JPS56163272A - Plasma etching device - Google Patents

Plasma etching device

Info

Publication number
JPS56163272A
JPS56163272A JP6589680A JP6589680A JPS56163272A JP S56163272 A JPS56163272 A JP S56163272A JP 6589680 A JP6589680 A JP 6589680A JP 6589680 A JP6589680 A JP 6589680A JP S56163272 A JPS56163272 A JP S56163272A
Authority
JP
Japan
Prior art keywords
electrode
electrodes
wafer
potential
areas
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6589680A
Other languages
English (en)
Inventor
Takuji Sugawara
Haruo Okano
Yasuhiro Horiike
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP6589680A priority Critical patent/JPS56163272A/ja
Publication of JPS56163272A publication Critical patent/JPS56163272A/ja
Pending legal-status Critical Current

Links

Landscapes

  • ing And Chemical Polishing (AREA)
  • Drying Of Semiconductors (AREA)
JP6589680A 1980-05-20 1980-05-20 Plasma etching device Pending JPS56163272A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6589680A JPS56163272A (en) 1980-05-20 1980-05-20 Plasma etching device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6589680A JPS56163272A (en) 1980-05-20 1980-05-20 Plasma etching device

Publications (1)

Publication Number Publication Date
JPS56163272A true JPS56163272A (en) 1981-12-15

Family

ID=13300180

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6589680A Pending JPS56163272A (en) 1980-05-20 1980-05-20 Plasma etching device

Country Status (1)

Country Link
JP (1) JPS56163272A (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS618927A (ja) * 1984-06-22 1986-01-16 インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション 半導体ウエハのプラズマ食刻装置
JPS63177520A (ja) * 1987-01-19 1988-07-21 Matsushita Electric Ind Co Ltd ドライエッチング方法
JPH08236509A (ja) * 1995-11-10 1996-09-13 Hitachi Ltd 基板処理方法および基板処理装置
JPH08236508A (ja) * 1995-11-10 1996-09-13 Hitachi Ltd 基板処理方法および基板処理装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS618927A (ja) * 1984-06-22 1986-01-16 インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション 半導体ウエハのプラズマ食刻装置
JPS63177520A (ja) * 1987-01-19 1988-07-21 Matsushita Electric Ind Co Ltd ドライエッチング方法
JPH08236509A (ja) * 1995-11-10 1996-09-13 Hitachi Ltd 基板処理方法および基板処理装置
JPH08236508A (ja) * 1995-11-10 1996-09-13 Hitachi Ltd 基板処理方法および基板処理装置

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