JPH04123536U - electronic components - Google Patents
electronic componentsInfo
- Publication number
- JPH04123536U JPH04123536U JP1991038232U JP3823291U JPH04123536U JP H04123536 U JPH04123536 U JP H04123536U JP 1991038232 U JP1991038232 U JP 1991038232U JP 3823291 U JP3823291 U JP 3823291U JP H04123536 U JPH04123536 U JP H04123536U
- Authority
- JP
- Japan
- Prior art keywords
- external connection
- connection terminal
- lead
- ribbon
- pair
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002184 metal Substances 0.000 claims description 10
- 229910000679 solder Inorganic materials 0.000 abstract description 11
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 16
- 230000000694 effects Effects 0.000 description 3
- 238000005476 soldering Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 238000004512 die casting Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/36—Structure, shape, material or disposition of the strap connectors prior to the connecting process
- H01L2224/37—Structure, shape, material or disposition of the strap connectors prior to the connecting process of an individual strap connector
- H01L2224/3754—Coating
- H01L2224/37599—Material
- H01L2224/376—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/83801—Soldering or alloying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Abstract
(57)【要約】
【目的】電子部品のリボンリードを外部接続端子の正確
な位置に半田付けする。
【構成】外部接続端子（6）と回路基板又は電子素子の
接続電極（10）とをリボンリード（9）を介して電気的
に接続する際に、外部接続端子（6）の両側縁に少なく
とも一対の突出部（13）を形成し、リボンリード（9）
の端部をこれら一対の突出部（13）の間に配置して、外
部接続端子（6）に半田付けする。一対の突出部（13）
の間にリボンリード（9）の端部を固着することによっ
てリボンリード（9）の傾斜状態での固着を防止するこ
とができる。
(57) [Summary] [Purpose] To solder the ribbon leads of electronic components to the exact positions of external connection terminals. [Structure] When electrically connecting the external connection terminal (6) and the connection electrode (10) of the circuit board or electronic element via the ribbon lead (9), at least Forms a pair of protrusions (13) and ribbon leads (9)
is placed between the pair of protrusions (13) and soldered to the external connection terminal (6). A pair of protrusions (13)
By fixing the end of the ribbon lead (9) between the ends, it is possible to prevent the ribbon lead (9) from sticking in an inclined state.
Description
【０００１】0001
本考案は配線リードを外部接続端子の正確な位置に固着できる電子部品に関す る。 This invention relates to electronic components that allow wiring leads to be fixed to the exact position of external connection terminals. Ru.
【０００２】0002
図７は従来のハイブリッドＩＣを示す。図示のように、このハイブリッドＩＣ は樹脂製の外囲体（1）、ダイキャストによって形成された金属底板（2）、金属 底板（2）の内面（3）にラバー（4）を介して固着された回路基板（5）及び板状 金属から成る外部接続端子（6）を備えている。回路基板（5）上に形成された接 続電極（図示せず）と外部接続端子（6）は、接続リード組立体（7）によって電 気的に接続される。接続リード組立板（7）は台座（8）とこれにスポット溶接さ れた帯状金属から成る配線リード（以下、リボンリードと称する）（9）から構 成される。台座（8）にスポット溶接されたリボンリード（9）の一端付近には台 座（8）側に湾曲部（9a）が形成され、湾曲部（9a）よりも台座（8）から離間し たリボンリード（9）の他端は図示のように折曲げ加工されて外部接続端子（6） に半田付けされている。また、台座（8）の下面も回路基板（5）上の接続電極に 半田付けされている。 FIG. 7 shows a conventional hybrid IC. As shown, this hybrid IC is a resin outer shell (1), a metal bottom plate formed by die-casting (2), and a metal A circuit board (5) and a plate shape fixed to the inner surface (3) of the bottom plate (2) via rubber (4) Equipped with an external connection terminal (6) made of metal. The contacts formed on the circuit board (5) The connection electrode (not shown) and the external connection terminal (6) are electrically connected by the connection lead assembly (7). connected emotionally. The connection lead assembly plate (7) is spot welded to the pedestal (8). It is constructed from wiring leads (hereinafter referred to as ribbon leads) (9) made of strip-shaped metal. will be accomplished. A pedestal is placed near one end of the ribbon lead (9) spot welded to the pedestal (8). A curved part (9a) is formed on the seat (8) side, and is further away from the base (8) than the curved part (9a). The other end of the ribbon lead (9) is bent as shown to form an external connection terminal (6). is soldered to. Also, the bottom surface of the pedestal (8) is also connected to the connection electrode on the circuit board (5). It is soldered.
【０００３】0003
ところが、上記の如くに製作されたハイブリッドＩＣでは、リボンリード（9 ）を外部接続端子（6）に半田付けする際の加熱に起因して、台座（8）を回路基 板（5）に固着する半田が軟化する。この為に、図６に点で示す半田によりリボ ンリード（9）が外部接続端子（6）に偏心状態で傾斜して固着されることがある 。傾斜状態での固着は単なる外観不良であるのみならず、接続不良等により製品 の信頼性を低下する要因となる。 本考案は上記問題を鑑みてなされたものであり、リボンリードの傾斜状態での 固着を防止して、リボンリードを外部接続端子の正確な位置に半田付けできる電 子部品を提供することを目的とする。 However, in the hybrid IC manufactured as described above, ribbon leads (9 ) to the external connection terminal (6), the pedestal (8) may be connected to the circuit board. The solder that adheres to the plate (5) will soften. For this purpose, solder shown as dots in Figure 6 is used to mount the rib. The lead (9) may be stuck to the external connection terminal (6) eccentrically and at an angle. . Sticking in an inclined state is not only a visual defect, but also a product failure due to poor connections, etc. This is a factor that reduces the reliability of the system. The present invention was developed in view of the above problems, and is designed to solve the problem when the ribbon lead is tilted. An electric cable that prevents sticking and allows you to solder the ribbon lead to the exact position of the external connection terminal. The purpose is to provide child parts.
【０００４】0004
本考案による電子部品では、帯状金属から成る配線リードを介して板状金属か ら成る外部接続端子と回路基板又は電子素子の接続電極とを電気的に接続し、配 線リードの端部を外部接続端子の両側縁に形成された一対の突出部の間に配置し た状態で外部接続端子に半田付けする。例えば、一対の突出部は外部接続端子の 長手方向に延在している。 In the electronic component according to the present invention, a wire is connected to a sheet metal via a wiring lead made of a strip metal. electrically connect the external connection terminal consisting of the circuit board or the connection electrode of the electronic element, Place the end of the wire lead between the pair of protrusions formed on both sides of the external connection terminal. solder it to the external connection terminal. For example, a pair of protrusions are external connection terminals. Extending in the longitudinal direction.
【０００５】[0005]
本考案によれば、一対の突出部の間に配線リードの端部を固着することによっ て配線リードの傾斜状態での固着を防止することができる。 According to the present invention, by fixing the end of the wiring lead between a pair of protrusions, This can prevent the wiring leads from sticking in an inclined state.
【０００６】[0006]
以下、本考案による電子部品の一実施例に係わるハイブリッドＩＣを図１〜図 ５について説明する。 Below, a hybrid IC according to an embodiment of the electronic component according to the present invention is shown in Figs. 5 will be explained.
【０００７】 本実施例のハイブリッドＩＣは細部を除いて図７のハイブリッドＩＣとほぼ同 じである。即ち、図１に示すハイブリッドＩＣは、放射板を兼ねる金属底板（2 ）と、これにラバー（4）を介して固着された回路基板（5）と、板状金属から成 る外部接続端子（6）とを備えている。外部接続端子（6）はリード組立体（7） を介して回路基板（5）上の接続電極（10）に電気的に接続されている。 リード組立体（7）は、従来例と同様に台座（8）とこれにスポット溶接された リボンリード（9）から構成されている。図１に示すように、リボンリード（9） には湾曲部（9a）と屈曲部（9b）が形成されて、台座部（8）の下面とリボンリ ード（9）の先端側がそれぞれ半田（11)(12）によって回路基板（5）の接続電極 （10）と外部接続端子（6）に固着されている。 図示のようにリード組立体（7）を取付けるときは、まず、図２に示すように 湾曲部（9a）のみを形成したリボンリード（9）と台座（8）とから成るリード組 立体（7）を用意し、台座（8）を回路基板（5）に半田付けする。次に、リボン リード（9）の先端側に折曲げ加工を施して屈曲部（9b）を形成してこれを外部 接続端子（6）に半田付けする。 本実施例と従来のハイブリッドＩＣの相違点は、図３及び図４と図６との対比 から明らかなように、本実施例では、外部接続端子（6）の両側縁に形成した一 対の突出部（13）の間にリボンリード（9）を配置して半田（12）によって外部 接続端子（6）に固着したことである。一対の突出部（13）は外部接続端子（6） の側縁部を部分的に下面から押圧して上面側に偏位させることによって外部接続 端子（6）の（長手方向）に形成されている。突出部（13）の突出高さは外部接 続端子（6）の厚さの１／２程度である。 一対の突出部（13）はリボンリード（9）のガイド部として機能し、上述のよ うにリード組立体（7）のリボンリード（9）を半田付けしたときにリボンリード （9）が外部接続端子（6）に対して斜めに半田で固着されることを防止する。即 ち、図３に示すように一対の突出部（13）の間隔Ｌ1はリボンリード（9）を円滑 に装着できる程度にリボンリード（9）の幅Ｌ2よりも大きいが、間隔Ｌ1と幅Ｌ2 の差は僅かである。この為、リボンリード（9）が横方向に移動しようとする際 に、一対の突出部（13）がストッパとして良好に作用し、リボンリード（9）が 横方向に大きく偏心、傾斜又はずれたりすることが防止される。突出部（13）が リボンリード（9）のストッパとして良好に機能するように一対の突出部（13） の外部接続端子（6）の延在する方向（長手方向）における長さは、リボンリー ド（9）の外部接続端子（6）上に配設された部分の長さの１／３以上、望ましく は１／２以上に設定するのが良い。 また、図３及び図４から明らかなように、一対の突出部（13）はリボンリード （9）よりも上方に突出するので、半田（12）の流れ留め部としても機能する。 このため、リボンリード（9）の上面に十分な厚みをもって半田（12）を塗布で き、リボンリード（9）を外部接続端子（6）に対して強固に固着することができ る。突出部（13）の外部接続端子（6）の一方の主面からの突出高さは、外部接 続端子（6）に配設されたリボンリード（9）の厚さの４／３倍以上、望ましくは ２倍以上とすると、突出部（13）による半田（12）の流れ留め効果が十分に得ら れる。 以上のように、本実施例のハイブリッドＩＣによればリボンリード（9）が外 部接続端子（6）に対して、偏心状態、傾斜状態又はずれた状態で半田付けされ ることがない。このため、リボンリード（9）は十分な半田付け強度で外部接続 端子（6）に固着されるから、接続不良及び外観不良等が生ずることなく信頼性 も向上する。The hybrid IC of this embodiment is almost the same as the hybrid IC of FIG. 7 except for details. That is, the hybrid IC shown in FIG. 1 includes a metal bottom plate (2) that also serves as a radiation plate, a circuit board (5) fixed to this via a rubber (4), and an external connection terminal (6) made of a plate-shaped metal. ). The external connection terminal (6) is electrically connected to the connection electrode (10) on the circuit board (5) via the lead assembly (7). The lead assembly (7) is composed of a pedestal (8) and a ribbon lead (9) spot welded to the pedestal (8), as in the conventional example. As shown in Figure 1, the ribbon lead (9) is formed with a curved part (9a) and a bent part (9b), and the lower surface of the pedestal part (8) and the tip side of the ribbon lead (9) are soldered (11), respectively. )(12) is fixed to the connection electrode (10) of the circuit board (5) and the external connection terminal (6). When attaching the lead assembly (7) as shown in the figure, first, as shown in FIG. ) and solder the pedestal (8) to the circuit board (5). Next, the tip side of the ribbon lead (9) is bent to form a bent part (9b), which is soldered to the external connection terminal (6). The difference between this embodiment and the conventional hybrid IC is that, as is clear from the comparison between FIGS. 3 and 4 and FIG. The ribbon lead (9) is arranged between the parts (13) and fixed to the external connection terminal (6) with solder (12). A pair of protrusions (13) are formed in the (longitudinal direction) of the external connection terminal (6) by partially pressing the side edges of the external connection terminal (6) from the bottom surface and deflecting them toward the top surface. There is. The protrusion height of the protrusion (13) is about 1/2 of the thickness of the external connection terminal (6). The pair of protrusions (13) function as guide parts for the ribbon lead (9), and when the ribbon lead (9) of the lead assembly (7) is soldered as described above, the ribbon lead (9) is connected to the external connection. Preventing the terminal (6) from being fixed with solder diagonally. That is, as shown in FIG. 3, the distance L 1 between the pair of protrusions (13) is larger than the width L 2 of the ribbon lead (9) to the extent that the ribbon lead (9) can be smoothly attached . The difference in width L 2 is small. Therefore, when the ribbon lead (9) attempts to move laterally, the pair of protrusions (13) effectively act as a stopper, preventing the ribbon lead (9) from being significantly eccentric, tilted, or misaligned laterally. It is prevented from doing so. In order for the protruding part (13) to function well as a stopper for the ribbon lead (9), the length of the pair of protruding parts (13) in the direction in which the external connection terminal (6) extends (longitudinal direction) is the same as that of the ribbon lead. It is preferable to set the length to 1/3 or more, preferably 1/2 or more of the length of the portion disposed on the external connection terminal (6) of (9). Furthermore, as is clear from FIGS. 3 and 4, since the pair of protrusions (13) protrude above the ribbon leads (9), they also function as flow prevention parts for the solder (12). Therefore, the solder (12) can be applied to the upper surface of the ribbon lead (9) with a sufficient thickness, and the ribbon lead (9) can be firmly fixed to the external connection terminal (6). The protrusion height of the protrusion (13) from one main surface of the external connection terminal (6) is at least 4/3 times the thickness of the ribbon lead (9) disposed on the external connection terminal (6); Desirably, when it is twice or more, the effect of preventing the solder (12) from flowing by the protrusion (13) can be sufficiently obtained. As described above, according to the hybrid IC of the present embodiment, the ribbon lead (9) is not soldered to the external connection terminal (6) in an eccentric, inclined or misaligned state. Therefore, since the ribbon lead (9) is fixed to the external connection terminal (6) with sufficient soldering strength, reliability is improved without causing poor connection or poor appearance.
【０００８】[0008]
本考案の実施態様は上記実施例の構造に限られることなく、以下のような変形 が可能である。 （1） 前記の実施例では、一対の突出部（13）を外部接続端子（6）に形成す る例を示したが、図５に示すように２対以上の突出部（13）を形成してもよい。 （2） 外部接続端子（6）の内側部分を長さ方向に両側縁に対して窪ませるこ とにより相対的に突出部（13）を形成してもよい。外部接続端子（6）の端部か ら窪んだ内側部分にリボンリード（9）の端部を固着することができる。 （3） 一対の突出部（13）を外部接続端子（6）と別体で形成しても良い。但 し、実施例のように外部接続端子（6）の一部を押圧加工して設けるのが生産性 等の点で望ましい。 （4） 一対の突出部（13）は互いに対向する位置から若干ずらして配置して も良い。 （5） 台座（8）とリボンリード（9）を同時に接続電極（10）と外部接続端 子（6）に半田付けして形成する場合にも有効である。 The embodiments of the present invention are not limited to the structure of the above embodiments, but may include the following modifications. is possible. (1) In the above embodiment, the pair of protrusions (13) are formed on the external connection terminal (6). Although an example has been shown, two or more pairs of protrusions (13) may be formed as shown in FIG. (2) Make the inner part of the external connection terminal (6) recessed in the length direction against both edges. The protrusion (13) may be formed relatively by. Is it the end of the external connection terminal (6)? The end of the ribbon lead (9) can be fixed to the recessed inner part. (3) The pair of protrusions (13) may be formed separately from the external connection terminal (6). However However, it is more productive to press a part of the external connection terminal (6) as shown in the example. It is desirable for the following reasons. (4) The pair of protrusions (13) are arranged slightly offset from the positions facing each other. Also good. (5) Connect the pedestal (8) and ribbon lead (9) to the electrode (10) and external connection end at the same time. It is also effective when soldering to the child (6).
【０００９】[0009]
本考案によれば、一対の突出部の間に配線リードを固着することによって配線 リードの傾斜状態での固着を防止し、配線リードを外部接続端子の正確な位置に 半田付けできる電子部品を得ることができる。 According to the present invention, wiring is achieved by fixing the wiring lead between a pair of protrusions. Prevents the lead from sticking in an inclined state and places the wiring lead in the correct position of the external connection terminal. Electronic components that can be soldered can be obtained.
【図１】図４のI−I線に沿う断面図[Figure 1] Cross-sectional view along line I-I in Figure 4
【図２】リボンリードの一端を台座に固着し、他端を外
部接続端子に固着する前の状態を示す側面図[Figure 2] Side view showing the state before one end of the ribbon lead is fixed to the pedestal and the other end is fixed to the external connection terminal
【図３】図４のIII−III線に沿う断面図[Figure 3] Cross-sectional view along line III-III in Figure 4
【図４】リボンリードの他端を外部接続端子に固着した
状態を示す斜視図[Figure 4] A perspective view showing the state in which the other end of the ribbon lead is fixed to the external connection terminal.
【図５】本考案の他の実施例を示す斜視図[Fig. 5] A perspective view showing another embodiment of the present invention.
【図６】リボンリードの他端を外部接続端子に固着した
従来の状態を示す斜視図[Fig. 6] A perspective view showing a conventional state in which the other end of the ribbon lead is fixed to an external connection terminal.
【図７】従来の自動車イグナイタ用のハイブリッドＩＣ
を示す断面図[Figure 7] Hybrid IC for conventional automobile igniter
Cross-sectional view showing
５．．回路基板、６．．外部接続端子、９．．リボンリ
ード（配線リード）、１０．．接続電極、１２．．半
田、１３．．突出部、5. ．． circuit board, 6. ．． External connection terminal, 9. ．． Ribbon lead (wiring lead), 10. ．． connection electrode, 12. ．． Handa, 13. ．． protrusion,
Claims (2)
状金属から成る外部接続端子と回路基板又は電子素子の
接続電極とを電気的に接続した電子部品において、 前
記配線リードの端部は前記外部接続端子の両側縁に形成
された一対の突出部の間に配置された状態で前記外部接
続端子に半田付けされていることを特徴とする電子部
品。1. An electronic component in which an external connection terminal made of a plate-shaped metal and a connection electrode of a circuit board or an electronic element are electrically connected via a wiring lead made of a band-shaped metal, wherein an end of the wiring lead is connected to the connection electrode of the circuit board or an electronic element. An electronic component characterized in that the electronic component is soldered to the external connection terminal while being disposed between a pair of protrusions formed on both side edges of the external connection terminal.
長手方向に延在する「請求項１」に記載の電子部品。2. The electronic component according to claim 1, wherein the pair of protrusions extend in the longitudinal direction of the external connection terminal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1991038232U JP2574102Y2 (en) | 1991-04-26 | 1991-04-26 | Electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1991038232U JP2574102Y2 (en) | 1991-04-26 | 1991-04-26 | Electronic components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04123536U true JPH04123536U (en) | 1992-11-09 |
| JP2574102Y2 JP2574102Y2 (en) | 1998-06-11 |
Family
ID=31919812
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1991038232U Expired - Fee Related JP2574102Y2 (en) | 1991-04-26 | 1991-04-26 | Electronic components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2574102Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100472309B1 (en) * | 1997-07-22 | 2005-05-27 | 삼성전자주식회사 | Metal Tool for Beam Lead Bonding |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5645043A (en) * | 1979-09-19 | 1981-04-24 | Matsushita Electric Ind Co Ltd | Forming method for electrode lead |
| JPH01143128U (en) * | 1988-03-24 | 1989-10-02 |
-
1991
- 1991-04-26 JP JP1991038232U patent/JP2574102Y2/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5645043A (en) * | 1979-09-19 | 1981-04-24 | Matsushita Electric Ind Co Ltd | Forming method for electrode lead |
| JPH01143128U (en) * | 1988-03-24 | 1989-10-02 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100472309B1 (en) * | 1997-07-22 | 2005-05-27 | 삼성전자주식회사 | Metal Tool for Beam Lead Bonding |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2574102Y2 (en) | 1998-06-11 |
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