JPS57155825A - Surface wave device - Google Patents

Surface wave device

Info

Publication number
JPS57155825A
JPS57155825A JP4133981A JP4133981A JPS57155825A JP S57155825 A JPS57155825 A JP S57155825A JP 4133981 A JP4133981 A JP 4133981A JP 4133981 A JP4133981 A JP 4133981A JP S57155825 A JPS57155825 A JP S57155825A
Authority
JP
Japan
Prior art keywords
insulating film
electrode part
piezoelectric substrate
wave
wave device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4133981A
Other languages
Japanese (ja)
Inventor
Tsutomu Nishikawa
Atsushi Tani
Shoichi Kishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP4133981A priority Critical patent/JPS57155825A/en
Publication of JPS57155825A publication Critical patent/JPS57155825A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02Details
    • H03H9/02535Details of surface acoustic wave devices
    • H03H9/02614Treatment of substrates, e.g. curved, spherical, cylindrical substrates ensuring closed round-about circuits for the acoustical waves
    • H03H9/02622Treatment of substrates, e.g. curved, spherical, cylindrical substrates ensuring closed round-about circuits for the acoustical waves of the surface, including back surface
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02Details
    • H03H9/02535Details of surface acoustic wave devices
    • H03H9/02818Means for compensation or elimination of undesirable effects

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)

Abstract

PURPOSE:To achieve low loss easily and economically, by attaching an insulating film having a smaller lateral wave speed than that of a piezoelectric substrate on the non-electrode part of a transducer, in a rub-wave type surface wave device. CONSTITUTION:Input and output transducers 20 consisting of cross finger electrodes are provided on the surface of a piezoelectric substrate to constitute a surface wave device transmitting and receiving rub-wave type surface waves, and an insulating film 30 having smaller transversal wave speed than that of the piezoelectric substrate is attached to a non-electrode part between cross finger electrodes of the transducer 20. The same insulating film 30 is attached on a transmission path between the input and output transducers on the non-electrode part of the transducers 20, allowing to make further lower loss.
JP4133981A 1981-03-20 1981-03-20 Surface wave device Pending JPS57155825A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4133981A JPS57155825A (en) 1981-03-20 1981-03-20 Surface wave device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4133981A JPS57155825A (en) 1981-03-20 1981-03-20 Surface wave device

Publications (1)

Publication Number Publication Date
JPS57155825A true JPS57155825A (en) 1982-09-27

Family

ID=12605755

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4133981A Pending JPS57155825A (en) 1981-03-20 1981-03-20 Surface wave device

Country Status (1)

Country Link
JP (1) JPS57155825A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59156013A (en) * 1983-02-25 1984-09-05 Hiroshi Shimizu High coupling elastic surface wave piezoelectric substrate
WO2018151146A1 (en) * 2017-02-16 2018-08-23 株式会社弾性波デバイスラボ Acoustic wave element and method for manufacturing same

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59156013A (en) * 1983-02-25 1984-09-05 Hiroshi Shimizu High coupling elastic surface wave piezoelectric substrate
WO2018151146A1 (en) * 2017-02-16 2018-08-23 株式会社弾性波デバイスラボ Acoustic wave element and method for manufacturing same
JPWO2018151146A1 (en) * 2017-02-16 2019-06-27 株式会社弾性波デバイスラボ Elastic wave device and method of manufacturing the same
US11336255B2 (en) 2017-02-16 2022-05-17 Acoustic Wave Device Labo., Ltd. Acoustic wave element and method for manufacturing same

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