JPS56152315A - Elastic surface wave filter - Google Patents

Elastic surface wave filter

Info

Publication number
JPS56152315A
JPS56152315A JP5533180A JP5533180A JPS56152315A JP S56152315 A JPS56152315 A JP S56152315A JP 5533180 A JP5533180 A JP 5533180A JP 5533180 A JP5533180 A JP 5533180A JP S56152315 A JPS56152315 A JP S56152315A
Authority
JP
Japan
Prior art keywords
substrate
adhesive
stem
wave filter
litao3
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5533180A
Other languages
Japanese (ja)
Inventor
Takuji Yamada
Shizuo Tokunaga
Shigeyuki Kita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP5533180A priority Critical patent/JPS56152315A/en
Publication of JPS56152315A publication Critical patent/JPS56152315A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02818—Means for compensation or elimination of undesirable effects
    • H03H9/02866—Means for compensation or elimination of undesirable effects of bulk wave excitation and reflections
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02543—Characteristics of substrate, e.g. cutting angles
    • H03H9/02574—Characteristics of substrate, e.g. cutting angles of combined substrates, multilayered substrates, piezoelectrical layers on not-piezoelectrical substrate
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02614—Treatment of substrates, e.g. curved, spherical, cylindrical substrates ensuring closed round-about circuits for the acoustical waves
    • H03H9/02622—Treatment of substrates, e.g. curved, spherical, cylindrical substrates ensuring closed round-about circuits for the acoustical waves of the surface, including back surface
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/058—Holders; Supports for surface acoustic wave devices
    • H03H9/0585—Holders; Supports for surface acoustic wave devices consisting of an adhesive layer

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)

Abstract

PURPOSE:To attenuate the bulk wave up to the level where it does not cause the defect of the frequency characteristic, by mixing high-permittivity substance powder equal to the piezoelectric substrate with the adhesive by which the piezoelectric substrate is caused to adhere onto the stem. CONSTITUTION:Input electrode 12 and output electrode 13 are formed as prescribed on the surface of piezoelectric substrate 11 consisting of LiTaO3, and the reverse face of substrate 11 is caused to face to stem 14, and substrate 11 is bound to a prescribed position on the surface of stem 14 by adhesion through adhesive 15. In this adhesive powder 16 of LiTaO3 which is the same material as substrate 11 is mixed in volume ratio 1:1. As a result, the acoustic impedance of the adhesive layer can be made equal to that of the substrate approximately, and the bulk wave propagated through the reverse face of the substrate is attenuated up to the level, where it does not cause the defect of the frequency characteristic, when the elastic surface wave filter is operated.
JP5533180A 1980-04-28 1980-04-28 Elastic surface wave filter Pending JPS56152315A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5533180A JPS56152315A (en) 1980-04-28 1980-04-28 Elastic surface wave filter

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5533180A JPS56152315A (en) 1980-04-28 1980-04-28 Elastic surface wave filter

Publications (1)

Publication Number Publication Date
JPS56152315A true JPS56152315A (en) 1981-11-25

Family

ID=12995547

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5533180A Pending JPS56152315A (en) 1980-04-28 1980-04-28 Elastic surface wave filter

Country Status (1)

Country Link
JP (1) JPS56152315A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58200621A (en) * 1982-05-19 1983-11-22 Hitachi Ltd Surface acoustic wave device
EP1215255A2 (en) * 2000-12-12 2002-06-19 Ngk Insulators, Ltd. A method for producing bonded articles, bonded articles and bonding agents
WO2005048449A2 (en) * 2003-11-04 2005-05-26 Epcos Ag Saw component comprising an adhesive and use thereof
KR100671031B1 (en) 2004-07-09 2007-01-18 사공건 Fluid level measuring system using acoustic impedance matching

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58200621A (en) * 1982-05-19 1983-11-22 Hitachi Ltd Surface acoustic wave device
EP1215255A2 (en) * 2000-12-12 2002-06-19 Ngk Insulators, Ltd. A method for producing bonded articles, bonded articles and bonding agents
JP2002180014A (en) * 2000-12-12 2002-06-26 Ngk Insulators Ltd Method for producing bonded body, bonded body and adhesive
US6824897B2 (en) * 2000-12-12 2004-11-30 Ngk Insulators, Ltd. Method for producing bonded articles, bonded articles and bonding agents
EP1215255A3 (en) * 2000-12-12 2005-03-16 Ngk Insulators, Ltd. A method for producing bonded articles, bonded articles and bonding agents
JP4698018B2 (en) * 2000-12-12 2011-06-08 日本碍子株式会社 Adhesive manufacturing method and adhesive
WO2005048449A2 (en) * 2003-11-04 2005-05-26 Epcos Ag Saw component comprising an adhesive and use thereof
WO2005048449A3 (en) * 2003-11-04 2006-01-19 Epcos Ag Saw component comprising an adhesive and use thereof
US7218189B2 (en) * 2003-11-04 2007-05-15 Epcos Ag SAW component with adhesive location and use thereof
DE10351429B4 (en) * 2003-11-04 2013-10-31 Epcos Ag SAW device with splice and use for it
KR100671031B1 (en) 2004-07-09 2007-01-18 사공건 Fluid level measuring system using acoustic impedance matching

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