ES8501275A1 - Aparato para mecanizar con rayos laser una pieza trabajada - Google Patents
Aparato para mecanizar con rayos laser una pieza trabajadaInfo
- Publication number
- ES8501275A1 ES8501275A1 ES525267A ES525267A ES8501275A1 ES 8501275 A1 ES8501275 A1 ES 8501275A1 ES 525267 A ES525267 A ES 525267A ES 525267 A ES525267 A ES 525267A ES 8501275 A1 ES8501275 A1 ES 8501275A1
- Authority
- ES
- Spain
- Prior art keywords
- laser
- laser beam
- power level
- sequence
- measurement
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/20—Bonding
- B23K26/21—Bonding by welding
- B23K26/24—Seam welding
- B23K26/26—Seam welding of rectilinear seams
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/20—Bonding
- B23K26/21—Bonding by welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/20—Bonding
- B23K26/21—Bonding by welding
- B23K26/24—Seam welding
- B23K26/242—Fillet welding, i.e. involving a weld of substantially triangular cross section joining two parts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/20—Bonding
- B23K26/21—Bonding by welding
- B23K26/24—Seam welding
- B23K26/244—Overlap seam welding
-
- G—PHYSICS
- G21—NUCLEAR PHYSICS; NUCLEAR ENGINEERING
- G21C—NUCLEAR REACTORS
- G21C3/00—Reactor fuel elements and their assemblies; Selection of substances for use as reactor fuel elements
- G21C3/30—Assemblies of a number of fuel elements in the form of a rigid unit
- G21C3/32—Bundles of parallel pin-, rod-, or tube-shaped fuel elements
- G21C3/34—Spacer grids
- G21C3/3424—Fabrication of spacer grids
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E30/00—Energy generation of nuclear origin
- Y02E30/30—Nuclear fission reactors
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- High Energy & Nuclear Physics (AREA)
- Laser Beam Processing (AREA)
Abstract
APARATO PARA MECANIZAR CON RAYOS LASER UNA PIEZA TRABAJADA.COMPRENDE: UN LASER QUE TIENE UNA POTENCIA DE SALIDA CONTROLABLE; UN DISPOSITIVO OPTICO PARA DIRIGIR UN HAZ DE RAYOS LASER SOBRE LA PIEZA TRABAJADA; UN DISPOSITIVO DE MEDICION DE LA POTENCIA DEL LASER PARA MEDIR LA POTENCIA DEL HAZ Y UN CIRCUITO DE CONTROL CONECTADO AL DISPOSITIVO DE MEDICION Y AL LASER E INCLUYE UN CIRCUITO DE CALIBRACION QUE RESPONDE A LA POTENCIA MEDIDA DEL HAZ DE RAYOS LASER DIRIGIDO, PARA PROPORCIONAR UNA SEN/AL DE CONTROL, PARA LA PRIMERA MODALIDAD DE MECANIZACION QUE CONSISTE EN SOLDADURA POR PUNTOS DE LA PIEZA TRABAJADA Y PARA LA SEGUNDA MODALIDAD DE MECANIZACION QUE CONSISTE EN SOLDADURA POR COSTURA A LA PIEZA EN FUNCION DE LA POTENCIA MEDIDA Y DE UNOS PARAMETROS DE LASER COMO PARAMETROS INDICATIVOS DEL NIVEL DE POTENCIA DEL LASER, DE LA ANCHURA Y DE LA FRECUENCIA DE LOS IMPULSOS CONTROLADOS DE RAYOS LASER.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/414,272 US4545018A (en) | 1982-09-01 | 1982-09-01 | Calibration of automated laser machining apparatus |
Publications (2)
Publication Number | Publication Date |
---|---|
ES525267A0 ES525267A0 (es) | 1984-11-16 |
ES8501275A1 true ES8501275A1 (es) | 1984-11-16 |
Family
ID=23640729
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES525267A Expired ES8501275A1 (es) | 1982-09-01 | 1983-08-31 | Aparato para mecanizar con rayos laser una pieza trabajada |
Country Status (8)
Country | Link |
---|---|
US (1) | US4545018A (es) |
EP (1) | EP0102837B1 (es) |
JP (1) | JPS59156594A (es) |
KR (1) | KR910007154B1 (es) |
BE (1) | BE897649A (es) |
DE (1) | DE3378564D1 (es) |
ES (1) | ES8501275A1 (es) |
FR (1) | FR2532230B1 (es) |
Families Citing this family (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2536900B2 (ja) * | 1988-04-22 | 1996-09-25 | ファナック株式会社 | Ncレ―ザ装置 |
US4945489A (en) * | 1988-05-25 | 1990-07-31 | Robolase Systems, Inc. | Laser time-sharing system |
US5185734A (en) * | 1990-07-20 | 1993-02-09 | International Business Machines Corporation | Calibrating and power-protecting laser drive circuits |
US5464960A (en) * | 1993-01-12 | 1995-11-07 | Iatrotech, Inc. | Laser calibration device |
DE4414464C1 (de) * | 1994-04-26 | 1995-12-21 | Krupp Ag Hoesch Krupp | Verfahren zum Herstellen geschweißter Stahlblechplatinen |
JP3315556B2 (ja) * | 1994-04-27 | 2002-08-19 | 三菱電機株式会社 | レーザ加工装置 |
US5621737A (en) * | 1994-07-18 | 1997-04-15 | Motorola, Inc. | Communication system with link margin control and method |
US6081261A (en) * | 1995-11-01 | 2000-06-27 | Ricoh Corporation | Manual entry interactive paper and electronic document handling and processing system |
US6188392B1 (en) | 1997-06-30 | 2001-02-13 | Intel Corporation | Electronic pen device |
US6201903B1 (en) | 1997-09-30 | 2001-03-13 | Ricoh Company, Ltd. | Method and apparatus for pen-based faxing |
US6181329B1 (en) | 1997-12-23 | 2001-01-30 | Ricoh Company, Ltd. | Method and apparatus for tracking a hand-held writing instrument with multiple sensors that are calibrated by placing the writing instrument in predetermined positions with respect to the writing surface |
US6472671B1 (en) * | 2000-02-09 | 2002-10-29 | Jean I. Montagu | Quantified fluorescence microscopy |
US6794424B2 (en) * | 2001-12-04 | 2004-09-21 | Agilent Technologies, Inc. | Devices for calibrating optical scanners and methods of using the same |
US7534561B2 (en) | 2003-04-02 | 2009-05-19 | Agilent Technologies, Inc. | Nucleic acid array in situ fabrication methods and arrays produced using the same |
US7770454B2 (en) * | 2003-09-26 | 2010-08-10 | Lsp Technologies, Inc. | Laser system and method for non-destructive bond detection and evaluation |
US6977356B2 (en) * | 2003-09-30 | 2005-12-20 | United Technologies Corporation | Stereovision guided laser drilling system |
US7242775B2 (en) * | 2003-11-12 | 2007-07-10 | Magiq Technologies, Inc. | Optical pulse calibration for quantum key distribution |
US7820936B2 (en) * | 2004-07-02 | 2010-10-26 | Boston Scientific Scimed, Inc. | Method and apparatus for controlling and adjusting the intensity profile of a laser beam employed in a laser welder for welding polymeric and metallic components |
US8156811B2 (en) * | 2004-09-15 | 2012-04-17 | Lsp Technologies, Inc. | Apparatus and method for non-destructive testing |
US8132460B1 (en) | 2004-09-27 | 2012-03-13 | Lsp Technologies, Inc. | Laser induced bond delamination |
GB0601222D0 (en) * | 2006-01-21 | 2006-03-01 | En Ltd | Improvements in and relating to intense pulsed light devices |
US7676061B2 (en) * | 2006-05-02 | 2010-03-09 | Telesis Technologies, Inc. | Laser safety system |
US7856737B2 (en) * | 2007-08-28 | 2010-12-28 | Mathews Company | Apparatus and method for reducing a moisture content of an agricultural product |
US7509876B1 (en) | 2007-10-17 | 2009-03-31 | Lsp Technologies, Inc. | Laser bond inspection using annular laser beam |
US8374818B2 (en) * | 2008-12-19 | 2013-02-12 | Affymetrix, Inc. | System, method and apparatus for calibrating inspection tools |
US8489222B2 (en) * | 2010-05-20 | 2013-07-16 | Korea Nuclear Fuel Co., Ltd. | Machine and method for grinding spacer grid of nuclear fuel assembly |
US8359924B1 (en) | 2010-07-01 | 2013-01-29 | The Boeing Company | Bond interface testing |
US10213861B2 (en) * | 2013-03-11 | 2019-02-26 | Illinois Tool Works Inc. | Automated system for machine set-up of welding power sources and welding systems |
TWI562046B (en) * | 2015-06-25 | 2016-12-11 | Wistron Corp | Optical touch apparatus and width detecting method thereof |
FR3077749B1 (fr) * | 2018-02-14 | 2020-01-24 | Psa Automobiles Sa | Dispositif pour la mesure de puissance d’un faisceau laser d’une tete de soudage laser par tiret |
FR3112708A1 (fr) | 2020-07-23 | 2022-01-28 | Psa Automobiles Sa | Table de service pour un dispositif laser d’une installation de soudage laser et/ou de soudobrasage laser |
CN113953661B (zh) * | 2021-09-18 | 2022-03-15 | 四川国芯通智能科技有限公司 | 一种激光补焊机及其补焊方法 |
CN117548825B (zh) * | 2024-01-11 | 2024-03-15 | 山东省建设建工(集团)有限责任公司 | 一种建筑钢材加工设备 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1565007A1 (de) * | 1965-05-25 | 1970-05-21 | Philips Patentverwaltung | Verfahren und Geraet zur thermischen Materialbearbeitung mittels Laserstrahlen |
US3803379A (en) * | 1971-04-13 | 1974-04-09 | Systomation Inc | Laser working machine with workpiece support |
JPS5511436B2 (es) * | 1972-10-27 | 1980-03-25 | ||
JPS50110950A (es) * | 1974-02-12 | 1975-09-01 | ||
US4083629A (en) * | 1976-11-29 | 1978-04-11 | Gte Laboratories Incorporated | Beam splitting system for a welding laser |
US4327277A (en) * | 1978-08-24 | 1982-04-27 | Raytheon Company | Method for laser soldering |
US4201905A (en) * | 1978-08-29 | 1980-05-06 | Houdaille Industries, Inc. | Laser cutting head attachment for punch presses |
US4223202A (en) * | 1978-12-14 | 1980-09-16 | United Technologies Corporation | Apparatus and method for welding boat subassemblies utilizing laser radiation |
US4223201A (en) * | 1978-12-14 | 1980-09-16 | United Technologies Corporation | Laser welding apparatus for shipyard panel shops |
-
1982
- 1982-09-01 US US06/414,272 patent/US4545018A/en not_active Expired - Fee Related
-
1983
- 1983-08-30 FR FR8313903A patent/FR2532230B1/fr not_active Expired
- 1983-08-31 ES ES525267A patent/ES8501275A1/es not_active Expired
- 1983-08-31 BE BE211448A patent/BE897649A/fr unknown
- 1983-09-01 KR KR1019830004115A patent/KR910007154B1/ko not_active IP Right Cessation
- 1983-09-01 DE DE8383305083T patent/DE3378564D1/de not_active Expired
- 1983-09-01 EP EP83305083A patent/EP0102837B1/en not_active Expired
- 1983-09-01 JP JP58159159A patent/JPS59156594A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
ES525267A0 (es) | 1984-11-16 |
FR2532230B1 (fr) | 1986-12-26 |
EP0102837A2 (en) | 1984-03-14 |
KR910007154B1 (ko) | 1991-09-18 |
EP0102837A3 (en) | 1986-01-29 |
JPS59156594A (ja) | 1984-09-05 |
KR840006140A (ko) | 1984-11-22 |
JPH029548B2 (es) | 1990-03-02 |
EP0102837B1 (en) | 1988-11-30 |
US4545018A (en) | 1985-10-01 |
DE3378564D1 (en) | 1989-01-05 |
FR2532230A1 (fr) | 1984-03-02 |
BE897649A (fr) | 1984-02-29 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
ES8501275A1 (es) | Aparato para mecanizar con rayos laser una pieza trabajada | |
DE69116219T2 (de) | Zielbereichprofilierung von optischen Oberflächen durch Ecimer Laser Lichtabschmelzung | |
DE3061984D1 (en) | Method and device for controlling the impact of a monochromatic light beam emitted by a laser source on a target | |
BR8907546A (pt) | Processo e dispositivo para a usinagem de pecas de trabalho com radiacao a laser | |
DK674488D0 (da) | Apparat til kortlaegning af straalingsintensiteten i en laserstraale med hoej energi | |
ES8501274A1 (es) | Aparato de soldadura por laser | |
ATE253880T1 (de) | Verbesserter ophthalmochirurgischer laser | |
ATE441832T1 (de) | Verfahren und apparat zur formabweichungsmessung von bearbeiteten oberflächen | |
DE3782929D1 (de) | Bearbeitungsverfahren mittels laserstrahles. | |
DE69006304D1 (de) | Hochleistungslaserquelle mit optischer Steuerung der Strahlabtastung. | |
JPS6487713A (en) | Laser control equipment | |
JPS5727087A (en) | Wavelength sweeping laser | |
JPS56169347A (en) | Laser scribing device | |
DE69506711T2 (de) | Verfahren und Vorrichtung zum Schneiden von Materialien mittels Laser | |
JP2542821B2 (ja) | レ−ザ加工装置 | |
JPS57159285A (en) | Laser working device | |
JPS5747592A (en) | Laser working device | |
JPS55148483A (en) | Semiconductor laser device | |
ES2079282A2 (es) | Dispositivo interferometrico y metodo para medir y para estabilizar la longitud de onda de diodo laser. | |
ATE93430T1 (de) | Verfahren zur regelung des temperaturverlaufes an loetstellen beim laserloeten. | |
JPS5248898A (en) | Method of trimming work with laser light | |
YU47937B (sh) | Postupak za održavanje unapred utvrdjenog pravca zraka u laserskom impulsnom predajniku i uredjaj kojim se ostvaruje taj postupak | |
DE69022265T2 (de) | Verfahren und Vorrichtung zur Verbesserung der Freigabereaktion einer Laserdiode in einem optischen Übertragungssystem. | |
JPS5713120A (en) | Annealing device of pipe or the like | |
JPS577986A (en) | Processing device with laser |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
FD1A | Patent lapsed |
Effective date: 19971001 |