JPS6468463A - Method for vapor deposition by sputtering - Google Patents

Method for vapor deposition by sputtering

Info

Publication number
JPS6468463A
JPS6468463A JP62223161A JP22316187A JPS6468463A JP S6468463 A JPS6468463 A JP S6468463A JP 62223161 A JP62223161 A JP 62223161A JP 22316187 A JP22316187 A JP 22316187A JP S6468463 A JPS6468463 A JP S6468463A
Authority
JP
Japan
Prior art keywords
substrate
vapor deposition
thin films
thicknesses
order
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62223161A
Other languages
Japanese (ja)
Inventor
Yasuo Takagi
Wataru Ito
Shigeru Takebayashi
Shunpei Miyajima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Steel Corp
Original Assignee
Nippon Steel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel Corp filed Critical Nippon Steel Corp
Priority to JP62223161A priority Critical patent/JPS6468463A/en
Publication of JPS6468463A publication Critical patent/JPS6468463A/en
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy

Abstract

PURPOSE:To easily form plural sputtered thin films on a substrate for vapor deposition at exact thicknesses by using a target on which materials for thin films are deposited by physical evaporation to required thicknesses in order reverse from order of the sputtered thin films at the time of forming the plural layers of the thin films on the substrate of a method for vapor deposition by sputtering. CONSTITUTION:The target constituted by depositing BaO 2, Y2O3 3 and Cu 4 in this order, which is reverse from order of the materials deposited by evaporation on the substrate 6 for vapor deposition consisting of ceramics such as glass, alumina or berylia to the prescribed thicknesses on the surface of the substrate 1 made of a Cu-base alloy by the physical method such as vapor deposition by sputtering or ion plating is used as the target to be used for forming the thin films of Cu 7, Y2O3 8, and BaO 9 at the respective specific thicknesses on the surface of the above-mentioned substrate 6. The thin vapor deposited films of the plural metals or compds. are formed at the exact thicknesses on the substrate 6.
JP62223161A 1987-09-08 1987-09-08 Method for vapor deposition by sputtering Pending JPS6468463A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62223161A JPS6468463A (en) 1987-09-08 1987-09-08 Method for vapor deposition by sputtering

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62223161A JPS6468463A (en) 1987-09-08 1987-09-08 Method for vapor deposition by sputtering

Publications (1)

Publication Number Publication Date
JPS6468463A true JPS6468463A (en) 1989-03-14

Family

ID=16793750

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62223161A Pending JPS6468463A (en) 1987-09-08 1987-09-08 Method for vapor deposition by sputtering

Country Status (1)

Country Link
JP (1) JPS6468463A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5118661A (en) * 1989-11-21 1992-06-02 Nec Corporation Sputtering target for use in fabricating integrated circuit device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5118661A (en) * 1989-11-21 1992-06-02 Nec Corporation Sputtering target for use in fabricating integrated circuit device

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