JPS5669365A - Electroless plating reaction measuring apparatus - Google Patents
Electroless plating reaction measuring apparatusInfo
- Publication number
- JPS5669365A JPS5669365A JP14385879A JP14385879A JPS5669365A JP S5669365 A JPS5669365 A JP S5669365A JP 14385879 A JP14385879 A JP 14385879A JP 14385879 A JP14385879 A JP 14385879A JP S5669365 A JPS5669365 A JP S5669365A
- Authority
- JP
- Japan
- Prior art keywords
- electroless plating
- electrode
- plating reaction
- time
- change
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Chemically Coating (AREA)
Abstract
PURPOSE: To rapidly detect the amount and thickness of a film deposited by instantaneously applying a predetermined amount of charges to a working electrode which is a substance to be treated and measuring and analyzing a time change of polarization due to the application to measure electroless plating reaction.
CONSTITUTION: A predetermined amount of charges accumulated in capacitor 15 is instantaneously applied to working electrode 2 dipped in an electroless plating bath with charge applying mechanism 16, and a potential change of electrode 2 is obtd. as the relation of polarization value η-time t with potential difference recording mechanism 25 using reference electrode 3 of electroless plating reaction measuring probe 14 as a standard electrode. On the basis of this relation reaction resistance RELF, Tafel gradient βa, βc and depositing current iELF of electroless plating reaction are obtd. with analyzing mechanism 26, and a change of current iELF with the passage of time is integrated with integrating mechanism 27. Thus, the amount and thickness of a film deposited by electroless plating are detected.
COPYRIGHT: (C)1981,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14385879A JPS5926663B2 (en) | 1979-11-08 | 1979-11-08 | Electroless plating reaction measuring device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14385879A JPS5926663B2 (en) | 1979-11-08 | 1979-11-08 | Electroless plating reaction measuring device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5669365A true JPS5669365A (en) | 1981-06-10 |
JPS5926663B2 JPS5926663B2 (en) | 1984-06-29 |
Family
ID=15348600
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14385879A Expired JPS5926663B2 (en) | 1979-11-08 | 1979-11-08 | Electroless plating reaction measuring device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5926663B2 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58104167A (en) * | 1981-12-14 | 1983-06-21 | Oki Electric Ind Co Ltd | Continuous measuring method for thickness of electroless plating |
JPS58136761A (en) * | 1982-02-10 | 1983-08-13 | Chiyuushiyou Kigyo Shinko Jigyodan | Controlling method of electroless plating liquid |
JPS58141373A (en) * | 1982-02-10 | 1983-08-22 | Chiyuushiyou Kigyo Shinko Jigyodan | Method of measuring rate of deposition of electroless plating solution |
US5270659A (en) * | 1990-10-17 | 1993-12-14 | Hitachi Chemical Company, Ltd. | Apparatus for measuring deposition speed of electroless plating |
-
1979
- 1979-11-08 JP JP14385879A patent/JPS5926663B2/en not_active Expired
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58104167A (en) * | 1981-12-14 | 1983-06-21 | Oki Electric Ind Co Ltd | Continuous measuring method for thickness of electroless plating |
JPS58136761A (en) * | 1982-02-10 | 1983-08-13 | Chiyuushiyou Kigyo Shinko Jigyodan | Controlling method of electroless plating liquid |
JPS58141373A (en) * | 1982-02-10 | 1983-08-22 | Chiyuushiyou Kigyo Shinko Jigyodan | Method of measuring rate of deposition of electroless plating solution |
US5270659A (en) * | 1990-10-17 | 1993-12-14 | Hitachi Chemical Company, Ltd. | Apparatus for measuring deposition speed of electroless plating |
Also Published As
Publication number | Publication date |
---|---|
JPS5926663B2 (en) | 1984-06-29 |
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