JPS5621340A - Device for automatic treament of wafer - Google Patents

Device for automatic treament of wafer

Info

Publication number
JPS5621340A
JPS5621340A JP9610779A JP9610779A JPS5621340A JP S5621340 A JPS5621340 A JP S5621340A JP 9610779 A JP9610779 A JP 9610779A JP 9610779 A JP9610779 A JP 9610779A JP S5621340 A JPS5621340 A JP S5621340A
Authority
JP
Japan
Prior art keywords
wafer
cassette
wafer cassette
wafers
conveyed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9610779A
Other languages
English (en)
Other versions
JPS6359249B2 (ja
Inventor
Michiyuki Harada
Mamoru Kondo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Telegraph and Telephone Corp
Original Assignee
Nippon Telegraph and Telephone Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Telegraph and Telephone Corp filed Critical Nippon Telegraph and Telephone Corp
Priority to JP9610779A priority Critical patent/JPS5621340A/ja
Publication of JPS5621340A publication Critical patent/JPS5621340A/ja
Publication of JPS6359249B2 publication Critical patent/JPS6359249B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Automation & Control Theory (AREA)
JP9610779A 1979-07-30 1979-07-30 Device for automatic treament of wafer Granted JPS5621340A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9610779A JPS5621340A (en) 1979-07-30 1979-07-30 Device for automatic treament of wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9610779A JPS5621340A (en) 1979-07-30 1979-07-30 Device for automatic treament of wafer

Publications (2)

Publication Number Publication Date
JPS5621340A true JPS5621340A (en) 1981-02-27
JPS6359249B2 JPS6359249B2 (ja) 1988-11-18

Family

ID=14156156

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9610779A Granted JPS5621340A (en) 1979-07-30 1979-07-30 Device for automatic treament of wafer

Country Status (1)

Country Link
JP (1) JPS5621340A (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01230246A (ja) * 1987-11-06 1989-09-13 Tel Sagami Ltd 半導体ウェハの移し換え方法及び半導体ウェハの移し換え装置並びに半導体ウェハの熱処理ボート
JPH0384943A (ja) * 1989-08-28 1991-04-10 Tokyo Electron Ltd トレー保持機構

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01230246A (ja) * 1987-11-06 1989-09-13 Tel Sagami Ltd 半導体ウェハの移し換え方法及び半導体ウェハの移し換え装置並びに半導体ウェハの熱処理ボート
JPH0384943A (ja) * 1989-08-28 1991-04-10 Tokyo Electron Ltd トレー保持機構

Also Published As

Publication number Publication date
JPS6359249B2 (ja) 1988-11-18

Similar Documents

Publication Publication Date Title
JPS5619635A (en) Manufacturing apparatus
DE3171220D1 (en) Method of and apparatus for transferring semiconductor wafers between carrier members
GB2066300B (en) Sputter coating apparatus for semiconductor wafers
GB2039030B (en) Alignment device for semiconductor masks and wafers
GB2119680B (en) Apparatus for heat treating a semiconductor wafer
ES8500479A1 (es) Una instalacion para vigilar y registrar datos relacionados con una serie de operaciones en cada uno de los puestos para la fabricacion de un componente
DE2965631D1 (en) Method and apparatus for heating semiconductor wafers
JPS5621340A (en) Device for automatic treament of wafer
TW344089B (en) Loading and unloading station for semiconductor processing installations
ZA739678B (en) Electric circuits, particularly for automatic battery charging apparatus
ES8101851A1 (es) Perfeccionamientos en dispositivos para cortar bloques de barquillos
DE3868812D1 (de) Automatische vorrichtung fuer die schnelle thermochemische behandlung.
ES444665A1 (es) Un procedimiento para recargar un acumulador o una bateria.
JPS56169343A (en) Manufacture of semiconductor device
JPS57211746A (en) Wafer conveying apparatus
JPS56164522A (en) Transferring and distributing method
DE3376709D1 (en) Power supply conductor, essentially for vacuum apparatus, and manufacturing method thereof
JPS56133843A (en) Probe grinder for probe card
JPS53140698A (en) Method and device for wafer lapping
JPS5312784A (en) Method and apparatus for transferring substrates in vacuum
JPS51120148A (en) Trouble processing system for unattended stations
JPS5793826A (en) Basket automatic transporter
JPS52156552A (en) Wafer inspection apparatus
CA578540A (en) Apparatus for automatically centering a moving endless belt
JPS5241883A (en) Bobin separation arrangment apparatus