JPS5641367A - Electroless plating method - Google Patents

Electroless plating method

Info

Publication number
JPS5641367A
JPS5641367A JP11645079A JP11645079A JPS5641367A JP S5641367 A JPS5641367 A JP S5641367A JP 11645079 A JP11645079 A JP 11645079A JP 11645079 A JP11645079 A JP 11645079A JP S5641367 A JPS5641367 A JP S5641367A
Authority
JP
Japan
Prior art keywords
bubble
active agent
surface active
air
sending
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11645079A
Other languages
English (en)
Other versions
JPS5818431B2 (ja
Inventor
Akishi Nakaso
Toshiro Okamura
Koji Kamiyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Showa Denko Materials Co Ltd
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP54116450A priority Critical patent/JPS5818431B2/ja
Publication of JPS5641367A publication Critical patent/JPS5641367A/ja
Publication of JPS5818431B2 publication Critical patent/JPS5818431B2/ja
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1655—Process features
    • C23C18/1664—Process features with additional means during the plating process
    • C23C18/1669—Agitation, e.g. air introduction
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C23C18/405—Formaldehyde

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP54116450A 1979-09-10 1979-09-10 無電解メツキ法 Expired JPS5818431B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP54116450A JPS5818431B2 (ja) 1979-09-10 1979-09-10 無電解メツキ法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP54116450A JPS5818431B2 (ja) 1979-09-10 1979-09-10 無電解メツキ法

Publications (2)

Publication Number Publication Date
JPS5641367A true JPS5641367A (en) 1981-04-18
JPS5818431B2 JPS5818431B2 (ja) 1983-04-13

Family

ID=14687409

Family Applications (1)

Application Number Title Priority Date Filing Date
JP54116450A Expired JPS5818431B2 (ja) 1979-09-10 1979-09-10 無電解メツキ法

Country Status (1)

Country Link
JP (1) JPS5818431B2 (ja)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58102628A (ja) * 1981-12-14 1983-06-18 Inoue Japax Res Inc 放電加工装置
JPS6125723A (ja) * 1984-07-10 1986-02-04 Mitsubishi Electric Corp 放電加工の加工用電源制御装置
JPS6279914A (ja) * 1985-10-04 1987-04-13 Mitsubishi Electric Corp 放電加工用電源
JPS63312983A (ja) * 1987-06-16 1988-12-21 Hitachi Ltd 無電解銅めっき方法
US5126525A (en) * 1988-11-01 1992-06-30 Sodick Co., Ltd. Power supply system for electric discharge machines

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58102628A (ja) * 1981-12-14 1983-06-18 Inoue Japax Res Inc 放電加工装置
JPH0223286B2 (ja) * 1981-12-14 1990-05-23 Inoue Japax Res
JPS6125723A (ja) * 1984-07-10 1986-02-04 Mitsubishi Electric Corp 放電加工の加工用電源制御装置
JPH0429492B2 (ja) * 1984-07-10 1992-05-19
JPS6279914A (ja) * 1985-10-04 1987-04-13 Mitsubishi Electric Corp 放電加工用電源
JPH0450122B2 (ja) * 1985-10-04 1992-08-13 Mitsubishi Electric Corp
JPS63312983A (ja) * 1987-06-16 1988-12-21 Hitachi Ltd 無電解銅めっき方法
JPH0576550B2 (ja) * 1987-06-16 1993-10-22 Hitachi Ltd
US5126525A (en) * 1988-11-01 1992-06-30 Sodick Co., Ltd. Power supply system for electric discharge machines
US5298709A (en) * 1988-11-01 1994-03-29 Sodick Co., Ltd. Power supply system for electric discharge machines
US5386095A (en) * 1988-11-01 1995-01-31 Sodick Co., Ltd. Electric discharge machine power supply with current control at variable levels
US5534675A (en) * 1988-11-01 1996-07-09 Sodick Co., Ltd. Power supply system for electric discharge machines

Also Published As

Publication number Publication date
JPS5818431B2 (ja) 1983-04-13

Similar Documents

Publication Publication Date Title
JPS5641367A (en) Electroless plating method
KR890000693A (ko) 무전해 동도금 방법 및 여기에 사용된 장치
KR920002710B1 (ko) 화학동도금방법
US5736065A (en) Chemical reducing solution for copper oxide
EP0187150B1 (en) Composition and process for conditioning the surface of plastic substrates prior to metal plating
JPS563690A (en) High speed through-hole plating method
FI884659A0 (fi) Vaetskedispersionsblandning och foerfarande foer polering av jaernkomponenter.
KR960021516A (ko) 표면 금속화를 위한 방법 및 환원 용액
EP0367074A3 (en) Preparing printed circuit boards for electroplating
JPS6449298A (en) Manufacture of multilayer printed-circuit board
JPS56108869A (en) Nickel coat forming method
JPS63194396A (ja) 銅含有多層印刷配線基板中のめっきスルーホール中のストリンガーの除去方法
WO1982002063A1 (en) Method for chemical copper plating and bath to perform the method
JPS5765727A (en) Etchant for polyimide resin
JPS56156792A (en) Thickly plating method
Cerwonka Nickel Electroplating Solution and Acetylenic Compounds Therefor
JPS5687658A (en) Method of making electroless plating on nonconductor surface
JPS5658960A (en) Chemical copper-plating solution
JPS5528482A (en) Heat transfer surface and its preparation
JPH04208595A (ja) プリント配線板の小径孔内の脱泡方法
JPS57200588A (en) Nickel plating solution
JPS5729495A (en) Protective film forming liquid for original plate
Li et al. A ELECTROLESS PLATING OF Ni-P ON THE METALIZED CERAMICS(English)
Muramaki et al. Electrochemical Investigations on the Effects of Edge Protection Media in the Etching of Copper
JPH0429397A (ja) 多層プリント配線板の製造方法