JPS5624921A - Transferring method of wafer - Google Patents

Transferring method of wafer

Info

Publication number
JPS5624921A
JPS5624921A JP10199079A JP10199079A JPS5624921A JP S5624921 A JPS5624921 A JP S5624921A JP 10199079 A JP10199079 A JP 10199079A JP 10199079 A JP10199079 A JP 10199079A JP S5624921 A JPS5624921 A JP S5624921A
Authority
JP
Japan
Prior art keywords
board
circular arc
slots
wafers
arc slots
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10199079A
Other languages
Japanese (ja)
Inventor
Masaaki Sadamori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP10199079A priority Critical patent/JPS5624921A/en
Publication of JPS5624921A publication Critical patent/JPS5624921A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof

Abstract

PURPOSE:To enable surely to transfer semiconductor wafers being set up on plural circular arc slots provided on a board into a washer having similarly circular arc slots on both side walls by a method wherein the location of these slots is made to coincide with each other, and the board only is made to sink. CONSTITUTION:A device to transfer semiconductor wafers 4 being set up on plural circular arc slots provided on a board 6 into similar plural circular arc slots 1b formed on the side walls of a washer 1 is constituted as follows. Side plates 1a confronting with each other are provided in the washer 1, plural comblike circular arc slots 1b having the form coinciding with the form of circumference of the wafers 4 are provided on the plates and an opening part 1e is provided at the part surrounded with the plates. The width of the board 6 to be inserted in there is made to be smaller than that of the opening part 1e. After the wafers 4 are set up, the location of circular arc slots on both sides are made to coincide and the board 6 is inserted into the opening part 1e and is made to sink to remain the wafers 4 only in the slots 1b. When they are to be reversely transferred, the board 6 is pushed up with a push-up tool 3 returning to the previous condition.
JP10199079A 1979-08-08 1979-08-08 Transferring method of wafer Pending JPS5624921A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10199079A JPS5624921A (en) 1979-08-08 1979-08-08 Transferring method of wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10199079A JPS5624921A (en) 1979-08-08 1979-08-08 Transferring method of wafer

Publications (1)

Publication Number Publication Date
JPS5624921A true JPS5624921A (en) 1981-03-10

Family

ID=14315266

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10199079A Pending JPS5624921A (en) 1979-08-08 1979-08-08 Transferring method of wafer

Country Status (1)

Country Link
JP (1) JPS5624921A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5149244A (en) * 1989-08-18 1992-09-22 Applied Materials, Inc. Apparatus for aligning wafers within a semiconductor wafer cassette
US5217341A (en) * 1989-08-18 1993-06-08 Applied Materials, Inc. Method for aligning wafers within a semiconductor wafer cassette
US6961639B2 (en) 2002-01-29 2005-11-01 Recif, Societe Anonyme Apparatus and process for identification of characters inscribed on a semiconductor wafer containing an orientation mark
US7108476B2 (en) 1998-05-05 2006-09-19 Recif Technologies Sas Method and device for changing a semiconductor wafer position
CN105081908A (en) * 2015-09-15 2015-11-25 沈阳飞机工业（集团）有限公司 High precision semicircle clamp and semicircle inner hole machining method thereof

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5149244A (en) * 1989-08-18 1992-09-22 Applied Materials, Inc. Apparatus for aligning wafers within a semiconductor wafer cassette
US5217341A (en) * 1989-08-18 1993-06-08 Applied Materials, Inc. Method for aligning wafers within a semiconductor wafer cassette
US7108476B2 (en) 1998-05-05 2006-09-19 Recif Technologies Sas Method and device for changing a semiconductor wafer position
US6961639B2 (en) 2002-01-29 2005-11-01 Recif, Societe Anonyme Apparatus and process for identification of characters inscribed on a semiconductor wafer containing an orientation mark
CN105081908A (en) * 2015-09-15 2015-11-25 沈阳飞机工业（集团）有限公司 High precision semicircle clamp and semicircle inner hole machining method thereof

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