JPS5656020A - Manufacture of elastic surface wave device - Google Patents

Manufacture of elastic surface wave device

Info

Publication number
JPS5656020A
JPS5656020A JP13180379A JP13180379A JPS5656020A JP S5656020 A JPS5656020 A JP S5656020A JP 13180379 A JP13180379 A JP 13180379A JP 13180379 A JP13180379 A JP 13180379A JP S5656020 A JPS5656020 A JP S5656020A
Authority
JP
Japan
Prior art keywords
wafer
main surface
camber
yield
input
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13180379A
Other languages
Japanese (ja)
Inventor
Tadao Komi
Katsuji Kawaguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP13180379A priority Critical patent/JPS5656020A/en
Publication of JPS5656020A publication Critical patent/JPS5656020A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)

Abstract

PURPOSE:To improve characteristics and yield by reducing bad conditions such as camber as much as possible by roughening the 2nd main surface of a wafer and then by etching the wafer before mirror-finishing the 1st main surface where input and output electrodes are to be formed. CONSTITUTION:An LiTaO3 signle crystal is cut into a prescribed wafer. Of this wafer, the 2nd main surface 5 opposing to the 1st main surface 2 where input and output electrodes are to be formed is roughened by manual sliding and honing work. Next, a solution having a 1:2 ratio of HF to HNO3 is used to etch the wafer at the room temperature for 15 minutes and after curvature is removed, electrodes are formed on this wafer to improve the yield while maintaining prescribed excellent characteristics. Namely, provess etching provides better results with regard to removal of camber and prevention of cracking in handling.
JP13180379A 1979-10-15 1979-10-15 Manufacture of elastic surface wave device Pending JPS5656020A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13180379A JPS5656020A (en) 1979-10-15 1979-10-15 Manufacture of elastic surface wave device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13180379A JPS5656020A (en) 1979-10-15 1979-10-15 Manufacture of elastic surface wave device

Publications (1)

Publication Number Publication Date
JPS5656020A true JPS5656020A (en) 1981-05-16

Family

ID=15066468

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13180379A Pending JPS5656020A (en) 1979-10-15 1979-10-15 Manufacture of elastic surface wave device

Country Status (1)

Country Link
JP (1) JPS5656020A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003017983A (en) * 2001-06-28 2003-01-17 Kyocera Corp Wafer for elastic wave and elastic wave device employing the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003017983A (en) * 2001-06-28 2003-01-17 Kyocera Corp Wafer for elastic wave and elastic wave device employing the same

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