JPS5669365A - Electroless plating reaction measuring apparatus - Google Patents

Electroless plating reaction measuring apparatus

Info

Publication number
JPS5669365A
JPS5669365A JP14385879A JP14385879A JPS5669365A JP S5669365 A JPS5669365 A JP S5669365A JP 14385879 A JP14385879 A JP 14385879A JP 14385879 A JP14385879 A JP 14385879A JP S5669365 A JPS5669365 A JP S5669365A
Authority
JP
Japan
Prior art keywords
electroless plating
electrode
plating reaction
time
change
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14385879A
Other languages
Japanese (ja)
Other versions
JPS5926663B2 (en
Inventor
Kenichi Sugano
Masayuki Suzuki
Yuichi Sato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP14385879A priority Critical patent/JPS5926663B2/en
Publication of JPS5669365A publication Critical patent/JPS5669365A/en
Publication of JPS5926663B2 publication Critical patent/JPS5926663B2/en
Expired legal-status Critical Current

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Abstract

PURPOSE: To rapidly detect the amount and thickness of a film deposited by instantaneously applying a predetermined amount of charges to a working electrode which is a substance to be treated and measuring and analyzing a time change of polarization due to the application to measure electroless plating reaction.
CONSTITUTION: A predetermined amount of charges accumulated in capacitor 15 is instantaneously applied to working electrode 2 dipped in an electroless plating bath with charge applying mechanism 16, and a potential change of electrode 2 is obtd. as the relation of polarization value η-time t with potential difference recording mechanism 25 using reference electrode 3 of electroless plating reaction measuring probe 14 as a standard electrode. On the basis of this relation reaction resistance RELF, Tafel gradient βa, βc and depositing current iELF of electroless plating reaction are obtd. with analyzing mechanism 26, and a change of current iELF with the passage of time is integrated with integrating mechanism 27. Thus, the amount and thickness of a film deposited by electroless plating are detected.
COPYRIGHT: (C)1981,JPO&Japio
JP14385879A 1979-11-08 1979-11-08 Electroless plating reaction measuring device Expired JPS5926663B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14385879A JPS5926663B2 (en) 1979-11-08 1979-11-08 Electroless plating reaction measuring device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14385879A JPS5926663B2 (en) 1979-11-08 1979-11-08 Electroless plating reaction measuring device

Publications (2)

Publication Number Publication Date
JPS5669365A true JPS5669365A (en) 1981-06-10
JPS5926663B2 JPS5926663B2 (en) 1984-06-29

Family

ID=15348600

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14385879A Expired JPS5926663B2 (en) 1979-11-08 1979-11-08 Electroless plating reaction measuring device

Country Status (1)

Country Link
JP (1) JPS5926663B2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58104167A (en) * 1981-12-14 1983-06-21 Oki Electric Ind Co Ltd Continuous measuring method for thickness of electroless plating
JPS58136761A (en) * 1982-02-10 1983-08-13 Chiyuushiyou Kigyo Shinko Jigyodan Controlling method of electroless plating liquid
JPS58141373A (en) * 1982-02-10 1983-08-22 Chiyuushiyou Kigyo Shinko Jigyodan Method of measuring rate of deposition of electroless plating solution
US5270659A (en) * 1990-10-17 1993-12-14 Hitachi Chemical Company, Ltd. Apparatus for measuring deposition speed of electroless plating

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58104167A (en) * 1981-12-14 1983-06-21 Oki Electric Ind Co Ltd Continuous measuring method for thickness of electroless plating
JPS58136761A (en) * 1982-02-10 1983-08-13 Chiyuushiyou Kigyo Shinko Jigyodan Controlling method of electroless plating liquid
JPS58141373A (en) * 1982-02-10 1983-08-22 Chiyuushiyou Kigyo Shinko Jigyodan Method of measuring rate of deposition of electroless plating solution
US5270659A (en) * 1990-10-17 1993-12-14 Hitachi Chemical Company, Ltd. Apparatus for measuring deposition speed of electroless plating

Also Published As

Publication number Publication date
JPS5926663B2 (en) 1984-06-29

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