JPS5635485A - Manufacture of semiconductor laser element - Google Patents
Manufacture of semiconductor laser elementInfo
- Publication number
- JPS5635485A JPS5635485A JP11079379A JP11079379A JPS5635485A JP S5635485 A JPS5635485 A JP S5635485A JP 11079379 A JP11079379 A JP 11079379A JP 11079379 A JP11079379 A JP 11079379A JP S5635485 A JPS5635485 A JP S5635485A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- al2o3
- laser element
- thereafter
- manufacture
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/028—Coatings ; Treatment of the laser facets, e.g. etching, passivation layers or reflecting layers
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Formation Of Insulating Films (AREA)
- Semiconductor Lasers (AREA)
Abstract
PURPOSE:To obtain a complete film having preferable adherence and protective effect by heating a laser crystal at higher than 200 deg.C and thereafter evaporating Al2O3 on the resonant surface thereof. CONSTITUTION:A GaAlAs laser substrate is cut, and a rectangular substrate 1 connected with a streak architecture double hetero junction type laser element is formed, and Al2O3 is evaporated thereon in the state that is heated at approx. 300 deg.C by an infrared ray lamp 2. The temperature of the substrate 1 is detected by a thermocouple 3, electrons are irradiated from a filament 5 to a target 4, and are deposited. Thereafter, it is divided into elements. According to this configuration, the Al2O3 is not isolated due to the cleavage of the substrate, and preferable protective film can be obtained, and its deterioration can be prevented.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11079379A JPS5850037B2 (en) | 1979-08-29 | 1979-08-29 | Manufacturing method of semiconductor laser device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11079379A JPS5850037B2 (en) | 1979-08-29 | 1979-08-29 | Manufacturing method of semiconductor laser device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5635485A true JPS5635485A (en) | 1981-04-08 |
JPS5850037B2 JPS5850037B2 (en) | 1983-11-08 |
Family
ID=14544768
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11079379A Expired JPS5850037B2 (en) | 1979-08-29 | 1979-08-29 | Manufacturing method of semiconductor laser device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5850037B2 (en) |
-
1979
- 1979-08-29 JP JP11079379A patent/JPS5850037B2/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS5850037B2 (en) | 1983-11-08 |
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