JPS56144531A - Manufacture of semiconductor device - Google Patents
Manufacture of semiconductor deviceInfo
- Publication number
- JPS56144531A JPS56144531A JP4734680A JP4734680A JPS56144531A JP S56144531 A JPS56144531 A JP S56144531A JP 4734680 A JP4734680 A JP 4734680A JP 4734680 A JP4734680 A JP 4734680A JP S56144531 A JPS56144531 A JP S56144531A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- scribed lines
- insulating film
- semiconductor device
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02524—Group 14 semiconducting materials
- H01L21/02532—Silicon, silicon germanium, germanium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/02373—Group 14 semiconducting materials
- H01L21/02381—Silicon, silicon germanium, germanium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02439—Materials
- H01L21/02488—Insulating materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02656—Special treatments
- H01L21/02664—Aftertreatments
- H01L21/02667—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth
- H01L21/02675—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth using laser beams
Abstract
PURPOSE:To facilitate die separation after the completion of a semiconductor device by previously forming grooves along scribed lines on an insulating film formed on a semiconductor substrate. CONSTITUTION:Patterning is applied to an SiO2 insulating film 2 formed on an Si semiconductor substrate 1 and articles existing on scribed lines are removed to form grooves 2A. Next, a poly crystalline Si layer 3 is formed on the substrate 1. Next, the layer 3 is irradiated by a laser beam for annealing and the layer 3 is converted into a monocrystal Si layer 3'. After that, necessary semiconductor elements are formed on the layer 3'. Next, the semiconductor device under completed wafer state is cut along the scribed lines to separate the device into each chip. In this case, no insulating film 2 exists on the scribed lines. Therefore, cutting is extremely easy.
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4734680A JPS56144531A (en) | 1980-04-10 | 1980-04-10 | Manufacture of semiconductor device |
US06/240,130 US4381201A (en) | 1980-03-11 | 1981-03-03 | Method for production of semiconductor devices |
EP81101579A EP0036137B1 (en) | 1980-03-11 | 1981-03-05 | Method for production of semiconductor devices |
DE8181101579T DE3168424D1 (en) | 1980-03-11 | 1981-03-05 | Method for production of semiconductor devices |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4734680A JPS56144531A (en) | 1980-04-10 | 1980-04-10 | Manufacture of semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS56144531A true JPS56144531A (en) | 1981-11-10 |
Family
ID=12772589
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4734680A Pending JPS56144531A (en) | 1980-03-11 | 1980-04-10 | Manufacture of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56144531A (en) |
-
1980
- 1980-04-10 JP JP4734680A patent/JPS56144531A/en active Pending
Non-Patent Citations (1)
Title |
---|
JAPANESE JOURNAL OF APPLIED PHYSICS=1980 * |
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