JPS56150841A - Cooling material for electric parts - Google Patents

Cooling material for electric parts

Info

Publication number
JPS56150841A
JPS56150841A JP5293180A JP5293180A JPS56150841A JP S56150841 A JPS56150841 A JP S56150841A JP 5293180 A JP5293180 A JP 5293180A JP 5293180 A JP5293180 A JP 5293180A JP S56150841 A JPS56150841 A JP S56150841A
Authority
JP
Japan
Prior art keywords
passage
corrosion
metal
cooling material
electrolysis
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5293180A
Other languages
Japanese (ja)
Inventor
Hideki Takahashi
Kazuo Kobayashi
Shigeo Kobayashi
Takashi Kano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP5293180A priority Critical patent/JPS56150841A/en
Publication of JPS56150841A publication Critical patent/JPS56150841A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

PURPOSE:To sharply reduce the amount of corrosion caused by electrolysis by a method wherein the portion equivalent to the inlet and outlet of a passage is constituted by a metal. CONSTITUTION:The press-pieces 18 and 19, consisting of the metal having a corrosion-resisting property, are fixed on both ends of the cooling material 16 which has a plurality of the penetrated holes 17 to be used for the passage. Then, curved passages 20A-20C of the passage are provided on the press-pieces 18 and 19. Pertaining to the passage in the dotted frames 18A and 18B, an l/d>=1 relations are given between a passage inside diameter d and a passage length l. Accordingly, as the portion equivalent to the inlet and outlet of the passage is made of a corrosion-resisting metal, the amount of corrosion generated by the electrolysis can be greatly reduced even when an electric current is flown at this section.
JP5293180A 1980-04-23 1980-04-23 Cooling material for electric parts Pending JPS56150841A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5293180A JPS56150841A (en) 1980-04-23 1980-04-23 Cooling material for electric parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5293180A JPS56150841A (en) 1980-04-23 1980-04-23 Cooling material for electric parts

Publications (1)

Publication Number Publication Date
JPS56150841A true JPS56150841A (en) 1981-11-21

Family

ID=12928581

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5293180A Pending JPS56150841A (en) 1980-04-23 1980-04-23 Cooling material for electric parts

Country Status (1)

Country Link
JP (1) JPS56150841A (en)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60250657A (en) * 1984-05-11 1985-12-11 エル．セー．セー．‐セー．イー．セー．ウー．コンパニー・ユーロペエンヌ・ドウ・コンポーザン・エレクトロツク Housing with capsule for dispersing heat generated by electric circuit
JPS6426894U (en) * 1987-08-11 1989-02-15
JPH01286350A (en) * 1988-05-12 1989-11-17 Nec Corp Cooling device of integrated circuit
JPH0298997A (en) * 1988-07-25 1990-04-11 Minnesota Mining & Mfg Co <3M> Product having main part having surrounded flow path and its manufacture
US5177667A (en) * 1991-10-25 1993-01-05 International Business Machines Corporation Thermal conduction module with integral impingement cooling
US5239200A (en) * 1991-08-21 1993-08-24 International Business Machines Corporation Apparatus for cooling integrated circuit chips
JPH0787274B2 (en) * 1990-03-30 1995-09-20 ラインメタル ゲゼルシャフト ミット ベシュレンクテル ハフツング Circuit board for power electronics
JP2001237357A (en) * 2000-02-24 2001-08-31 Sts Kk Heat transfer device with meandering path
JP2014079117A (en) * 2012-10-11 2014-05-01 Mitsubishi Electric Corp On-vehicle power conversion apparatus
JP7184229B1 (en) * 2021-02-04 2022-12-06 大日本印刷株式会社 Heat exchanger

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60250657A (en) * 1984-05-11 1985-12-11 エル．セー．セー．‐セー．イー．セー．ウー．コンパニー・ユーロペエンヌ・ドウ・コンポーザン・エレクトロツク Housing with capsule for dispersing heat generated by electric circuit
JPS6426894U (en) * 1987-08-11 1989-02-15
JPH01286350A (en) * 1988-05-12 1989-11-17 Nec Corp Cooling device of integrated circuit
JPH0298997A (en) * 1988-07-25 1990-04-11 Minnesota Mining & Mfg Co <3M> Product having main part having surrounded flow path and its manufacture
JPH0787274B2 (en) * 1990-03-30 1995-09-20 ラインメタル ゲゼルシャフト ミット ベシュレンクテル ハフツング Circuit board for power electronics
US5239200A (en) * 1991-08-21 1993-08-24 International Business Machines Corporation Apparatus for cooling integrated circuit chips
US5177667A (en) * 1991-10-25 1993-01-05 International Business Machines Corporation Thermal conduction module with integral impingement cooling
JP2001237357A (en) * 2000-02-24 2001-08-31 Sts Kk Heat transfer device with meandering path
JP2014079117A (en) * 2012-10-11 2014-05-01 Mitsubishi Electric Corp On-vehicle power conversion apparatus
JP7184229B1 (en) * 2021-02-04 2022-12-06 大日本印刷株式会社 Heat exchanger

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