JPS5648132A - Method and device for thermally conducting vacuum coated article to be treated - Google Patents
Method and device for thermally conducting vacuum coated article to be treatedInfo
- Publication number
- JPS5648132A JPS5648132A JP12735680A JP12735680A JPS5648132A JP S5648132 A JPS5648132 A JP S5648132A JP 12735680 A JP12735680 A JP 12735680A JP 12735680 A JP12735680 A JP 12735680A JP S5648132 A JPS5648132 A JP S5648132A
- Authority
- JP
- Japan
- Prior art keywords
- treated
- coated article
- thermally conducting
- vacuum coated
- conducting vacuum
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/265—Bombardment with radiation with high-energy radiation producing ion implantation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
- C23C14/541—Heating or cooling of the substrates
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B23/00—Single-crystal growth by condensing evaporated or sublimed materials
- C30B23/02—Epitaxial-layer growth
- C30B23/06—Heating of the deposition chamber, the substrate or the materials to be evaporated
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B31/00—Diffusion or doping processes for single crystals or homogeneous polycrystalline material with defined structure; Apparatus therefor
- C30B31/20—Doping by irradiation with electromagnetic waves or by particle radiation
- C30B31/22—Doping by irradiation with electromagnetic waves or by particle radiation by ion-implantation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/002—Cooling arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/20—Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
- H01J2237/2001—Maintaining constant desired temperature
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Materials Engineering (AREA)
- High Energy & Nuclear Physics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- General Physics & Mathematics (AREA)
- Toxicology (AREA)
- Electromagnetism (AREA)
- Health & Medical Sciences (AREA)
- Physical Vapour Deposition (AREA)
- Drying Of Semiconductors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/075,401 US4261762A (en) | 1979-09-14 | 1979-09-14 | Method for conducting heat to or from an article being treated under vacuum |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5648132A true JPS5648132A (en) | 1981-05-01 |
JPH0227778B2 JPH0227778B2 (ja) | 1990-06-19 |
Family
ID=22125486
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12735680A Granted JPS5648132A (en) | 1979-09-14 | 1980-09-16 | Method and device for thermally conducting vacuum coated article to be treated |
Country Status (5)
Country | Link |
---|---|
US (1) | US4261762A (ja) |
EP (1) | EP0025670B2 (ja) |
JP (1) | JPS5648132A (ja) |
CA (1) | CA1159161A (ja) |
DE (1) | DE3066291D1 (ja) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62171637A (ja) * | 1986-01-22 | 1987-07-28 | ノルデイシエル・マシ−ネンバウ・ルド・バアデル・ゲ−エムベ−ハ−・ウント・コンパニ・カ−ゲ− | 魚から切身を作る切身とり作業において魚から皮のない腹身を得る方法および装置 |
JPH02197123A (ja) * | 1988-09-22 | 1990-08-03 | Fsi Internatl Inc | ウエハの表側と裏側との同時のエッチングを制御する方法と装置 |
JPH03177572A (ja) * | 1979-12-21 | 1991-08-01 | Varian Assoc Inc | ウェーハを熱処理する装置 |
JPH07273176A (ja) * | 1995-03-10 | 1995-10-20 | Hitachi Ltd | 真空処理装置の試料保持方法 |
JP2022531137A (ja) * | 2019-05-01 | 2022-07-06 | アクセリス テクノロジーズ, インコーポレイテッド | 高出力ウェハー冷却 |
Families Citing this family (102)
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---|---|---|---|---|
EP0017472A1 (en) * | 1979-04-06 | 1980-10-15 | Lintott Engineering Limited | Evacuable equipment containing a device for heat transfer and process for the manufacture of semi-conductor components using this equipment |
US4909314A (en) * | 1979-12-21 | 1990-03-20 | Varian Associates, Inc. | Apparatus for thermal treatment of a wafer in an evacuated environment |
US5024747A (en) * | 1979-12-21 | 1991-06-18 | Varian Associates, Inc. | Wafer coating system |
US4385937A (en) * | 1980-05-20 | 1983-05-31 | Tokyo Shibaura Denki Kabushiki Kaisha | Regrowing selectively formed ion amorphosized regions by thermal gradient |
EP0046154B1 (en) * | 1980-08-08 | 1984-11-28 | Battelle Development Corporation | Apparatus for coating substrates by high-rate cathodic sputtering, as well as sputtering cathode for such apparatus |
DE3118785A1 (de) * | 1981-05-12 | 1982-12-02 | Siemens AG, 1000 Berlin und 8000 München | Verfahren und vorrichtung zum dotieren von halbleitermaterial |
US4433247A (en) * | 1981-09-28 | 1984-02-21 | Varian Associates, Inc. | Beam sharing method and apparatus for ion implantation |
US4392938A (en) * | 1981-11-12 | 1983-07-12 | Varian Associates, Inc. | Radio frequency etch table with biased extension member |
US4512391A (en) * | 1982-01-29 | 1985-04-23 | Varian Associates, Inc. | Apparatus for thermal treatment of semiconductor wafers by gas conduction incorporating peripheral gas inlet |
US4634331A (en) * | 1982-05-24 | 1987-01-06 | Varian Associates, Inc. | Wafer transfer system |
US4457359A (en) * | 1982-05-25 | 1984-07-03 | Varian Associates, Inc. | Apparatus for gas-assisted, solid-to-solid thermal transfer with a semiconductor wafer |
US4508161A (en) * | 1982-05-25 | 1985-04-02 | Varian Associates, Inc. | Method for gas-assisted, solid-to-solid thermal transfer with a semiconductor wafer |
EP0100206A1 (en) * | 1982-07-22 | 1984-02-08 | Oerlikon-Buhrle U.S.A. Inc. | Apparatus for treating an article in a vacuum chamber |
GB8306764D0 (en) * | 1983-03-11 | 1983-04-20 | Johnson Matthey Plc | Calibration warning apparatus |
US4609565A (en) * | 1984-10-10 | 1986-09-02 | Mobil Solar Energy Corporation | Method of fabricating solar cells |
EP0167589A4 (en) * | 1983-12-19 | 1989-01-19 | Mobil Solar Energy Corp | METHOD FOR THE PRODUCTION OF SUN CELLS. |
US4603466A (en) * | 1984-02-17 | 1986-08-05 | Gca Corporation | Wafer chuck |
US4535834A (en) * | 1984-05-02 | 1985-08-20 | Varian Associates, Inc. | Method and apparatus for controlling thermal transfer in a cyclic vacuum processing system |
US4527620A (en) * | 1984-05-02 | 1985-07-09 | Varian Associates, Inc. | Apparatus for controlling thermal transfer in a cyclic vacuum processing system |
US4567938A (en) * | 1984-05-02 | 1986-02-04 | Varian Associates, Inc. | Method and apparatus for controlling thermal transfer in a cyclic vacuum processing system |
GB8418063D0 (en) * | 1984-07-16 | 1984-08-22 | Atomic Energy Authority Uk | Temperature control in vacuum |
US4672210A (en) * | 1985-09-03 | 1987-06-09 | Eaton Corporation | Ion implanter target chamber |
US5484011A (en) * | 1986-12-19 | 1996-01-16 | Applied Materials, Inc. | Method of heating and cooling a wafer during semiconductor processing |
US5228501A (en) * | 1986-12-19 | 1993-07-20 | Applied Materials, Inc. | Physical vapor deposition clamping mechanism and heater/cooler |
US5871811A (en) * | 1986-12-19 | 1999-02-16 | Applied Materials, Inc. | Method for protecting against deposition on a selected region of a substrate |
US5215619A (en) * | 1986-12-19 | 1993-06-01 | Applied Materials, Inc. | Magnetic field-enhanced plasma etch reactor |
JPH0713960B2 (ja) * | 1986-12-23 | 1995-02-15 | 日本電気株式会社 | ドライエッチング装置 |
US4817556A (en) * | 1987-05-04 | 1989-04-04 | Varian Associates, Inc. | Apparatus for retaining wafers |
US5040484A (en) * | 1987-05-04 | 1991-08-20 | Varian Associates, Inc. | Apparatus for retaining wafers |
US4949783A (en) * | 1988-05-18 | 1990-08-21 | Veeco Instruments, Inc. | Substrate transport and cooling apparatus and method for same |
DE3914065A1 (de) * | 1989-04-28 | 1990-10-31 | Leybold Ag | Vorrichtung zur durchfuehrung von plasma-aetzverfahren |
US5248370A (en) * | 1989-05-08 | 1993-09-28 | Applied Materials, Inc. | Apparatus for heating and cooling semiconductor wafers in semiconductor wafer processing equipment |
DE69017258T2 (de) * | 1989-05-08 | 1995-08-03 | Applied Materials Inc | Verfahren und Vorrichtung zum Erwärmen und Kühlen von Plättchen in einer Halbleiterplättchenbearbeitungseinrichtung. |
JPH0693441B2 (ja) * | 1989-09-22 | 1994-11-16 | 株式会社東芝 | 半導体集積回路装置の加熱処理方法 |
US5244820A (en) * | 1990-03-09 | 1993-09-14 | Tadashi Kamata | Semiconductor integrated circuit device, method for producing the same, and ion implanter for use in the method |
EP0688042B1 (en) | 1990-04-20 | 1999-03-10 | Applied Materials, Inc. | Wafer processing apparatus |
US5094885A (en) * | 1990-10-12 | 1992-03-10 | Genus, Inc. | Differential pressure cvd chuck |
US5673750A (en) * | 1990-05-19 | 1997-10-07 | Hitachi, Ltd. | Vacuum processing method and apparatus |
KR0165898B1 (ko) * | 1990-07-02 | 1999-02-01 | 미다 가쓰시게 | 진공처리방법 및 장치 |
US5578532A (en) * | 1990-07-16 | 1996-11-26 | Novellus Systems, Inc. | Wafer surface protection in a gas deposition process |
US5133284A (en) * | 1990-07-16 | 1992-07-28 | National Semiconductor Corp. | Gas-based backside protection during substrate processing |
US5238499A (en) * | 1990-07-16 | 1993-08-24 | Novellus Systems, Inc. | Gas-based substrate protection during processing |
US5230741A (en) * | 1990-07-16 | 1993-07-27 | Novellus Systems, Inc. | Gas-based backside protection during substrate processing |
US5843233A (en) * | 1990-07-16 | 1998-12-01 | Novellus Systems, Inc. | Exclusion guard and gas-based substrate protection for chemical vapor deposition apparatus |
US5620525A (en) * | 1990-07-16 | 1997-04-15 | Novellus Systems, Inc. | Apparatus for supporting a substrate and introducing gas flow doximate to an edge of the substrate |
JP2559529B2 (ja) * | 1990-09-21 | 1996-12-04 | 株式会社日立製作所 | 荷電粒子露光装置 |
USH1145H (en) | 1990-09-25 | 1993-03-02 | Sematech, Inc. | Rapid temperature response wafer chuck |
US6165311A (en) * | 1991-06-27 | 2000-12-26 | Applied Materials, Inc. | Inductively coupled RF plasma reactor having an overhead solenoidal antenna |
US6238588B1 (en) | 1991-06-27 | 2001-05-29 | Applied Materials, Inc. | High pressure high non-reactive diluent gas content high plasma ion density plasma oxide etch process |
US6077384A (en) | 1994-08-11 | 2000-06-20 | Applied Materials, Inc. | Plasma reactor having an inductive antenna coupling power through a parallel plate electrode |
US6063233A (en) | 1991-06-27 | 2000-05-16 | Applied Materials, Inc. | Thermal control apparatus for inductively coupled RF plasma reactor having an overhead solenoidal antenna |
US6514376B1 (en) | 1991-06-27 | 2003-02-04 | Applied Materials Inc. | Thermal control apparatus for inductively coupled RF plasma reactor having an overhead solenoidal antenna |
US6024826A (en) * | 1996-05-13 | 2000-02-15 | Applied Materials, Inc. | Plasma reactor with heated source of a polymer-hardening precursor material |
US6488807B1 (en) | 1991-06-27 | 2002-12-03 | Applied Materials, Inc. | Magnetic confinement in a plasma reactor having an RF bias electrode |
US6036877A (en) * | 1991-06-27 | 2000-03-14 | Applied Materials, Inc. | Plasma reactor with heated source of a polymer-hardening precursor material |
US5477975A (en) * | 1993-10-15 | 1995-12-26 | Applied Materials Inc | Plasma etch apparatus with heated scavenging surfaces |
US6090303A (en) * | 1991-06-27 | 2000-07-18 | Applied Materials, Inc. | Process for etching oxides in an electromagnetically coupled planar plasma apparatus |
US6074512A (en) * | 1991-06-27 | 2000-06-13 | Applied Materials, Inc. | Inductively coupled RF plasma reactor having an overhead solenoidal antenna and modular confinement magnet liners |
JPH05166757A (ja) * | 1991-12-13 | 1993-07-02 | Tokyo Electron Ltd | 被処理体の温調装置 |
US5356476A (en) * | 1992-06-15 | 1994-10-18 | Materials Research Corporation | Semiconductor wafer processing method and apparatus with heat and gas flow control |
US5370739A (en) * | 1992-06-15 | 1994-12-06 | Materials Research Corporation | Rotating susceptor semiconductor wafer processing cluster tool module useful for tungsten CVD |
US5436790A (en) * | 1993-01-15 | 1995-07-25 | Eaton Corporation | Wafer sensing and clamping monitor |
US5424097A (en) * | 1993-09-30 | 1995-06-13 | Specialty Coating Systems, Inc. | Continuous vapor deposition apparatus |
US5647911A (en) * | 1993-12-14 | 1997-07-15 | Sony Corporation | Gas diffuser plate assembly and RF electrode |
US5588827A (en) * | 1993-12-17 | 1996-12-31 | Brooks Automation Inc. | Passive gas substrate thermal conditioning apparatus and method |
EP0733130A4 (en) * | 1993-12-17 | 1997-04-02 | Brooks Automation Inc | APPARATUS FOR HEATING OR COOLING TABLETS |
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JP4079992B2 (ja) | 1994-10-17 | 2008-04-23 | バリアン・セミコンダクター・エクイップメント・アソシエイツ・インコーポレイテッド | 導電性被処理体を載置部材に締め付けるための装置及び静電クランピング方法 |
US5605600A (en) * | 1995-03-13 | 1997-02-25 | International Business Machines Corporation | Etch profile shaping through wafer temperature control |
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JPS50109596A (ja) * | 1974-02-06 | 1975-08-28 | ||
JPS50137962U (ja) * | 1974-04-16 | 1975-11-13 | ||
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JPS5488270U (ja) * | 1977-12-05 | 1979-06-22 | ||
JPS54104777A (en) * | 1978-01-30 | 1979-08-17 | Rockwell International Corp | Device for supporting substrata |
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-
1979
- 1979-09-14 US US06/075,401 patent/US4261762A/en not_active Expired - Lifetime
-
1980
- 1980-09-04 DE DE8080303093T patent/DE3066291D1/de not_active Expired
- 1980-09-04 EP EP80303093A patent/EP0025670B2/en not_active Expired
- 1980-09-09 CA CA000359913A patent/CA1159161A/en not_active Expired
- 1980-09-16 JP JP12735680A patent/JPS5648132A/ja active Granted
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS50109596A (ja) * | 1974-02-06 | 1975-08-28 | ||
JPS50137962U (ja) * | 1974-04-16 | 1975-11-13 | ||
JPS53123669A (en) * | 1977-04-05 | 1978-10-28 | Fujitsu Ltd | Wafer holding method |
JPS5488270U (ja) * | 1977-12-05 | 1979-06-22 | ||
JPS54104777A (en) * | 1978-01-30 | 1979-08-17 | Rockwell International Corp | Device for supporting substrata |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03177572A (ja) * | 1979-12-21 | 1991-08-01 | Varian Assoc Inc | ウェーハを熱処理する装置 |
JPH0633457B2 (ja) * | 1979-12-21 | 1994-05-02 | バリアン・アソシエイツ・インコーポレイテッド | ウェーハを熱処理する装置 |
JPS62171637A (ja) * | 1986-01-22 | 1987-07-28 | ノルデイシエル・マシ−ネンバウ・ルド・バアデル・ゲ−エムベ−ハ−・ウント・コンパニ・カ−ゲ− | 魚から切身を作る切身とり作業において魚から皮のない腹身を得る方法および装置 |
JPH0434364B2 (ja) * | 1986-01-22 | 1992-06-05 | Norudeitsusheru Mashiinenbau Ruudorufu Baaderu Gmbh Unto Co Kg | |
JPH02197123A (ja) * | 1988-09-22 | 1990-08-03 | Fsi Internatl Inc | ウエハの表側と裏側との同時のエッチングを制御する方法と装置 |
JPH07273176A (ja) * | 1995-03-10 | 1995-10-20 | Hitachi Ltd | 真空処理装置の試料保持方法 |
JP2022531137A (ja) * | 2019-05-01 | 2022-07-06 | アクセリス テクノロジーズ, インコーポレイテッド | 高出力ウェハー冷却 |
Also Published As
Publication number | Publication date |
---|---|
EP0025670B2 (en) | 1989-04-05 |
US4261762A (en) | 1981-04-14 |
JPH0227778B2 (ja) | 1990-06-19 |
DE3066291D1 (en) | 1984-03-01 |
EP0025670B1 (en) | 1984-01-25 |
EP0025670A1 (en) | 1981-03-25 |
CA1159161A (en) | 1983-12-20 |
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