JPS56162846A - Ic gang bonding device - Google Patents
Ic gang bonding deviceInfo
- Publication number
- JPS56162846A JPS56162846A JP6685580A JP6685580A JPS56162846A JP S56162846 A JPS56162846 A JP S56162846A JP 6685580 A JP6685580 A JP 6685580A JP 6685580 A JP6685580 A JP 6685580A JP S56162846 A JPS56162846 A JP S56162846A
- Authority
- JP
- Japan
- Prior art keywords
- tape
- chip
- twisted
- pitch
- camera
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/79—Apparatus for Tape Automated Bonding [TAB]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01039—Yttrium [Y]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6685580A JPS56162846A (en) | 1980-05-20 | 1980-05-20 | Ic gang bonding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6685580A JPS56162846A (en) | 1980-05-20 | 1980-05-20 | Ic gang bonding device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS56162846A true JPS56162846A (en) | 1981-12-15 |
| JPH0130299B2 JPH0130299B2 (enrdf_load_stackoverflow) | 1989-06-19 |
Family
ID=13327876
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6685580A Granted JPS56162846A (en) | 1980-05-20 | 1980-05-20 | Ic gang bonding device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS56162846A (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58142534A (ja) * | 1982-02-19 | 1983-08-24 | Nec Corp | フイルムキヤリアボンデイング装置 |
| JPS58165335A (ja) * | 1982-03-26 | 1983-09-30 | Nec Corp | テ−プキヤリア方式による半導体装置の製造方法及びその製造装置 |
-
1980
- 1980-05-20 JP JP6685580A patent/JPS56162846A/ja active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58142534A (ja) * | 1982-02-19 | 1983-08-24 | Nec Corp | フイルムキヤリアボンデイング装置 |
| JPS58165335A (ja) * | 1982-03-26 | 1983-09-30 | Nec Corp | テ−プキヤリア方式による半導体装置の製造方法及びその製造装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0130299B2 (enrdf_load_stackoverflow) | 1989-06-19 |
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