JPS5676556A - Bonding gold wire for semiconductor element - Google Patents

Bonding gold wire for semiconductor element

Info

Publication number
JPS5676556A
JPS5676556A JP15399579A JP15399579A JPS5676556A JP S5676556 A JPS5676556 A JP S5676556A JP 15399579 A JP15399579 A JP 15399579A JP 15399579 A JP15399579 A JP 15399579A JP S5676556 A JPS5676556 A JP S5676556A
Authority
JP
Japan
Prior art keywords
element group
gold wire
semiconductor element
bonding gold
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15399579A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6322062B2 (en:Method
Inventor
Shozo Hayashi
Susumu Tomiyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tanaka Denshi Kogyo KK
Original Assignee
Tanaka Denshi Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tanaka Denshi Kogyo KK filed Critical Tanaka Denshi Kogyo KK
Priority to JP15399579A priority Critical patent/JPS5676556A/ja
Priority to US06/160,302 priority patent/US4330329A/en
Priority to DE3023623A priority patent/DE3023623C2/de
Priority to GB8021205A priority patent/GB2063913B/en
Publication of JPS5676556A publication Critical patent/JPS5676556A/ja
Publication of JPS6322062B2 publication Critical patent/JPS6322062B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
    • C22C5/02—Alloys based on gold
    • H10W72/50—
    • H10W72/5522—
    • H10W72/555—

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Wire Bonding (AREA)
JP15399579A 1979-11-28 1979-11-28 Bonding gold wire for semiconductor element Granted JPS5676556A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP15399579A JPS5676556A (en) 1979-11-28 1979-11-28 Bonding gold wire for semiconductor element
US06/160,302 US4330329A (en) 1979-11-28 1980-06-17 Gold bonding wire for semiconductor elements and the semiconductor element
DE3023623A DE3023623C2 (de) 1979-11-28 1980-06-24 Gold-Verbindungsdraht für Halbleiterelemente und dessen Verwendung für Verbindungsstellen einer Silicium-Chip-Elektrode in Halbleiterelementen
GB8021205A GB2063913B (en) 1979-11-28 1980-06-27 Gold wire

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15399579A JPS5676556A (en) 1979-11-28 1979-11-28 Bonding gold wire for semiconductor element

Publications (2)

Publication Number Publication Date
JPS5676556A true JPS5676556A (en) 1981-06-24
JPS6322062B2 JPS6322062B2 (en:Method) 1988-05-10

Family

ID=15574607

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15399579A Granted JPS5676556A (en) 1979-11-28 1979-11-28 Bonding gold wire for semiconductor element

Country Status (1)

Country Link
JP (1) JPS5676556A (en:Method)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1989011161A1 (fr) * 1988-05-02 1989-11-16 Nippon Steel Corporation Fil de connexion pour elements semi-conducteurs
US5008997A (en) * 1988-09-16 1991-04-23 National Semiconductor Gold/tin eutectic bonding for tape automated bonding process
JPH06293281A (ja) * 1993-04-06 1994-10-21 Ohtsu Tire & Rubber Co Ltd :The クローラ形走行装置
US5491034A (en) * 1988-05-02 1996-02-13 Nippon Steel Corporation Bonding wire for semiconductor element

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5251867A (en) * 1975-10-23 1977-04-26 Nec Corp Bonding wire for semiconductor device
JPS5282183A (en) * 1975-12-29 1977-07-09 Nec Corp Connecting wires for semiconductor devices
JPS53112060A (en) * 1977-03-11 1978-09-30 Tanaka Electronics Ind Gold wire for bonding semiconductor

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5251867A (en) * 1975-10-23 1977-04-26 Nec Corp Bonding wire for semiconductor device
JPS5282183A (en) * 1975-12-29 1977-07-09 Nec Corp Connecting wires for semiconductor devices
JPS53112060A (en) * 1977-03-11 1978-09-30 Tanaka Electronics Ind Gold wire for bonding semiconductor

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1989011161A1 (fr) * 1988-05-02 1989-11-16 Nippon Steel Corporation Fil de connexion pour elements semi-conducteurs
JPH02119148A (ja) * 1988-05-02 1990-05-07 Nippon Steel Corp 半導体素子用ボンディングワイヤ
US5491034A (en) * 1988-05-02 1996-02-13 Nippon Steel Corporation Bonding wire for semiconductor element
US5008997A (en) * 1988-09-16 1991-04-23 National Semiconductor Gold/tin eutectic bonding for tape automated bonding process
JPH06293281A (ja) * 1993-04-06 1994-10-21 Ohtsu Tire & Rubber Co Ltd :The クローラ形走行装置

Also Published As

Publication number Publication date
JPS6322062B2 (en:Method) 1988-05-10

Similar Documents

Publication Publication Date Title
ES8705927A1 (es) Un procedimiento de formacion de un material de almacenamiento reversible de hidrogeno.
ES441949A1 (es) Procedimiento de fabricacion de dispositivos electromagneticos.
EP0110418A3 (en) Ductile brazing alloys containing reactive metals
Oikawa Lattice diffusion of substitutional elements in iron and iron-base solid solutions. A critical review
JPS5655535A (en) Metal bond-diamond sintered body
JPS5676556A (en) Bonding gold wire for semiconductor element
JPS5797891A (en) Cu-ag alloy brazing material
JPS5251867A (en) Bonding wire for semiconductor device
JPS6462296A (en) Gold brazing alloy
JPS5621354A (en) Bonding wire for semiconductor element
JPS6487734A (en) Material for gold extra fine wire
FR2298609A1 (fr) Alliage pour la metallisation et le brasage des materiaux abrasifs
JPS5695492A (en) Copper-group brazing alloy
ES8501276A1 (es) Procedimiento para soldar directamente productos semiacabados a base de materiales de contacto sobre soportes de contactos electricos.
GB799005A (en) A method of uniting materials by means of hard solders
JPS5516731A (en) Watch dial plate
JPS56169341A (en) Bonding wire for semiconductor element
JPS5619629A (en) Bonding wire for semiconductor element
CA2068635A1 (en) Solid bodies made of high-temperature superconducting ceramic material to which contact is made by metallic conductors, and processes for producing them
JPS54103764A (en) Brazing material
JPS563653A (en) Manufacture of seal bonding material
JPS56122140A (en) Gold wire for bonding semiconductor element and semiconductor element
JPS5688328A (en) Gold wire for bonding semiconductor element and semiconductor element
GB967038A (en) Brazing alloy and devices produced therewith
JPS5768040A (en) Electrode structure for semiconductor device