JPS6466981A - Target for sputtering deposition and manufacture thereof - Google Patents
Target for sputtering deposition and manufacture thereofInfo
- Publication number
- JPS6466981A JPS6466981A JP62223163A JP22316387A JPS6466981A JP S6466981 A JPS6466981 A JP S6466981A JP 62223163 A JP62223163 A JP 62223163A JP 22316387 A JP22316387 A JP 22316387A JP S6466981 A JPS6466981 A JP S6466981A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- target
- thin film
- uniform
- approximately
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Physical Vapour Deposition (AREA)
- Superconductor Devices And Manufacturing Methods Thereof (AREA)
- Superconductors And Manufacturing Methods Therefor (AREA)
Abstract
PURPOSE:To simplify a sputtering device and reduce its cost by performing lamination in sequence while changing target materials according to neighboring layers, performing physical deposition on a target substrate, and by forming target thin films consisting of a plurality of layers. CONSTITUTION:A target consisting of a BaO layer 2, a Y2O3 layer 3, and a Cu layer 4 is produced on a copper substrate 1 whose diameter is 6 inches by the ion plating method. As a result, a uniform three-layer target is produced in approximately 15 minutes, where each layer is 1mum in thickness. The deposition rate at this time is 5 to 60Angstrom /s. By using the three-layer target thus obtained, a thin film is formed by magnetron sputtering, where each layer is approximately 500Angstrom in thickness. The RF power can be increased to 0.7kW max. through each layer under sputtering conditions with a degree of vacuum of 5X10<-3> torr and Ar flow of 70ccm. The surface of formed thin film is uniform. The used target has sputter mark in circular form but thin film has not been peeled off on the substrates 1 and 2 and between each layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62223163A JPS6466981A (en) | 1987-09-08 | 1987-09-08 | Target for sputtering deposition and manufacture thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62223163A JPS6466981A (en) | 1987-09-08 | 1987-09-08 | Target for sputtering deposition and manufacture thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6466981A true JPS6466981A (en) | 1989-03-13 |
Family
ID=16793784
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62223163A Pending JPS6466981A (en) | 1987-09-08 | 1987-09-08 | Target for sputtering deposition and manufacture thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6466981A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6277253B1 (en) * | 1999-10-06 | 2001-08-21 | Applied Materials, Inc. | External coating of tungsten or tantalum or other refractory metal on IMP coils |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6082664A (en) * | 1983-10-12 | 1985-05-10 | Citizen Watch Co Ltd | Sputtering device |
-
1987
- 1987-09-08 JP JP62223163A patent/JPS6466981A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6082664A (en) * | 1983-10-12 | 1985-05-10 | Citizen Watch Co Ltd | Sputtering device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6277253B1 (en) * | 1999-10-06 | 2001-08-21 | Applied Materials, Inc. | External coating of tungsten or tantalum or other refractory metal on IMP coils |
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