JPS5638830A - Sealing method - Google Patents

Sealing method

Info

Publication number
JPS5638830A
JPS5638830A JP11499379A JP11499379A JPS5638830A JP S5638830 A JPS5638830 A JP S5638830A JP 11499379 A JP11499379 A JP 11499379A JP 11499379 A JP11499379 A JP 11499379A JP S5638830 A JPS5638830 A JP S5638830A
Authority
JP
Japan
Prior art keywords
sealing
resin
frame body
peripheral region
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11499379A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6145379B2 (cg-RX-API-DMAC10.html
Inventor
Kazuo Usada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP11499379A priority Critical patent/JPS5638830A/ja
Publication of JPS5638830A publication Critical patent/JPS5638830A/ja
Publication of JPS6145379B2 publication Critical patent/JPS6145379B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W74/01—

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP11499379A 1979-09-07 1979-09-07 Sealing method Granted JPS5638830A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11499379A JPS5638830A (en) 1979-09-07 1979-09-07 Sealing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11499379A JPS5638830A (en) 1979-09-07 1979-09-07 Sealing method

Publications (2)

Publication Number Publication Date
JPS5638830A true JPS5638830A (en) 1981-04-14
JPS6145379B2 JPS6145379B2 (cg-RX-API-DMAC10.html) 1986-10-07

Family

ID=14651655

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11499379A Granted JPS5638830A (en) 1979-09-07 1979-09-07 Sealing method

Country Status (1)

Country Link
JP (1) JPS5638830A (cg-RX-API-DMAC10.html)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61220358A (ja) * 1985-03-27 1986-09-30 Hitachi Micro Comput Eng Ltd 半導体装置
JPS6393649U (cg-RX-API-DMAC10.html) * 1986-12-08 1988-06-17
JPH01169953A (ja) * 1987-12-25 1989-07-05 Citizen Watch Co Ltd 樹脂封止型ピングリッドアレイ構造
US7215010B2 (en) * 2000-03-03 2007-05-08 Infineon Technologies Ag Device for packing electronic components using injection molding technology

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4823962U (cg-RX-API-DMAC10.html) * 1971-07-28 1973-03-19

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4823962U (cg-RX-API-DMAC10.html) * 1971-07-28 1973-03-19

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61220358A (ja) * 1985-03-27 1986-09-30 Hitachi Micro Comput Eng Ltd 半導体装置
JPS6393649U (cg-RX-API-DMAC10.html) * 1986-12-08 1988-06-17
JPH01169953A (ja) * 1987-12-25 1989-07-05 Citizen Watch Co Ltd 樹脂封止型ピングリッドアレイ構造
US7215010B2 (en) * 2000-03-03 2007-05-08 Infineon Technologies Ag Device for packing electronic components using injection molding technology

Also Published As

Publication number Publication date
JPS6145379B2 (cg-RX-API-DMAC10.html) 1986-10-07

Similar Documents

Publication Publication Date Title
JPS5638830A (en) Sealing method
JPS53143656A (en) Resin seal-forming of electronic parts
JPS57128930A (en) Resin sealing
JPS5211866A (en) Resin sealing method in a semiconductor device
JPS564241A (en) Manufacture of semiconductor device
JPS5275180A (en) Package for integrated circuits
JPS5632736A (en) Sealing method of hybrid integrated circuit device
JPS56114336A (en) Resin sealing method for hybrid integrated circuit
JPS55130134A (en) Bonding method of semiconductor pellet
JPS5522873A (en) Manufacturing method of resin sealing semiconductor device
JPS5387173A (en) Molding mold
JPS5769762A (en) Sealing method of hybrid integrated circuit
JPS5481073A (en) Sealing method for semiconductor element
JPS5669851A (en) Semiconductor device
JPS57202745A (en) Manufacture of semiconductor device
JPS55119348A (en) Thin type battery
JPS57118654A (en) Circuit substrate
JPS57100027A (en) Manufacture of interior material
JPS54160171A (en) Package for semiconductor element
JPS5426879A (en) Encapsulated electronic part
JPS5494877A (en) Production of electronic part device
JPS5487178A (en) Construction of bonding part between semiconductor pellet and electrode plate
JPS5734353A (en) Resin sealed type semiconductor device
JPS5735354A (en) Sealing method for semiconductor housing container
JPS57187943A (en) Sealing method of semiconductor element