JPS56152316A - Elastic surface wave filter - Google Patents

Elastic surface wave filter

Info

Publication number
JPS56152316A
JPS56152316A JP5533280A JP5533280A JPS56152316A JP S56152316 A JPS56152316 A JP S56152316A JP 5533280 A JP5533280 A JP 5533280A JP 5533280 A JP5533280 A JP 5533280A JP S56152316 A JPS56152316 A JP S56152316A
Authority
JP
Japan
Prior art keywords
substrate
powder
layer
main components
piezoelectric substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5533280A
Other languages
Japanese (ja)
Inventor
Shizuo Tokunaga
Takuji Yamada
Shigeyuki Kita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP5533280A priority Critical patent/JPS56152316A/en
Publication of JPS56152316A publication Critical patent/JPS56152316A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02818—Means for compensation or elimination of undesirable effects
    • H03H9/02842—Means for compensation or elimination of undesirable effects of reflections
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02543—Characteristics of substrate, e.g. cutting angles
    • H03H9/02574—Characteristics of substrate, e.g. cutting angles of combined substrates, multilayered substrates, piezoelectrical layers on not-piezoelectrical substrate
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02614—Treatment of substrates, e.g. curved, spherical, cylindrical substrates ensuring closed round-about circuits for the acoustical waves
    • H03H9/02622—Treatment of substrates, e.g. curved, spherical, cylindrical substrates ensuring closed round-about circuits for the acoustical waves of the surface, including back surface
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02818—Means for compensation or elimination of undesirable effects
    • H03H9/02866—Means for compensation or elimination of undesirable effects of bulk wave excitation and reflections
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/058—Holders; Supports for surface acoustic wave devices
    • H03H9/0585—Holders; Supports for surface acoustic wave devices consisting of an adhesive layer
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
    • H03H9/1071—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the SAW device

Abstract

PURPOSE:To suppress the bulk wave to improve the characteristic, by forming a layer, where high-permittivity substance powder equal to the piezoelectric substrate is main components, on the reverse face of the piezoelectric substrate. CONSTITUTION:Input electrode 12, output electrode 13, and sound absorbing layers 14 and 15 are formed as prescribed on the surface of piezoelectric substrate 11 consisting of LiTaO3. The paste where a binder is added to LiTaO3 powder (>=60% content) is coated on the reverse face of this substrate to form layer 16 with piezoelectric substrate powder as main components. The piezoelectric substrate formed in this manner is caused to adhere to stem 18 through adhesive 17. As a result, the layer with substrate powder as main components is formed just under the substrate, and the acoustic impedance in the substrate matches that in the adhered part approximately; and further, the effect of bulk wave absorption is improved greatly due to multilayers of the layer with substrate powder as main components and the adhesive layer.
JP5533280A 1980-04-28 1980-04-28 Elastic surface wave filter Pending JPS56152316A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5533280A JPS56152316A (en) 1980-04-28 1980-04-28 Elastic surface wave filter

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5533280A JPS56152316A (en) 1980-04-28 1980-04-28 Elastic surface wave filter

Publications (1)

Publication Number Publication Date
JPS56152316A true JPS56152316A (en) 1981-11-25

Family

ID=12995575

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5533280A Pending JPS56152316A (en) 1980-04-28 1980-04-28 Elastic surface wave filter

Country Status (1)

Country Link
JP (1) JPS56152316A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005048449A2 (en) * 2003-11-04 2005-05-26 Epcos Ag Saw component comprising an adhesive and use thereof
US8035464B1 (en) * 2009-03-05 2011-10-11 Triquint Semiconductor, Inc. Bonded wafer SAW filters and methods

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005048449A2 (en) * 2003-11-04 2005-05-26 Epcos Ag Saw component comprising an adhesive and use thereof
WO2005048449A3 (en) * 2003-11-04 2006-01-19 Epcos Ag Saw component comprising an adhesive and use thereof
JP2007510339A (en) * 2003-11-04 2007-04-19 エプコス　アクチエンゲゼルシャフト SAW device with an adhesive point and use thereof
US7218189B2 (en) * 2003-11-04 2007-05-15 Epcos Ag SAW component with adhesive location and use thereof
JP4705580B2 (en) * 2003-11-04 2011-06-22 エプコス アクチエンゲゼルシャフト SAW device with an adhesive point and use thereof
US8035464B1 (en) * 2009-03-05 2011-10-11 Triquint Semiconductor, Inc. Bonded wafer SAW filters and methods

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