JPS56152963A - Sputtering apparatus - Google Patents
Sputtering apparatusInfo
- Publication number
- JPS56152963A JPS56152963A JP5631680A JP5631680A JPS56152963A JP S56152963 A JPS56152963 A JP S56152963A JP 5631680 A JP5631680 A JP 5631680A JP 5631680 A JP5631680 A JP 5631680A JP S56152963 A JPS56152963 A JP S56152963A
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- substrate
- target
- electrodes
- sputtered film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Physical Vapour Deposition (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5631680A JPS56152963A (en) | 1980-04-30 | 1980-04-30 | Sputtering apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5631680A JPS56152963A (en) | 1980-04-30 | 1980-04-30 | Sputtering apparatus |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS56152963A true JPS56152963A (en) | 1981-11-26 |
JPS6328985B2 JPS6328985B2 (US20020051482A1-20020502-M00012.png) | 1988-06-10 |
Family
ID=13023744
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5631680A Granted JPS56152963A (en) | 1980-04-30 | 1980-04-30 | Sputtering apparatus |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56152963A (US20020051482A1-20020502-M00012.png) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61250166A (ja) * | 1985-04-26 | 1986-11-07 | Matsushita Electric Ind Co Ltd | 多成分薄膜の製造方法 |
JPH02274874A (ja) * | 1989-04-17 | 1990-11-09 | Materials Res Corp | 基板被覆堆積用スパッタ装置及び方法 |
US7837836B2 (en) * | 2004-02-12 | 2010-11-23 | Seagate Technology Llc | Method and apparatus for multi-stage sputter deposition of uniform thickness layers |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0399291U (US20020051482A1-20020502-M00012.png) * | 1990-01-31 | 1991-10-16 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5239851U (US20020051482A1-20020502-M00012.png) * | 1975-09-11 | 1977-03-22 | ||
JPS52111747U (US20020051482A1-20020502-M00012.png) * | 1976-02-20 | 1977-08-25 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5268244A (en) * | 1975-12-02 | 1977-06-06 | Senjin Kk | Method of mixing plastic materials |
-
1980
- 1980-04-30 JP JP5631680A patent/JPS56152963A/ja active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5239851U (US20020051482A1-20020502-M00012.png) * | 1975-09-11 | 1977-03-22 | ||
JPS52111747U (US20020051482A1-20020502-M00012.png) * | 1976-02-20 | 1977-08-25 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61250166A (ja) * | 1985-04-26 | 1986-11-07 | Matsushita Electric Ind Co Ltd | 多成分薄膜の製造方法 |
JPH02274874A (ja) * | 1989-04-17 | 1990-11-09 | Materials Res Corp | 基板被覆堆積用スパッタ装置及び方法 |
US7837836B2 (en) * | 2004-02-12 | 2010-11-23 | Seagate Technology Llc | Method and apparatus for multi-stage sputter deposition of uniform thickness layers |
Also Published As
Publication number | Publication date |
---|---|
JPS6328985B2 (US20020051482A1-20020502-M00012.png) | 1988-06-10 |
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