JPS5642114B2 - - Google Patents

Info

Publication number
JPS5642114B2
JPS5642114B2 JP10416679A JP10416679A JPS5642114B2 JP S5642114 B2 JPS5642114 B2 JP S5642114B2 JP 10416679 A JP10416679 A JP 10416679A JP 10416679 A JP10416679 A JP 10416679A JP S5642114 B2 JPS5642114 B2 JP S5642114B2
Authority
JP
Japan
Prior art keywords
wire
conductor
applying
hole
point
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP10416679A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5562680A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS5562680A publication Critical patent/JPS5562680A/ja
Publication of JPS5642114B2 publication Critical patent/JPS5642114B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B23K26/21—Bonding by welding
    • B23K26/22—Spot welding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by welding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07125—Means for controlling the bonding environment, e.g. valves or vacuum pumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07535—Applying EM radiation, e.g. induction heating or using a laser
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Laser Beam Processing (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP10416679A 1978-10-31 1979-08-17 Wire bonding method Granted JPS5562680A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US95615878A 1978-10-31 1978-10-31

Publications (2)

Publication Number Publication Date
JPS5562680A JPS5562680A (en) 1980-05-12
JPS5642114B2 true JPS5642114B2 (enExample) 1981-10-02

Family

ID=25497833

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10416679A Granted JPS5562680A (en) 1978-10-31 1979-08-17 Wire bonding method

Country Status (5)

Country Link
EP (1) EP0010610B1 (enExample)
JP (1) JPS5562680A (enExample)
CA (1) CA1135871A (enExample)
DE (1) DE2965205D1 (enExample)
IT (1) IT1165447B (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3370240D1 (en) * 1982-12-06 1987-04-16 Welding Inst Bonding leads to semiconductor devices
WO1984002867A1 (en) * 1983-01-24 1984-08-02 Ford Werke Ag Method of laser soldering
IT1195117B (it) * 1986-08-01 1988-10-12 Vallko Srl Tettuccio apribile di autoveicolo
US4928384A (en) * 1987-03-24 1990-05-29 Cooper Industries, Inc. Method of making a wire bonded microfuse
US5093988A (en) * 1991-01-24 1992-03-10 Kohler Co. Method for attaching a flexible connector
EP0628375B1 (en) * 1993-05-21 2002-03-20 Toyota Jidosha Kabushiki Kaisha Laser welding method
US6501043B1 (en) * 1999-10-22 2002-12-31 Medtronic, Inc. Apparatus and method for laser welding of ribbons
DE102018213639A1 (de) * 2018-08-14 2020-02-20 Te Connectivity Germany Gmbh Verfahren zum Anbringen wenigstens eines insbesondere stiftförmigen Kontaktelements auf einer Leiterbahn einer Leiterplatte, Stiftleiste zur Anbringung auf einer Leiterplatte, Verbindungsanordnung

Also Published As

Publication number Publication date
EP0010610A1 (fr) 1980-05-14
IT1165447B (it) 1987-04-22
JPS5562680A (en) 1980-05-12
DE2965205D1 (en) 1983-05-19
CA1135871A (en) 1982-11-16
EP0010610B1 (fr) 1983-04-13
IT7926086A0 (it) 1979-09-28

Similar Documents

Publication Publication Date Title
IE820631L (en) Providing raised contact portions on contact areas of an¹electronic microcircuit
TW350071B (en) Chip resistor and a method of producing the same
DE3879021D1 (de) Elektrische sicherung und verfahren zu ihrer herstellung.
EP0376541A3 (en) Removing meltable material
JPS5440570A (en) Method of bonding high voltage aluminum ball
MY117343A (en) Electric circuit card and method of manufacture
JPS5642114B2 (enExample)
KR850005137A (ko) 반도체소자 제조방법
KR19980038021A (ko) 피복 와이어의 와이어 본딩장치 및 그 방법
DE3663317D1 (en) Electrical wire with refractory coating
JPS5787143A (en) Method for wire bonding
MY108775A (en) Continuous carrier web member and method of fabricating sheet metal components for electrical connectors
ATE40903T1 (de) Verfahren und vorrichtung zum herstellen von zweischicht-kontaktstuecken auf silberbasis fuer elektrische schaltgeraete.
DE3390451T1 (de) Verfahren zum Laser-Löten
JPS5635658A (en) Manufacture of rotor
GB1267710A (en) Electrical connection, and method of producing the same
JPS56114572A (en) Soldering method and its equipment
JPS56103410A (en) Manufacture of coil
JPS5351967A (en) Bonding terminal formation method
JPS568851A (en) Lead wire connecting method of semiconductor device
EP0046022A3 (en) A wire holding jig for apparatus which installs electrical wires into a connector assembly and a method of manufacturing the jig
JPS57178338A (en) Wire bonding method
JPS56100459A (en) Electronic component
JPS5348464A (en) Lead wire mounting method for compound semiconductor element
JPS56114341A (en) Bonding method