID=13845505
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8497179A Pending JPS569095A (en) | 1979-07-06 | 1979-07-06 | Low melting point hard solder material |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS569095A (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58148094A (ja) * | 1982-02-25 | 1983-09-03 | Tanaka Kikinzoku Kogyo Kk | ろう材 |
US4471028A (en) * | 1981-05-14 | 1984-09-11 | Pioneer Electronic Corporation | Honeycomb core diaphragm |
JPH01274371A (ja) * | 1988-04-25 | 1989-11-02 | Hitachi Ltd | 絶縁皮膜電線と瑞子の接合方法 |
CN1044212C (zh) * | 1995-12-12 | 1999-07-21 | 福田金属箔粉工业株式会社 | Sn基低熔点焊料 |
-
1979
- 1979-07-06 JP JP8497179A patent/JPS569095A/ja active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4471028A (en) * | 1981-05-14 | 1984-09-11 | Pioneer Electronic Corporation | Honeycomb core diaphragm |
JPS58148094A (ja) * | 1982-02-25 | 1983-09-03 | Tanaka Kikinzoku Kogyo Kk | ろう材 |
JPH0126798B2 (ja) * | 1982-02-25 | 1989-05-25 | Tanaka Precious Metal Ind | |
JPH01274371A (ja) * | 1988-04-25 | 1989-11-02 | Hitachi Ltd | 絶縁皮膜電線と瑞子の接合方法 |
CN1044212C (zh) * | 1995-12-12 | 1999-07-21 | 福田金属箔粉工业株式会社 | Sn基低熔点焊料 |
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