JPS5765727A - Etchant for polyimide resin - Google Patents

Etchant for polyimide resin

Info

Publication number
JPS5765727A
JPS5765727A JP14168180A JP14168180A JPS5765727A JP S5765727 A JPS5765727 A JP S5765727A JP 14168180 A JP14168180 A JP 14168180A JP 14168180 A JP14168180 A JP 14168180A JP S5765727 A JPS5765727 A JP S5765727A
Authority
JP
Japan
Prior art keywords
polyimide resin
etchant
alcoholic
aqueous
concentration
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14168180A
Other languages
Japanese (ja)
Other versions
JPS6054980B2 (en
Inventor
Hiroshi Suzuki
Daisuke Makino
Atsushi Saiki
Yukiyoshi Harada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Showa Denko Materials Co Ltd
Original Assignee
Hitachi Chemical Co Ltd
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd, Hitachi Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP14168180A priority Critical patent/JPS6054980B2/en
Publication of JPS5765727A publication Critical patent/JPS5765727A/en
Publication of JPS6054980B2 publication Critical patent/JPS6054980B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
  • Weting (AREA)

Abstract

PURPOSE: Titled etchant capable of forming, with precision, fine through holes in a polyimide resin film, comprising an aqueous (or alcoholic) solution containing tetramethylammonium hydroxide and a polyamide compound.
CONSTITUTION: An etchant suitalbe to etch a polyimide resin, comprising an (aqueous or alcoholic) solution containing tetramethylammonium hydroxide in a concentration of 10W30wt% and a polyamine compound of the formula, wherein R is a 2C or higher atomic group, e.g., ethylenediamine, in a concentration of 1W 30wt%.
COPYRIGHT: (C)1982,JPO&Japio
JP14168180A 1980-10-08 1980-10-08 Etching liquid for forming through holes in polyimide resin Expired JPS6054980B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14168180A JPS6054980B2 (en) 1980-10-08 1980-10-08 Etching liquid for forming through holes in polyimide resin

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14168180A JPS6054980B2 (en) 1980-10-08 1980-10-08 Etching liquid for forming through holes in polyimide resin

Publications (2)

Publication Number Publication Date
JPS5765727A true JPS5765727A (en) 1982-04-21
JPS6054980B2 JPS6054980B2 (en) 1985-12-03

Family

ID=15297726

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14168180A Expired JPS6054980B2 (en) 1980-10-08 1980-10-08 Etching liquid for forming through holes in polyimide resin

Country Status (1)

Country Link
JP (1) JPS6054980B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002006423A1 (en) * 2000-07-18 2002-01-24 3M Innovative Properties Company Liquid crystal polymers for flexible circuits
FR2834180A1 (en) * 2001-12-20 2003-06-27 Org Europeene De Rech Production of a multi layer module for high-density printed circuits comprises anisotropically etching micro holes through a metal-coated polyimide film

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002006423A1 (en) * 2000-07-18 2002-01-24 3M Innovative Properties Company Liquid crystal polymers for flexible circuits
FR2834180A1 (en) * 2001-12-20 2003-06-27 Org Europeene De Rech Production of a multi layer module for high-density printed circuits comprises anisotropically etching micro holes through a metal-coated polyimide film
WO2003055288A1 (en) * 2001-12-20 2003-07-03 Organisation Europeenne Pour La Recherche Nucleaire Method for making a multilayer module with high-density printed circuits
US7135119B2 (en) 2001-12-20 2006-11-14 Organisation Europeenne Pour La Recherche Nucleaire Method for making a multilayer module with high-density printed circuits

Also Published As

Publication number Publication date
JPS6054980B2 (en) 1985-12-03

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