JPS5684717A - Epoxy resin molding material - Google Patents
Epoxy resin molding materialInfo
- Publication number
- JPS5684717A JPS5684717A JP16145179A JP16145179A JPS5684717A JP S5684717 A JPS5684717 A JP S5684717A JP 16145179 A JP16145179 A JP 16145179A JP 16145179 A JP16145179 A JP 16145179A JP S5684717 A JPS5684717 A JP S5684717A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- wax
- molding material
- esterified
- esterified wax
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003822 epoxy resin Substances 0.000 title abstract 4
- 229920000647 polyepoxide Polymers 0.000 title abstract 4
- 239000012778 molding material Substances 0.000 title abstract 3
- 239000003795 chemical substances by application Substances 0.000 abstract 3
- -1 tetraphenylphosphonium tetraphenylborate Chemical compound 0.000 abstract 3
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 abstract 2
- 239000005011 phenolic resin Substances 0.000 abstract 2
- 239000004215 Carbon black (E152) Substances 0.000 abstract 1
- 229930195733 hydrocarbon Natural products 0.000 abstract 1
- 150000002430 hydrocarbons Chemical class 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 238000000465 moulding Methods 0.000 abstract 1
- 229920003986 novolac Polymers 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 abstract 1
- 230000002195 synergetic effect Effects 0.000 abstract 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16145179A JPS5684717A (en) | 1979-12-14 | 1979-12-14 | Epoxy resin molding material |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16145179A JPS5684717A (en) | 1979-12-14 | 1979-12-14 | Epoxy resin molding material |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5684717A true JPS5684717A (en) | 1981-07-10 |
JPS6136771B2 JPS6136771B2 (enrdf_load_stackoverflow) | 1986-08-20 |
Family
ID=15735347
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16145179A Granted JPS5684717A (en) | 1979-12-14 | 1979-12-14 | Epoxy resin molding material |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5684717A (enrdf_load_stackoverflow) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5967660A (ja) * | 1982-10-12 | 1984-04-17 | Toshiba Corp | 封止用エポキシ樹脂組成物及びこれを用いた樹脂封止型半導体装置 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6360775U (enrdf_load_stackoverflow) * | 1986-10-09 | 1988-04-22 |
-
1979
- 1979-12-14 JP JP16145179A patent/JPS5684717A/ja active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5967660A (ja) * | 1982-10-12 | 1984-04-17 | Toshiba Corp | 封止用エポキシ樹脂組成物及びこれを用いた樹脂封止型半導体装置 |
Also Published As
Publication number | Publication date |
---|---|
JPS6136771B2 (enrdf_load_stackoverflow) | 1986-08-20 |
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