JPS5645043A - Forming method for electrode lead - Google Patents

Forming method for electrode lead

Info

Publication number
JPS5645043A
JPS5645043A JP12115579A JP12115579A JPS5645043A JP S5645043 A JPS5645043 A JP S5645043A JP 12115579 A JP12115579 A JP 12115579A JP 12115579 A JP12115579 A JP 12115579A JP S5645043 A JPS5645043 A JP S5645043A
Authority
JP
Japan
Prior art keywords
solder
lead
film
projections
plated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12115579A
Other languages
Japanese (ja)
Inventor
Kenzo Hatada
Kosei Kajiwara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP12115579A priority Critical patent/JPS5645043A/en
Publication of JPS5645043A publication Critical patent/JPS5645043A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/79—Apparatus for Tape Automated Bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01024—Chromium [Cr]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To obtain an electrode lead having a higher reliability by providing a barrier metal layer on the electrode terminal of a semiconductor element, and forming a pair of solder layers, between which a lead plated with a metal is pressed on heating. CONSTITUTION:A semiconductor element 31 is coated with a film 32 of Cr-Cu or the like, on which a resist mask is provided to form projections 35 by providing solder plating. Moreover, the Cr-Cu film 32 is etched to leave a film 32' by using the resist mask. The solder projections 35 are arranged in parallel or U-shape so that a Cu lead 5 is readily inserted. The Cu lead 5 plated with Sn 6 is aligned with the concave portion made by the solder projections 35, and pressed on heating. This causes the solder to wet sides 40 of the lead 5. Because there is no solder under the lead 5, no solder flows out of the Cr-Cu film 32'. The constitution permits a treat- ment at a lower temperature than the Au-Sn eutectic connection. Therefore, the production of cracks in the element 31 is prevented, and there is no possibility of a short-circuit resulting from the flow-out of the solder, so that a lead connection having a higher reliability is obtained.
JP12115579A 1979-09-19 1979-09-19 Forming method for electrode lead Pending JPS5645043A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12115579A JPS5645043A (en) 1979-09-19 1979-09-19 Forming method for electrode lead

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12115579A JPS5645043A (en) 1979-09-19 1979-09-19 Forming method for electrode lead

Publications (1)

Publication Number Publication Date
JPS5645043A true JPS5645043A (en) 1981-04-24

Family

ID=14804205

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12115579A Pending JPS5645043A (en) 1979-09-19 1979-09-19 Forming method for electrode lead

Country Status (1)

Country Link
JP (1) JPS5645043A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60122823A (en) * 1983-12-07 1985-07-01 Kaneko Agricult Mach Co Ltd Method for detecting flame on burner and device thereof
JPH04123536U (en) * 1991-04-26 1992-11-09 サンケン電気株式会社 electronic components
JPH04324651A (en) * 1991-04-25 1992-11-13 Nec Corp Manufacture of film carrier tape

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60122823A (en) * 1983-12-07 1985-07-01 Kaneko Agricult Mach Co Ltd Method for detecting flame on burner and device thereof
JPH04324651A (en) * 1991-04-25 1992-11-13 Nec Corp Manufacture of film carrier tape
JPH04123536U (en) * 1991-04-26 1992-11-09 サンケン電気株式会社 electronic components

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