JPS5687658A - Method of making electroless plating on nonconductor surface - Google Patents
Method of making electroless plating on nonconductor surfaceInfo
- Publication number
- JPS5687658A JPS5687658A JP16279079A JP16279079A JPS5687658A JP S5687658 A JPS5687658 A JP S5687658A JP 16279079 A JP16279079 A JP 16279079A JP 16279079 A JP16279079 A JP 16279079A JP S5687658 A JPS5687658 A JP S5687658A
- Authority
- JP
- Japan
- Prior art keywords
- soln
- electroless plating
- rinsed
- sensitizing
- rinsing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Chemically Coating (AREA)
- Surface Treatment Of Glass (AREA)
Abstract
PURPOSE: To form a plating layer of excellent adhesiveness by degreasing, rinsing, etching and rinsing the body to be plated then sensitizing the same by ultrasonic waves and further activating the same then electroless plating said body at the time of electroless plating the nonconductor surface.
CONSTITUTION: The surface of a nonconductive object such as ceramics, glass, plastic or the like is the first degreased with trichloroethylene, alkaline soln. or the like. After this is rinsed, it is etched with a soln. of 1W20% HF and 1W20% NHO3, and further it is rinsed, thence it is sensitized by ultrasonic waves of 10W50 KHz frequencies by using a mixed sensitizing soln. of 1W30g/l SnCl2, 10ml/l HCl. After this is rinsed, it is activated by using a soln. of 0.05W2g/l PdCl2, <50ml/ lHCl, and is then dipped in an electroless plating soln. and is thereby plated. A plating layer of exceedingly with high adhesiveness may be easily formed.
COPYRIGHT: (C)1981,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16279079A JPS5687658A (en) | 1979-12-17 | 1979-12-17 | Method of making electroless plating on nonconductor surface |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16279079A JPS5687658A (en) | 1979-12-17 | 1979-12-17 | Method of making electroless plating on nonconductor surface |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5687658A true JPS5687658A (en) | 1981-07-16 |
Family
ID=15761249
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16279079A Pending JPS5687658A (en) | 1979-12-17 | 1979-12-17 | Method of making electroless plating on nonconductor surface |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5687658A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6311675A (en) * | 1986-07-03 | 1988-01-19 | Nippon Mining Co Ltd | Electroless plating method for alumina substrate |
JPH03183678A (en) * | 1989-12-12 | 1991-08-09 | Okuno Seiyaku Kogyo Kk | Method for plating ceramics |
-
1979
- 1979-12-17 JP JP16279079A patent/JPS5687658A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6311675A (en) * | 1986-07-03 | 1988-01-19 | Nippon Mining Co Ltd | Electroless plating method for alumina substrate |
JPH03183678A (en) * | 1989-12-12 | 1991-08-09 | Okuno Seiyaku Kogyo Kk | Method for plating ceramics |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
AU574823B2 (en) | Metallization of electronic interconnection boards | |
FR2097133B1 (en) | ||
SE8101360L (en) | PROCEDURE FOR MANUFACTURING PRINTED LEADER PLATES WITH PERFORTS, WHICH WALLS ARE METALLIZED | |
JPS5687658A (en) | Method of making electroless plating on nonconductor surface | |
EP0358480A3 (en) | Process for producing multilayer printed wiring board | |
JPS54100931A (en) | Electroless nickel plating | |
JPS64275A (en) | Catalyst for electroless plating and method using said catalyst | |
JPS55154555A (en) | Plating method for ferrite magnet | |
EP0261301A3 (en) | Process for the preparation of circuit-printed board having plated through-hole | |
JPH0429397A (en) | Manufacture of multilayer printed circuit board | |
IT1241122B (en) | METHOD TO PREPARE A LAYER THAT PREVENTS THE DIFFUSION OF ALKALINE METALS | |
JPS5460582A (en) | Electrode wiring and its forming method in semiconductor device | |
Moisan et al. | Process for Selective Metallization | |
JPS6487782A (en) | Partial plating method | |
JPS5417977A (en) | Method of plating polyurethane foam | |
JPS5753277A (en) | Fluororesin filmformation on surface of iron or iron alloy | |
JPS56108869A (en) | Nickel coat forming method | |
JPS649884A (en) | Insert ceramics | |
JPS57111328A (en) | Electroless plating onto plastic surface | |
JPS57149463A (en) | Metal-plating method of polyamide resin | |
Utsumi et al. | Metallized Ceramic Substrate and Method of Manufacturing the Same | |
Stahl et al. | Method of Producing Printed Circuit Boards with Holes Having Metallized Walls | |
JPS6489392A (en) | Manufacture of printed wiring board | |
JPS558490A (en) | Production of artificial patina | |
JPS57114672A (en) | Electroless plated body |