JPS566451A - Deviding method of semiconductor device - Google Patents

Deviding method of semiconductor device

Info

Publication number
JPS566451A
JPS566451A JP8231079A JP8231079A JPS566451A JP S566451 A JPS566451 A JP S566451A JP 8231079 A JP8231079 A JP 8231079A JP 8231079 A JP8231079 A JP 8231079A JP S566451 A JPS566451 A JP S566451A
Authority
JP
Japan
Prior art keywords
scratch
semiconductor device
groove
diamond
monocrystal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8231079A
Other languages
English (en)
Inventor
Ideo Maeyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP8231079A priority Critical patent/JPS566451A/ja
Publication of JPS566451A publication Critical patent/JPS566451A/ja
Pending legal-status Critical Current

Links

Classifications

    • H10P54/00—
    • H10P72/7432—

Landscapes

  • Dicing (AREA)
JP8231079A 1979-06-27 1979-06-27 Deviding method of semiconductor device Pending JPS566451A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8231079A JPS566451A (en) 1979-06-27 1979-06-27 Deviding method of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8231079A JPS566451A (en) 1979-06-27 1979-06-27 Deviding method of semiconductor device

Publications (1)

Publication Number Publication Date
JPS566451A true JPS566451A (en) 1981-01-23

Family

ID=13770979

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8231079A Pending JPS566451A (en) 1979-06-27 1979-06-27 Deviding method of semiconductor device

Country Status (1)

Country Link
JP (1) JPS566451A (ja)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5919713A (en) * 1994-01-28 1999-07-06 Fujitsu Limited Semiconductor device and method of making
US6580054B1 (en) 2002-06-10 2003-06-17 New Wave Research Scribing sapphire substrates with a solid state UV laser
US6805808B2 (en) 2000-09-14 2004-10-19 Sumitomo Electric Industries, Ltd. Method for separating chips from diamond wafer
US6806544B2 (en) 2002-11-05 2004-10-19 New Wave Research Method and apparatus for cutting devices from conductive substrates secured during cutting by vacuum pressure
JP2005086160A (ja) * 2003-09-11 2005-03-31 Disco Abrasive Syst Ltd ウエーハの加工方法
US6960813B2 (en) 2002-06-10 2005-11-01 New Wave Research Method and apparatus for cutting devices from substrates
US7388172B2 (en) 2003-02-19 2008-06-17 J.P. Sercel Associates, Inc. System and method for cutting using a variable astigmatic focal beam spot
CN104871378A (zh) * 2012-12-18 2015-08-26 奥斯兰姆奥普托半导体有限责任公司 用于制造半导体激光器元件的方法和半导体激光器元件

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6455945B1 (en) 1994-01-28 2002-09-24 Fujitsu, Limited Semiconductor device having a fragment of a connection part provided on at least one lateral edge for mechanically connecting to adjacent semiconductor chips
US5919713A (en) * 1994-01-28 1999-07-06 Fujitsu Limited Semiconductor device and method of making
US6805808B2 (en) 2000-09-14 2004-10-19 Sumitomo Electric Industries, Ltd. Method for separating chips from diamond wafer
US7112518B2 (en) 2002-06-10 2006-09-26 New Wave Research Method and apparatus for cutting devices from substrates
US6580054B1 (en) 2002-06-10 2003-06-17 New Wave Research Scribing sapphire substrates with a solid state UV laser
US8822882B2 (en) 2002-06-10 2014-09-02 New Wave Research Scribing sapphire substrates with a solid state UV laser with edge detection
US7169688B2 (en) 2002-06-10 2007-01-30 New Wave Research, Inc. Method and apparatus for cutting devices from substrates
US6960739B2 (en) 2002-06-10 2005-11-01 New Wave Research Scribing sapphire substrates with a solid state UV laser
US6960813B2 (en) 2002-06-10 2005-11-01 New Wave Research Method and apparatus for cutting devices from substrates
US7052976B2 (en) 2002-11-05 2006-05-30 New Wave Research Method and apparatus for cutting devices from conductive substrates secured during cutting by vacuum pressure
US6806544B2 (en) 2002-11-05 2004-10-19 New Wave Research Method and apparatus for cutting devices from conductive substrates secured during cutting by vacuum pressure
US7388172B2 (en) 2003-02-19 2008-06-17 J.P. Sercel Associates, Inc. System and method for cutting using a variable astigmatic focal beam spot
US7709768B2 (en) 2003-02-19 2010-05-04 Jp Sercel Associates Inc. System and method for cutting using a variable astigmatic focal beam spot
US8502112B2 (en) 2003-02-19 2013-08-06 Ipg Microsystems Llc System and method for cutting using a variable astigmatic focal beam spot
JP2005086160A (ja) * 2003-09-11 2005-03-31 Disco Abrasive Syst Ltd ウエーハの加工方法
CN104871378A (zh) * 2012-12-18 2015-08-26 奥斯兰姆奥普托半导体有限责任公司 用于制造半导体激光器元件的方法和半导体激光器元件
US9608401B2 (en) 2012-12-18 2017-03-28 Osram Opto Semiconductors Gmbh Method for producing semiconductor laser elements and semi-conductor laser element

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