JPS5643726A - Etching device - Google Patents

Etching device

Info

Publication number
JPS5643726A
JPS5643726A JP11922279A JP11922279A JPS5643726A JP S5643726 A JPS5643726 A JP S5643726A JP 11922279 A JP11922279 A JP 11922279A JP 11922279 A JP11922279 A JP 11922279A JP S5643726 A JPS5643726 A JP S5643726A
Authority
JP
Japan
Prior art keywords
etching
etched
substance
electrode
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11922279A
Other languages
Japanese (ja)
Inventor
Haruo Okano
Yasuhiro Horiike
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP11922279A priority Critical patent/JPS5643726A/en
Publication of JPS5643726A publication Critical patent/JPS5643726A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Drying Of Semiconductors (AREA)

Abstract

PURPOSE:To prevent contamination from electrode metal and to maintain uniformity of etching by a method wherein a dielectric material layer where a substance to be etched is placed is formed on one of electrode of a plasma-etching device and air vents are provided on interfaces of electrodes and a dielectric layer. CONSTITUTION:A laying place of a substance to be etched 11 (underneath of which an organic material 12 such as polyester film or the like is provided) is formed by providing a high molecular material layer 9 such as tetrafluoro-ethylene resin or the like on a metal electrode 8, and an air vent 10 which is leading to a vacuum container of the device is provided. As a result, contaimination coming from the metal of the material to be etched 11 is eliminated, the gas emitted by organic substance is discharged, the material on which an etching is performed is tightly fixed and a stabilized uniformity of etching can be maintained.
JP11922279A 1979-09-19 1979-09-19 Etching device Pending JPS5643726A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11922279A JPS5643726A (en) 1979-09-19 1979-09-19 Etching device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11922279A JPS5643726A (en) 1979-09-19 1979-09-19 Etching device

Publications (1)

Publication Number Publication Date
JPS5643726A true JPS5643726A (en) 1981-04-22

Family

ID=14755973

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11922279A Pending JPS5643726A (en) 1979-09-19 1979-09-19 Etching device

Country Status (1)

Country Link
JP (1) JPS5643726A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61109353U (en) * 1984-12-21 1986-07-11

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61109353U (en) * 1984-12-21 1986-07-11
JPH0237395Y2 (en) * 1984-12-21 1990-10-09

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