JPS5633847A - Package molding for semiconductor - Google Patents
Package molding for semiconductorInfo
- Publication number
- JPS5633847A JPS5633847A JP10996579A JP10996579A JPS5633847A JP S5633847 A JPS5633847 A JP S5633847A JP 10996579 A JP10996579 A JP 10996579A JP 10996579 A JP10996579 A JP 10996579A JP S5633847 A JPS5633847 A JP S5633847A
- Authority
- JP
- Japan
- Prior art keywords
- cavities
- thermoplastic resin
- plate shaped
- resin plate
- shaped substances
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title abstract 6
- 238000000465 moulding Methods 0.000 title 1
- 239000000126 substance Substances 0.000 abstract 7
- 229920005992 thermoplastic resin Polymers 0.000 abstract 6
- 239000002184 metal Substances 0.000 abstract 3
- 229920005989 resin Polymers 0.000 abstract 3
- 239000011347 resin Substances 0.000 abstract 3
- 230000008018 melting Effects 0.000 abstract 2
- 238000002844 melting Methods 0.000 abstract 2
- 238000010438 heat treatment Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10996579A JPS5633847A (en) | 1979-08-28 | 1979-08-28 | Package molding for semiconductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10996579A JPS5633847A (en) | 1979-08-28 | 1979-08-28 | Package molding for semiconductor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5633847A true JPS5633847A (en) | 1981-04-04 |
| JPS6122467B2 JPS6122467B2 (enrdf_load_stackoverflow) | 1986-05-31 |
Family
ID=14523633
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10996579A Granted JPS5633847A (en) | 1979-08-28 | 1979-08-28 | Package molding for semiconductor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5633847A (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6313352A (ja) * | 1986-07-04 | 1988-01-20 | Sumitomo Bakelite Co Ltd | 半導体類の封止方法 |
-
1979
- 1979-08-28 JP JP10996579A patent/JPS5633847A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6313352A (ja) * | 1986-07-04 | 1988-01-20 | Sumitomo Bakelite Co Ltd | 半導体類の封止方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6122467B2 (enrdf_load_stackoverflow) | 1986-05-31 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| DE3063915D1 (en) | Injection mould with high capacity sprue bushing | |
| MY116961A (en) | Method for molding thermoplastic resin | |
| DE59301147D1 (de) | Spritzgiessmaschine mit Etagenwerkzeug | |
| TW429213B (en) | Method for molding thermoplastic resin | |
| JPS57113042A (en) | Mold clamping device for injection molding machine | |
| JPS5633847A (en) | Package molding for semiconductor | |
| DE3560022D1 (en) | Device for the protection of the moulds of an injection-moulding machine for injection moulding of plastic materials during the closing of the moulds | |
| JPS57201638A (en) | Insert molding method of thin-wall parts | |
| JPS5787320A (en) | Manufacture of resin molded article | |
| JPS55160948A (en) | Molded motor | |
| JPS57116623A (en) | Injection molding machine for thermoplastic synthetic resin | |
| JPH09201846A (ja) | リリースフィルムを用いる樹脂モールド方法及び樹脂モールド装置並びにこれに用いる樹脂タブレット | |
| GB9121541D0 (en) | Encapsulating semiconductor devices | |
| JPS55139241A (en) | Resin molding machine of substrate | |
| JPS5720437A (en) | Resin sealing metal mold for semiconductor device | |
| JP2587539B2 (ja) | 半導体装置の樹脂封止用金型 | |
| JPS5569421A (en) | Modling of frame for electric appliance | |
| JPS649713A (en) | Resin molding die | |
| JP3022419B2 (ja) | 半導体樹脂封止金型 | |
| JPS5629338A (en) | Resin sealing of semiconductor element | |
| JPS6436008A (en) | Molded capacitor | |
| JPS55138239A (en) | Resin sealing mold | |
| JPS5617238A (en) | Mold device for molding resin | |
| JPS5635446A (en) | Package for semiconductors | |
| JPS6473747A (en) | Formation of plastic package of semiconductor or the like |