JPS5617181A - Molten solder plating device - Google Patents
Molten solder plating deviceInfo
- Publication number
- JPS5617181A JPS5617181A JP9119379A JP9119379A JPS5617181A JP S5617181 A JPS5617181 A JP S5617181A JP 9119379 A JP9119379 A JP 9119379A JP 9119379 A JP9119379 A JP 9119379A JP S5617181 A JPS5617181 A JP S5617181A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- vessel
- liquid
- compartment
- liquid level
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0646—Solder baths
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
PURPOSE:To prevent the oxidation of solder and the formation of solder bridges and solder flashes by providing escape holes for efflux of molten liquid in compartment to the guiding plates of the compartment with a top opening edge and a lower receiving port of a titled jet type device. CONSTITUTION:Solder charged into a vessel 1 is heated and melted by a heater 5. When a propeller 7 is rotated by a motor 6, molten solder liquid passes through a receiving port 3 and flows into a compartment 4, from which it passes through a flow aligning plate 8 and flows out into the vessel 1 through escape holes 9, thereby circulating in the vessel. At this time, the flow rate of the molten liquid is controlled to prevent the liquid from flowing out from an opening edge 2 or to overflow therefrom to the extent of not allowing the flux carried in from the materials to be plated from diffusing, thereby maintaining a liquid level L2 of fixed height from the liquid level L1 in the vessel. If in this state electronic parts etc. of intricate shapes are solder plated, the escape of flux does not occur because the liquid level L2is in a state close to static. Since the efflux fall from the holes 9 is small, the formation or oxide produced on the solder surface may be reduced.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9119379A JPS5617181A (en) | 1979-07-18 | 1979-07-18 | Molten solder plating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9119379A JPS5617181A (en) | 1979-07-18 | 1979-07-18 | Molten solder plating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5617181A true JPS5617181A (en) | 1981-02-18 |
Family
ID=14019598
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9119379A Pending JPS5617181A (en) | 1979-07-18 | 1979-07-18 | Molten solder plating device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5617181A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7815096B2 (en) * | 2006-05-16 | 2010-10-19 | Celestica International Inc. | Laminar flow well |
-
1979
- 1979-07-18 JP JP9119379A patent/JPS5617181A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7815096B2 (en) * | 2006-05-16 | 2010-10-19 | Celestica International Inc. | Laminar flow well |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4401253A (en) | Mass soldering system | |
| KR20070108511A (en) | Wave solder nozzle with an exit trough having a weir, a surface of the through being wettable by solder, a wave soldering machine with such nozzle, a method of improving the flow of solder out of a wave solder nozzle | |
| US3190527A (en) | Means for applying oil film to solder wave | |
| MY104651A (en) | An automatic jet soldering apparatus | |
| JPS5617181A (en) | Molten solder plating device | |
| US3990621A (en) | Static head soldering system with oil | |
| JPS564351A (en) | Tundish for continuous casting | |
| TR24409A (en) | SHOULD SUBMIT THE INTERMEDIATE OF MELT TO THE END OF A ENDLESS DOEKUEM FRAGRANCE | |
| US3452916A (en) | Tinning-oil level control for a solder-wave apparatus | |
| US4635584A (en) | Apparatus for tinning printed-circuit boards | |
| BR9004830A (en) | PROCESS AND APPLIANCE FOR THE FLAT STRIPES FOUNDATION WITH RESISTANCE TO ADVANCE | |
| US3824049A (en) | Vessel for quenching cast sheeting | |
| JPH04339562A (en) | Jetting solder vessel | |
| JPS56105862A (en) | Sliding nozzle device having at least three plates | |
| JPS5516725A (en) | Soldering device | |
| JPS57152414A (en) | Preventing device for outflow of slag from refining vessel | |
| JPS56139828A (en) | Spark erosion equipment | |
| JPS5530360A (en) | Jet type solder bath | |
| JPH0677815B2 (en) | Jet type solder bath | |
| JPS62290876A (en) | Surface treatment device | |
| JPS56169764A (en) | Device for electroless copper plating | |
| JPH0489176A (en) | Solder jetting nozzle | |
| JPS6343193B2 (en) | ||
| GB1130030A (en) | Improvements in apparatus for the continuous indication and automatic regulation of the viscosity of a liquid | |
| GB1370756A (en) | Apparatus for pouring liquid metal |