JPS5642387A - Manufacture of solid state color image pickup element board - Google Patents

Manufacture of solid state color image pickup element board

Info

Publication number
JPS5642387A
JPS5642387A JP11774079A JP11774079A JPS5642387A JP S5642387 A JPS5642387 A JP S5642387A JP 11774079 A JP11774079 A JP 11774079A JP 11774079 A JP11774079 A JP 11774079A JP S5642387 A JPS5642387 A JP S5642387A
Authority
JP
Japan
Prior art keywords
image pickup
pickup element
bonding
elements
solid image
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11774079A
Other languages
Japanese (ja)
Other versions
JPS6041873B2 (en
Inventor
Akira Okazaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dai Nippon Printing Co Ltd
Original Assignee
Dai Nippon Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dai Nippon Printing Co Ltd filed Critical Dai Nippon Printing Co Ltd
Priority to JP54117740A priority Critical patent/JPS6041873B2/en
Publication of JPS5642387A publication Critical patent/JPS5642387A/en
Publication of JPS6041873B2 publication Critical patent/JPS6041873B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0216—Coatings
    • H01L31/02161—Coatings for devices characterised by at least one potential jump barrier or surface barrier
    • H01L31/02162—Coatings for devices characterised by at least one potential jump barrier or surface barrier for filtering or shielding light, e.g. multicolour filters for photodetectors

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Color Television Image Signal Generators (AREA)
  • Light Receiving Elements (AREA)

Abstract

PURPOSE:To enhance mass production of the solid state color image pickup element board by simultaneously bonding a number of arrayed color separation filters with the same number of solid image pickup elements arranged when forming the color solid image pickup element board integrated by bonding the color separation filters on the solid image pickup elements. CONSTITUTION:A number of solid image pickup element 23 are arrayed on an Si wafer as a solid image pickup element substrate 31, and a number of mosaic shape or stripe shape color separation filters 26 are arranged corresponding to the picture elements of the elements 23 as a color separation filter substrate 22. Then, grooves 22b are opened correspondingly to the bonding pad portion 25 of the elements 23 on the surface of forming the filters 26 of the filter substrate 22, and the substrates 21 and 22 are bonded using an adhesive which is hardened by irradiating ultraviolet rays or heat treatment. Thus, it can be manufactured in mass production, and the dusts adhered when bonding them are introduced into the grooves 22b, and improper bonding can be eliminated.
JP54117740A 1979-09-13 1979-09-13 Manufacturing method of color solid-state image sensor plate Expired JPS6041873B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP54117740A JPS6041873B2 (en) 1979-09-13 1979-09-13 Manufacturing method of color solid-state image sensor plate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP54117740A JPS6041873B2 (en) 1979-09-13 1979-09-13 Manufacturing method of color solid-state image sensor plate

Publications (2)

Publication Number Publication Date
JPS5642387A true JPS5642387A (en) 1981-04-20
JPS6041873B2 JPS6041873B2 (en) 1985-09-19

Family

ID=14719119

Family Applications (1)

Application Number Title Priority Date Filing Date
JP54117740A Expired JPS6041873B2 (en) 1979-09-13 1979-09-13 Manufacturing method of color solid-state image sensor plate

Country Status (1)

Country Link
JP (1) JPS6041873B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57173971A (en) * 1981-04-20 1982-10-26 Matsushita Electric Ind Co Ltd Manufacture of solid state image pickup device
JP2007522680A (en) * 2004-02-11 2007-08-09 ヒューレット−パッカード デベロップメント カンパニー エル．ピー． Wafer packaging and singulation method

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57173971A (en) * 1981-04-20 1982-10-26 Matsushita Electric Ind Co Ltd Manufacture of solid state image pickup device
JPH0250628B2 (en) * 1981-04-20 1990-11-02 Matsushita Electric Ind Co Ltd
JP2007522680A (en) * 2004-02-11 2007-08-09 ヒューレット−パッカード デベロップメント カンパニー エル．ピー． Wafer packaging and singulation method
JP4708366B2 (en) * 2004-02-11 2011-06-22 サムスン エレクトロニクス カンパニー リミテッド Wafer packaging and singulation method

Also Published As

Publication number Publication date
JPS6041873B2 (en) 1985-09-19

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