JPS56169347A - Laser scribing device - Google Patents

Laser scribing device

Info

Publication number
JPS56169347A
JPS56169347A JP7314780A JP7314780A JPS56169347A JP S56169347 A JPS56169347 A JP S56169347A JP 7314780 A JP7314780 A JP 7314780A JP 7314780 A JP7314780 A JP 7314780A JP S56169347 A JPS56169347 A JP S56169347A
Authority
JP
Japan
Prior art keywords
pulse
switch
wafer
scr
duty cycle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7314780A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0145225B2 (enrdf_load_stackoverflow
Inventor
Ken Ishikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP7314780A priority Critical patent/JPS56169347A/ja
Publication of JPS56169347A publication Critical patent/JPS56169347A/ja
Publication of JPH0145225B2 publication Critical patent/JPH0145225B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Dicing (AREA)
  • Lasers (AREA)
JP7314780A 1980-05-31 1980-05-31 Laser scribing device Granted JPS56169347A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7314780A JPS56169347A (en) 1980-05-31 1980-05-31 Laser scribing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7314780A JPS56169347A (en) 1980-05-31 1980-05-31 Laser scribing device

Publications (2)

Publication Number Publication Date
JPS56169347A true JPS56169347A (en) 1981-12-26
JPH0145225B2 JPH0145225B2 (enrdf_load_stackoverflow) 1989-10-03

Family

ID=13509788

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7314780A Granted JPS56169347A (en) 1980-05-31 1980-05-31 Laser scribing device

Country Status (1)

Country Link
JP (1) JPS56169347A (enrdf_load_stackoverflow)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07136782A (ja) * 1993-05-13 1995-05-30 Russian Technol Group Lp パルスレーザビームを用いた、透明な材料の内側に像を形成する方法及び装置
WO2014134470A1 (en) 2013-02-28 2014-09-04 Ipg Photonics Corporation Laser system and method for processing sapphire
US10286487B2 (en) 2013-02-28 2019-05-14 Ipg Photonics Corporation Laser system and method for processing sapphire
CN110121398A (zh) * 2016-08-30 2019-08-13 康宁股份有限公司 透明材料的激光加工
US10807199B2 (en) 2014-08-28 2020-10-20 Ipg Photonics Corporation Multi-laser system and method for cutting and post-cut processing hard dielectric materials
US11565350B2 (en) 2014-08-28 2023-01-31 Ipg Photonics Corporation System and method for laser beveling and/or polishing

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ES2285634T3 (es) 2002-03-12 2007-11-16 Hamamatsu Photonics K. K. Metodo para dividir un siustrato.

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5418129U (enrdf_load_stackoverflow) * 1978-06-21 1979-02-06

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5418129U (enrdf_load_stackoverflow) * 1978-06-21 1979-02-06

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07136782A (ja) * 1993-05-13 1995-05-30 Russian Technol Group Lp パルスレーザビームを用いた、透明な材料の内側に像を形成する方法及び装置
US5637244A (en) * 1993-05-13 1997-06-10 Podarok International, Inc. Method and apparatus for creating an image by a pulsed laser beam inside a transparent material
WO2014134470A1 (en) 2013-02-28 2014-09-04 Ipg Photonics Corporation Laser system and method for processing sapphire
US10286487B2 (en) 2013-02-28 2019-05-14 Ipg Photonics Corporation Laser system and method for processing sapphire
EP2961559B1 (en) * 2013-02-28 2020-05-20 IPG Photonics Corporation Laser systems and method for processing sapphire
US10807199B2 (en) 2014-08-28 2020-10-20 Ipg Photonics Corporation Multi-laser system and method for cutting and post-cut processing hard dielectric materials
US11565350B2 (en) 2014-08-28 2023-01-31 Ipg Photonics Corporation System and method for laser beveling and/or polishing
US11819949B2 (en) 2014-08-28 2023-11-21 Ipg Photonics Corporation Multi-laser system and method for cutting and post-cut processing hard dielectric materials
CN110121398A (zh) * 2016-08-30 2019-08-13 康宁股份有限公司 透明材料的激光加工

Also Published As

Publication number Publication date
JPH0145225B2 (enrdf_load_stackoverflow) 1989-10-03

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