JPS5640249A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS5640249A
JPS5640249A JP11618079A JP11618079A JPS5640249A JP S5640249 A JPS5640249 A JP S5640249A JP 11618079 A JP11618079 A JP 11618079A JP 11618079 A JP11618079 A JP 11618079A JP S5640249 A JPS5640249 A JP S5640249A
Authority
JP
Japan
Prior art keywords
resin
100pts
hardening
leakage current
extremely small
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11618079A
Other languages
Japanese (ja)
Other versions
JPS6154248B2 (en
Inventor
Takae Ikeda
Takashi Yokoyama
Hiroshi Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP11618079A priority Critical patent/JPS5640249A/en
Publication of JPS5640249A publication Critical patent/JPS5640249A/en
Publication of JPS6154248B2 publication Critical patent/JPS6154248B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
    • H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
    • H01L21/02118—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer carbon based polymeric organic or inorganic material, e.g. polyimides, poly cyclobutene or PVC

Abstract

PURPOSE:To obtain a device having an extremely small leakage current by containing polyimide resin powders in Si resin to coat a P-N junction section wherein heating treatment is applied after hardening the Si resin. CONSTITUTION:Polyimide resin powders of 5-100pts.wt. having a grain diameter of about 0.5-10mu is added to Si resin of 100pts.wt. and the Si resin is left in the air under the presence of moisture and hardening is sufficiently progressed. Next, heating is applied for 10-24hr in stages, at 50 deg.C for the first stage and at 200 deg.C or over for the final stage or in successively. In this composition, reverse leakage current becomes extremely small and a high reliability protective film will be obtained by protecting the exposed surface of the P-N junction of a semiconductor element.
JP11618079A 1979-09-12 1979-09-12 Manufacture of semiconductor device Granted JPS5640249A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11618079A JPS5640249A (en) 1979-09-12 1979-09-12 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11618079A JPS5640249A (en) 1979-09-12 1979-09-12 Manufacture of semiconductor device

Publications (2)

Publication Number Publication Date
JPS5640249A true JPS5640249A (en) 1981-04-16
JPS6154248B2 JPS6154248B2 (en) 1986-11-21

Family

ID=14680775

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11618079A Granted JPS5640249A (en) 1979-09-12 1979-09-12 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5640249A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4952662A (en) * 1988-02-12 1990-08-28 Huels Aktiengaellscaft Molding compounds comprising a thermoplastically processible, aromatic polyamide

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4952662A (en) * 1988-02-12 1990-08-28 Huels Aktiengaellscaft Molding compounds comprising a thermoplastically processible, aromatic polyamide

Also Published As

Publication number Publication date
JPS6154248B2 (en) 1986-11-21

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