JPS56166225A - Epoxy resin composition - Google Patents
Epoxy resin compositionInfo
- Publication number
- JPS56166225A JPS56166225A JP6955280A JP6955280A JPS56166225A JP S56166225 A JPS56166225 A JP S56166225A JP 6955280 A JP6955280 A JP 6955280A JP 6955280 A JP6955280 A JP 6955280A JP S56166225 A JPS56166225 A JP S56166225A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- low
- inorganic filler
- butadiene
- polyamine
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000203 mixture Substances 0.000 title abstract 5
- 239000003822 epoxy resin Substances 0.000 title abstract 3
- 229920000647 polyepoxide Polymers 0.000 title abstract 3
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 abstract 4
- 239000011256 inorganic filler Substances 0.000 abstract 3
- 229910003475 inorganic filler Inorganic materials 0.000 abstract 3
- 239000004593 Epoxy Substances 0.000 abstract 2
- 239000007795 chemical reaction product Substances 0.000 abstract 2
- 150000001875 compounds Chemical class 0.000 abstract 2
- 150000001990 dicarboxylic acid derivatives Chemical class 0.000 abstract 2
- 229920000768 polyamine Polymers 0.000 abstract 2
- 229920000642 polymer Polymers 0.000 abstract 2
- YBRVSVVVWCFQMG-UHFFFAOYSA-N 4,4'-diaminodiphenylmethane Chemical compound C1=CC(N)=CC=C1CC1=CC=C(N)C=C1 YBRVSVVVWCFQMG-UHFFFAOYSA-N 0.000 abstract 1
- 229930185605 Bisphenol Natural products 0.000 abstract 1
- 229920000459 Nitrile rubber Polymers 0.000 abstract 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 abstract 1
- NTXGQCSETZTARF-UHFFFAOYSA-N buta-1,3-diene;prop-2-enenitrile Chemical compound C=CC=C.C=CC#N NTXGQCSETZTARF-UHFFFAOYSA-N 0.000 abstract 1
- 230000009477 glass transition Effects 0.000 abstract 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 abstract 1
- 239000000843 powder Substances 0.000 abstract 1
- 239000000047 product Substances 0.000 abstract 1
- 239000010453 quartz Substances 0.000 abstract 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Organic Insulating Materials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6955280A JPS56166225A (en) | 1980-05-27 | 1980-05-27 | Epoxy resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6955280A JPS56166225A (en) | 1980-05-27 | 1980-05-27 | Epoxy resin composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS56166225A true JPS56166225A (en) | 1981-12-21 |
| JPS6136854B2 JPS6136854B2 (enrdf_load_stackoverflow) | 1986-08-20 |
Family
ID=13406000
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6955280A Granted JPS56166225A (en) | 1980-05-27 | 1980-05-27 | Epoxy resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS56166225A (enrdf_load_stackoverflow) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61260658A (ja) * | 1985-05-15 | 1986-11-18 | Toshiba Chem Corp | 樹脂封止型半導体装置 |
| JPS63128018A (ja) * | 1986-11-19 | 1988-05-31 | Sunstar Giken Kk | エポキシ樹脂組成物 |
| JPS63207816A (ja) * | 1987-02-23 | 1988-08-29 | Ube Ind Ltd | 半導体封止用エポキシ樹脂組成物 |
| US4937366A (en) * | 1989-02-13 | 1990-06-26 | Mobay Corporation | Process and compositions for production of moldings |
| US4963640A (en) * | 1989-02-13 | 1990-10-16 | Mobay Corporation | Process and compositions for production of moldings |
| JPH03236105A (ja) * | 1990-02-09 | 1991-10-22 | Kazuyoshi Uematsu | 導電体の絶縁，防錆用シーリング剤 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03119849U (enrdf_load_stackoverflow) * | 1990-03-19 | 1991-12-10 |
-
1980
- 1980-05-27 JP JP6955280A patent/JPS56166225A/ja active Granted
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61260658A (ja) * | 1985-05-15 | 1986-11-18 | Toshiba Chem Corp | 樹脂封止型半導体装置 |
| JPS63128018A (ja) * | 1986-11-19 | 1988-05-31 | Sunstar Giken Kk | エポキシ樹脂組成物 |
| JPS63207816A (ja) * | 1987-02-23 | 1988-08-29 | Ube Ind Ltd | 半導体封止用エポキシ樹脂組成物 |
| US4937366A (en) * | 1989-02-13 | 1990-06-26 | Mobay Corporation | Process and compositions for production of moldings |
| US4963640A (en) * | 1989-02-13 | 1990-10-16 | Mobay Corporation | Process and compositions for production of moldings |
| JPH03236105A (ja) * | 1990-02-09 | 1991-10-22 | Kazuyoshi Uematsu | 導電体の絶縁，防錆用シーリング剤 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6136854B2 (enrdf_load_stackoverflow) | 1986-08-20 |
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