JP2014079117A - On-vehicle power conversion apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an on-vehicle power conversion apparatus which expands an area of a heat radiation surface capable of cooling a heat generation electronic component while reducing the manufacturing costs and avoiding the deterioration of the cooling performance and the mountability.SOLUTION: An on-vehicle power conversion apparatus 1 according to this invention includes: multiple through holes 8, 9 which are provided below a switching element 4 placed on a placement surface 7 while penetrating through the housing 2, opens on a side wall surface 11 of the housing 2, and are arranged in a direction that the placement surface 7 spreads; and a first water passage lid 10 which connects an opening of the through hole 8 and an opening of the through hole 9 which open on the same side wall surface 11. A refrigerant passage 15 is formed by the through holes 8, 9, the first water passage lid 10, and the side wall surface 11 covered by the first water passage lid 10. A refrigerant for cooling the switching element 4 flows through the refrigerant passage 15.

Description

  The present invention relates to an in-vehicle power conversion device such as a DCDC converter device and an inverter device.

  Vehicles such as plug-in hybrid vehicles and electric vehicles are equipped with power conversion devices such as DCDC converter devices and inverter devices. Since a large current flows in the power conversion circuits included in these power conversion devices, the electronic components constituting the circuit, for example, the switching elements become very high temperature, and a water-cooled cooling method is usually employed as a heat dissipation measure. Therefore, the device is easy to enlarge. On the other hand, many devices are mounted in the vicinity of the power conversion device, and the power conversion device mounted on the vehicle has large restrictions in both shape and size.

A conventional power conversion device includes one main flow path that passes through a pedestal formed integrally with a housing in a straight line and a pair of sub flow paths that intersect with the main flow path, and has openings at both ends of the main flow path. In addition, a lid is attached to each of the pair of sub-flow passages, which serve as an inlet and an outlet for the refrigerant, respectively, and are connected to a hose that supplies the refrigerant from the pump. On the main surface of the pedestal portion, an electronic component having a large heat generation density (unit area, heat generation amount per unit time: unit W / m ² ), for example, a switching element is placed, and is constituted by a main flow path and a sub flow path. Cooled by the refrigerant flowing through the refrigerant flow path. In this power conversion device, the casing, the pedestal portion, and the refrigerant flow path are integrally manufactured by using casting. (For example, Patent Document 1)

  In another conventional power conversion device, an electronic component is placed on a pedestal portion in a housing, a recess is provided on the back surface of the pedestal portion of the housing, and the recess is covered with a water channel cover, thereby placing the electronic component on the pedestal portion. A refrigerant flow path through which a refrigerant for cooling the placed electronic component flows is formed. The water channel cover is formed with a refrigerant inlet and outlet, and pipes connected to a hose are attached to the inlet and outlet, and the water channel cover is fixed to the casing with bolts. (For example, Patent Document 2)

JP 2011-234477 A Japanese Patent Application Laid-Open No. 2004-297887

  In the two power converters taken up above, an exothermic electronic component is placed on the pedestal portion main surface, and cooled by the refrigerant flowing in the refrigerant flow path below the pedestal portion. On the other hand, power converters in recent years have increased in output, and the number of electronic components having a large heat generation density tends to increase. In addition, the heat generation density of the electronic components is also increased, and there is a tendency to place the electronic components further apart from each other in order not to cause thermal interference with each other. In response to these trends, the power conversion device increases the main surface area of the pedestal portion provided with the refrigerant flow path below, that is, the mounting surface of the electronic component that can cool the electronic component, that is, the area of the heat dissipation surface ( Hereinafter, it is necessary to increase the heat radiation area.

  Therefore, in the power conversion device described in Patent Document 1, it is conceivable to extend the pedestal in the direction in which the refrigerant flowing through the main flow path (hereinafter abbreviated as the main flow direction) in order to expand the heat radiation area. Along with this, casting must be performed with a mold so that the main flow path penetrating the pedestal also extends. At the time of casting, the columnar portion forming the main flow path of the mold is weaker than the pressure of molten metal (hereinafter, abbreviated as casting pressure) flowing into the mold as compared with other portions of the mold, and may be deformed.

  This columnar part greatly affects the life of the mold because the mold needs to be remanufactured when the amount of deformation increases due to casting pressure. The longer the columnar portion, the larger the deformation amount. Therefore, the main flow path can be formed even with one columnar portion, but in order to extend the life of the mold, a pair of opposing columnar portions are combined to form one A main flow path is formed. (See FIG. 2 of Patent Document 1)

  However, when the main channel is extended, the length of each columnar portion becomes longer in proportion to the length of the main channel, even if the main channel is formed by a pair of opposing columnar portions. If any of the columnar parts is deformed by the pressure during casting, it is necessary to remanufacture the mold. In other words, extending the main flow path has a problem that it shortens the life of the mold.

  In order to expand the heat dissipation area, the pedestal is enlarged in a direction perpendicular to the mainstream direction (hereinafter, abbreviated as mainstream orthogonal direction) when the pedestal is viewed from above, and the electronic components are arranged in parallel to the mainstream direction. It can be considered to be placed. When placed in parallel, it is necessary to place them apart from each other in order to prevent thermal interference between them. Correspondingly, the main flow path is formed large in the mainstream orthogonal direction so as to cool both the electronic components arranged in parallel. In this main flow path, the portion below the electronic component greatly contributes to the cooling of the electronic component, but the portion below the two electronic components does not contribute much to the cooling of the electronic component. In general, when the output of the pump supplying the refrigerant is constant, the flow velocity is faster because the cross-sectional area of the cross section perpendicular to the main flow direction of the refrigerant flow path (hereinafter, abbreviated as the through hole cross section) becomes faster, so that the cooling performance is improved. Although there is a limit to the size because it is high and adverse effects such as pressure loss are exerted, it is desirable to reduce the cross-sectional area so as not to exceed the limit. However, the main flow path that is large in the direction orthogonal to the main flow has a through-hole cross section including a portion that does not contribute to cooling of the electronic component, and is compared with a case where the through-hole cross section is formed only at a portion that contributes to cooling of the electronic component. And there existed a problem that a cross-sectional area became large and cooling property was impaired.

  Therefore, in order to reduce the cross-sectional area, it is conceivable that the entire cross-section of the through hole has a vertically thin shape, but in this case, the columnar portion of the mold also has a vertically thin cross-section, so that deformation due to pressure during casting is not possible. It is likely to occur and there is a risk of shortening the life of the mold.

  In order to reduce the cross-sectional area, it is also conceivable that the through-hole cross section has a vertical cross section, for example, a vertical thickness is ensured below the electronic components and a vertical thickness between the two electronic components is thin. In order to form the main channel so as to have a concave cross section, the columnar portion of the mold also has a concave cross section. However, a complicated mold shape makes it difficult to manufacture the mold, and there is a risk that the mold life may be shortened due to pressure during casting.

  In order to increase the heat radiation area in this way, in the pedestal part provided with one main flow path below, the pedestal part and the main flow path are extended in the main flow direction, and enlarged in the main flow orthogonal direction. However, there are the following problems. First, if the mold has a short life, the mold needs to be remanufactured frequently, or the mold is difficult to manufacture, resulting in an increase in the cost of the mold, resulting in an increase in production cost. There is also a problem that the cooling performance is deteriorated due to an increase in the cross-sectional area of the refrigerant flow path. These are problems that occur in order to increase the heat radiation area in one main flow path. Therefore, as an improved invention of the cited document 1, it is conceivable to provide a power conversion device having a plurality of main flow paths.

  When a plurality of main flow paths are provided, a pair of inlets and outlets exist for one main flow path, and hoses are individually attached. Therefore, for a plurality of main flow paths, the number and forms of hoses must be changed, such as having a plurality of hoses or a bifurcated hose form. In this case, the degree of freedom in routing piping such as a hose is lowered, and the mountability of the power converter is deteriorated.

  On the other hand, in the power conversion device described in Patent Document 2, the area of the pedestal main surface can be increased by enlarging the recess and the water channel cover of the housing, and as a result, the heat dissipation area can be increased. However, since the water channel cover including the pipe attached to the inlet and the outlet is attached to the lower part of the housing, the lower surface of the power conversion device has an uneven shape. When the lower surface is an installation surface for the vehicle, the installation surface has irregularities, so the degree of installation freedom is reduced, and the mountability of the power converter is deteriorated.

  The present invention has been made to solve the above problems, and the present invention reduces the production cost and expands the area of the heat radiation surface that can cool the heat-generating electronic components without impairing the cooling performance and mounting performance. It aims at obtaining the vehicle-mounted power converter device.

  An in-vehicle power conversion device according to the present invention is provided below an electronic component constituting a power conversion circuit, a housing having a mounting surface on which the electronic component is mounted, and an electronic component mounted on the mounting surface. A plurality of through-holes that pass through the inside of the housing and have openings on the side wall surface of the housing and are arranged in the direction in which the mounting surface spreads, and openings of different through-holes on the same side wall surface. A refrigerant channel is formed by a through-hole, a first water channel lid, and a side wall surface covered by the first water channel lid, and the refrigerant channel has a refrigerant inlet and a outlet. A refrigerant that communicates with the through holes and cools the electronic component placed on the first placement surface above the through holes flows through all the through holes.

  According to the present invention, it is possible to increase the area of the mounting surface of the electronic component that can cool the heat-generating electronic component, that is, the area of the heat dissipation surface without reducing the production cost and without impairing the cooling performance and the mounting property.

It is a perspective view of the vehicle-mounted power converter device which concerns on Embodiment 1 of this invention. It is sectional drawing of the vehicle-mounted power converter device which concerns on Embodiment 1 of this invention, and is sectional drawing seen from the arrow direction of A1-A1 of FIG. It is sectional drawing seen from the arrow direction of A2-A2 of FIG. It is sectional drawing of the vehicle-mounted power converter device which concerns on Embodiment 2 of this invention, and is sectional drawing seen from the arrow direction of C2-C2 of FIG. It is sectional drawing seen from the arrow direction of C1-C1 of FIG. It is sectional drawing seen from the arrow direction of BB of FIG. It is sectional drawing seen from the arrow direction of C3-C3 of FIG. It is sectional drawing seen from the arrow direction of C4-C4 of FIG. It is the figure which showed the side wall surface of the housing | casing of the vehicle-mounted power converter device which concerns on Embodiment 3 of this invention. It is the figure which showed the side wall surface facing the side wall surface shown in FIG. It is sectional drawing of the vehicle-mounted power converter device which concerns on Embodiment 4 of this invention.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In addition, the same number is attached | subjected about the equivalent or corresponding components and location in a figure.

Embodiment 1 FIG.
FIG. 1 is a perspective view showing a configuration of an in-vehicle power conversion device according to Embodiment 1 of the present invention.
In FIG. 1, a vehicle-mounted power conversion device 1 houses a switching element 4 and a larger magnetic component 5 as electronic components constituting a power conversion circuit 3 in a thermally conductive housing 2. Examples of the magnetic part 5 include a capacitor and a reactor. The switching element 4 having a large heat generation density is placed on the main surface 7 of the pedestal portions 6a and 6b, and through holes 8 and 9 pass through the pedestal portions 6a and 6b. These through-holes 8 and 9 are connected to the side wall surface 11 of the housing 2 by a first water channel lid 10, and are provided with an inlet 12 and an outlet 13 for refrigerant flowing in the through-hole. A pipe 14 is connected to the inlet 12 and outlet 13 and a pipe (not shown) such as a hose is attached to the pipe 14. A refrigerant supply means (not shown) such as a pump for supplying refrigerant to the in-vehicle power converter 1 is connected to the end of a pipe such as a hose. The refrigerant supplied by the pump flows from the inlet 12 and forms a refrigerant flow formed by the through holes 8 and 9, the first water channel lid 10, and the side wall surface 11 of the housing 2 covered by the first water channel lid 10. It flows through the passage 15 and flows out from the outlet 13. The switching element 4 placed on the main surface 7 of the pedestal portions 6a and 6b is cooled by the refrigerant flowing through the refrigerant flow path 15. The magnetic part 5 is placed in a recess 16 formed between the pedestals 6a and 6b.

  Since the switching element 4 has a high heat generation density due to high-speed switching and becomes high heat, it is necessary to directly cool the switching element 4 through a through hole below the switching element 4. On the other hand, since the magnetic component 5 is a larger electronic component than the switching element 4, if it is cooled directly from below such as being placed on the main surface of the pedestal portion, the in-vehicle power conversion device will be enlarged. However, since the magnetic component 5 has a lower heat generation density than the switching element 4, it is less necessary to cool directly from below like the switching element 4. Therefore, in the present embodiment, the magnetic body component 5 is placed on a placement surface provided below the main surface 7 of the pedestal portion provided with a through hole so as to be placed in the recess 16. Is miniaturized.

  The housing 2 and the pedestal portions 6a and 6b are integrally formed by casting. Casting is completed by combining a plurality of molds, pouring molten metal such as aluminum into the mold, and when the metal cools and solidifies, the mold is pulled out in a suitable direction. The through holes 8 and 9 are molded so as to penetrate through the pedestals 6a and 6b by columnar parts (not shown) that form the through holes of the mold during casting.

2 is a cross-sectional view of the in-vehicle power conversion device according to Embodiment 1 of the present invention, showing a cross-sectional view along A1-A1 in FIG. 3, and FIG. 3 is a cross-sectional view along A2-A2 in FIG. Show.
As shown in FIG. 2, the housing 2 is provided with a first pedestal portion 6 a and a second pedestal portion 6 b in parallel to form a recess 16, and the recess 16 has a first pedestal portion 6 a and a second pedestal portion 6 b. The magnetic body component 5 is placed so as to be sandwiched between the base portions 6b. A first through hole 8 is formed in the first pedestal portion 6a, a second through hole 9 is formed in the second pedestal portion 6b, and the main surface 7 of both pedestal portions 6a, 6b. The switching element 4 is mounted on the. Further, the heat conductive potting agent 20 is filled in the recess 16 so as to fill the gap between the inner wall surface 16a of the recess 16 and the magnetic component 5, and the heat generated by the magnetic component 5 is transferred to the pedestals 6a and 6b. Heat is being transferred. The upper surface of the housing 2 is covered with a protective cover 21 when the vehicle is mounted. In this configuration, the placement surface on which the electronic component is placed refers to the surface on which the main surface 7 of both pedestal portions and the magnetic component 5 are placed, and the first placement surface is the position of both pedestal portions. The main surface 7 is indicated.

  With this configuration, the electronic components are placed side by side in the direction in which the placement surface extends in the left-right direction in FIG. 2, and accordingly, the two through holes 8 and 9 are provided side by side in the direction in which the placement surface spreads. . Of these, the switching element 4 is cooled from below by the refrigerant flowing through the through holes 8 and 9 penetrating through the two pedestals 6 a and 6 b, respectively, and the magnetic component 5 is cooled from both sides by the refrigerant flowing through the through holes 8 and 9. Is done. The direction in which the placement surface spreads is not limited to the longitudinal direction and the short direction of the placement surface.

  Here, the height in the pedestal portions 6a and 6b is higher than the height of the magnetic body component 5, that is, the magnetic body component 5 is desirably stored below the main surface 7 of the pedestal portions 6a and 6b in the figure. The potting agent 20 is preferably filled so as to cover the magnetic component 5. Although the potting agent 20 has been described as the heat transfer material, any heat transfer material may be used as long as it can transfer heat generated by the magnetic component 5 to the housing 2, particularly the inner wall surface 16 a of the recess 16, and examples thereof include gels and heat dissipation sheets. . If the heat generated by the magnetic body component 5 is transferred to the pedestal portions 6a and 6b, for example, the distance between the inner wall surface 16a of the recess 16 and the magnetic body component 5 is sufficiently short, the heat transfer material may be omitted.

  The refrigerant flowing in the two through-holes 8 and 9 flows in the direction from the front to the back of the page with respect to the first through-hole 8, and from the back to the front of the page with respect to the second through-hole 9. Although it flows in the direction of heading, there is no problem with a configuration that flows in the opposite direction. The cross-section of the through hole can be easily formed by making it a rectangle or a circle as shown in FIG.

  As shown in FIG. 3, openings 30 a and 30 b are formed in the side wall surface 11 of the housing 2 at both ends of the first through hole 8, and openings 31 a and 30 b are formed at both ends of the second through hole 9. 31 b is formed on the side wall surface 11 of the housing 2. The refrigerant inlet 12 to which the inlet pipe 14 is attached communicates with the first through hole 8, and the refrigerant outlet 13 to which the outlet pipe 14 is attached is connected to the second through hole 9. Communicated with.

  In order to connect the first through-hole 8 and the second through-hole 9 in series, the opening 30a of the first through-hole 8 and the opening 31a of the second through-hole 9 should be covered. A first water channel lid 10 having a shape is attached to the side wall surface 11 of the housing 2. By applying a sealing agent to the edge of the first water channel lid 10 and fixing it with bolts, the refrigerant is prevented from leaking from the connecting portion between the first water channel lid 10 and the side wall surface 11 of the housing 2. Is possible. The first water channel lid 10 is desirably formed of sheet metal press molding or hard resin in order to reduce costs.

  The first water channel lid 10 has a bowl shape, and its corner portion 10a has a gentle shape such as an R shape or a slope. Similarly, the corner portion 11a of the side wall surface 11 covered with the first water channel lid 10 also has a corner portion 11a. Use a gentle shape such as an R shape or a slope. By making the corner 10a of the first water channel lid 10 into a gentle shape, stagnation of the refrigerant flow into the corner 10a is prevented. On the other hand, by making the corner portion 11a of the side wall surface 11 into a gentle shape, it is possible to avoid separation of the refrigerant flow and to reduce the pressure loss of the refrigerant in the corner portion 11a. An effect is also obtained when only one of the corner portion 10a of the first water channel lid 10 and the corner portion 11a of the side wall surface 11 covered by the first water channel lid 10 is subjected to the above treatment.

  A lid 34 is attached to the opening 30b of the first through hole 8 and the opening 31b of the second through hole 9 in order to close the openings. In order to solve the stagnation of the refrigerant flow, it is desirable that the lid 34 protrudes inward of the through hole, that is, upward in FIG. 3 to fill a dead space where the refrigerant stays.

  With this configuration, the refrigerant flowing through the refrigerant flow path 15 flows in from the introduction port 12 through the inlet pipe 14, and the inside of the first through hole 8, the first water channel lid 10, and the second through hole 9. In this order, and flows out from the outlet 13 to which the outlet pipe 14 is attached. The arrow shown in FIG. 3 has shown the direction through which a refrigerant | coolant flows.

1 to 3 exemplify the in-vehicle power conversion device according to the first embodiment. In FIG. 2, the mounting surface on which the electronic component is mounted has irregularities, but the height of the magnetic component 5 is high. If the height is not so high, the mounting surface may be a flat surface without providing the recess 16.
In addition, although two through holes 8 and 9 are formed in FIG. 2, two or more through holes may be provided. In this case, the fact that the plurality of through holes are arranged in the direction in which the placement surface spreads does not mean that the through holes are arranged in parallel, but may be arranged so as to be shifted in the vertical direction in the figure. For this reason, the mounting surface may be formed in a step shape, and the through holes may be formed in a step shape. Further, a plurality of through holes may be formed side by side with respect to one pedestal portion, and when viewed from above the housing, some of the through holes may overlap each other. These determine the positions, shapes, etc. of the plurality of through holes in consideration of the layout of the electronic components to be placed.

  Further, since the first water channel lid 10 has a shape of a lid, its molding and processing are easy, and the side wall surface 11 of the housing 2 covered with the first water channel lid 10 is also configured as the refrigerant flow channel 15. This side wall surface can be used effectively. In addition, when an elastic connecting member such as a hose is used instead of the first water channel lid, the durability deteriorates as compared with the first water channel lid 10, and therefore the first water channel lid 10 is positively used. .

Moreover, the side wall surface 11 of the housing | casing 2 covered with the 1st water channel cover 10 is dented, and the 1st water channel cover 10 is formed in plate shape, Therefore The recessed side wall surface 11 and the 1st water channel lid 10 It is also possible for refrigerant to circulate between them. In this case, the size can be reduced as compared with the case where the first water channel lid 10 is formed in a bowl shape.
Further, in FIG. 3, the opening 30 b and the opening 31 b are closed by the lid 34, but the opening 30 b and the opening 31 b are covered by the first water channel lid 10 instead of the lid 34. The opening 31b may be connected so that the refrigerant flows in parallel to the two first water channel lids 10.
Further, in the case of having three or more through holes, the first water channel lid 10 not only connects the openings of the two through holes but also connects the openings of the three or more through holes. May be. Thus, the refrigerant flowing through all the through holes means that the flow of the refrigerant flowing in from the inlet 12 is led out from the outlet 13 through all the through holes regardless of whether they are in series or in parallel. say.

  Further, the introduction port 12 and the outlet port 13 are provided on the side surfaces of the housing 2 that face each other in the left-right direction in FIG. 3, but each of them may be in communication with at least one of the plurality of through holes. It is also possible to use the part 30 b as the inlet 12 and the opening 31 b as the outlet 13. In this case, it is not necessary to cast the housing 2 so as to provide an opening on the lateral side surface of the housing 2 in the drawing.

As described above, according to the on-vehicle power conversion device configured as described above, the plurality of through holes are arranged in the direction in which the mounting surface of the electronic component spreads, so that the refrigerant flowing through the through holes is mounted above the through holes. Since the electronic component to be placed is cooled, the area of the mounting surface of the electronic component that can cool the electronic component, that is, the area of the heat dissipation surface can be increased. In addition, the present invention has the following effects (a) to (f) with respect to the following means taken to expand the area of the heat radiating surface, that is, while suppressing the production cost and cooling performance and The area of the heat dissipation surface can be increased without impairing the mountability.
(A) Compared to the case where one through-hole is extended in the mainstream direction, a plurality of through-holes are provided in order to obtain a necessary heat radiation area, so that the columnar part for molding the through-hole can be shortened. As a result, the life of the mold can be extended, the frequency of remanufacturing the mold can be suppressed, and the production cost can be reduced as a result.
(A) Compared to the case where one through hole is enlarged in the mainstream orthogonal direction, the cross section of the through hole is only below the electronic component. Improves.
(C) Further, when one through-hole is enlarged in the mainstream orthogonal direction and the entire cross-section of the through-hole is thinned in the vertical direction, which is considered as an improvement when one through-hole is enlarged in the mainstream orthogonal direction In comparison, the thickness in the vertical direction of the cross-section of the through-hole can be ensured, the mold life can be extended, and the production cost can be reduced.
(D) As a similar improvement, one through hole is enlarged in the mainstream orthogonal direction, and the cross section of the through hole is secured in the vertical direction below the electronic component, and the lower part between the two electronic components in the vertical direction. Compared to the case where it is made thinner, the through hole cross section can be formed in a simple shape such as a rectangle or a circle, so that it is possible to extend the life of the mold, and a simple column shape can be formed. Simplify and reduce production costs.

  (E) Moreover, since the first water channel lid connects the openings of the through holes, it is not necessary to change the number and form of the pipes attached to the inlet and the outlet. Therefore, compared with the case where a plurality of through-holes are provided and the pipes are attached to the respective through-holes, the degree of freedom in routing the pipes is improved and the mountability is improved.

  (F) Furthermore, the opening of the through hole is on the side wall surface of the housing, and the first water channel lid connects the openings of the through holes on the same side wall surface. There is no uneven shape due to constituting the refrigerant flow path. Therefore, the degree of freedom of installation is improved and the mountability is improved as compared to the case where the refrigerant flow path is configured by covering the concave portion on the rear surface of the housing with the water channel cover.

  Further, the plurality of through holes are provided below the electronic component mounted on the first mounting surface that is the heat dissipation surface above each through hole, and the refrigerant flows through all of the through holes. Since the coolant channel is formed in the first channel cover, the first water channel lid connecting the through hole and the opening of the through hole is more than necessary for cooling the electronic component placed on the first placement surface. It is possible to reduce the size and cost without taking the configuration. Moreover, since the opening part of the through-hole in the same side wall surface is connected, it is easy to connect and formation of the 1st water channel cover to connect is also easy.

  This power conversion device is mounted on a vehicle, and the above-mentioned effects such as improvement in cooling performance, improvement in piping routing freedom, and improvement in installation flexibility are particularly effective for the cooling performance and shape of the load. It is exhibited in a vehicle with large restrictions on arrangement and the like, and can be mounted on various vehicles.

  In addition to the configuration having the above effects, in the present embodiment, a recess for placing the electronic component is provided between the two through holes. That is, the magnetic component 5 is placed so as to be sandwiched between the first pedestal portion 6a and the second pedestal portion 6b. Conventionally, this magnetic component 5 was not configured to actively cool, but since a recess for placing the electronic component was provided between the two through holes, this electronic component can be cooled from both sides. Coolability for the electronic component is improved. Further, in order to cool the magnetic part 5, a new refrigerant flow path is not formed below the magnetic part 5, but the existing refrigerant flow path 15 is used, so that the casing 2 is large in the vertical direction. Manufacturing cost is suppressed, and the number of through holes is maintained.

  Moreover, in this Embodiment, the heat-transfer material which fills the clearance gap between the inner wall surface of a recessed part and the electronic component mounted in the recessed part is provided. That is, the potting agent 20 fills the periphery of the magnetic component 5 between the two pedestals 6a and 6b. With this configuration, the thermal conductivity between electronic components placed in the refrigerant flow path and the recess is improved, and the cooling performance of the electronic components is further improved.

  Moreover, in this Embodiment, the electronic component mounted in a recessed part is accommodated below from the main surface 7 of the base parts 6a and 6b used as a 1st mounting surface. That is, the magnetic component 5 is located below the main surface 7 of the two pedestals 6a and 6b in FIG. With this configuration, the heat transfer material can be filled up to the top of the electronic component placed in the recess, so that heat generated from the top of the electronic component is also conducted to the refrigerant flow path via the heat transfer material. The cooling performance of electronic parts is further improved. Moreover, since it is possible to form a through hole that increases the area of the side surface facing the electronic component in order to improve the cooling performance, the degree of freedom in forming the through hole is improved.

  Further, in the present embodiment, the switching element 4 is placed on the main surface 7 of the pedestal portions 6a and 6b serving as the first placement surfaces, and the magnetic component 5 that is a reactor or a capacitor is placed in the recess 16. The With this configuration, the switching element 4 is directly cooled by the refrigerant flowing below, and the magnetic component 5 having a lower heat generation density is indirectly cooled by the refrigerant flowing on both sides via the heat transfer material or the air layer. , Ensure the cooling of both electronic components. In addition, the magnetic component 5 larger than the switching element 4 is placed in the concave portion, so that the size of the device is not increased.

  Moreover, in this Embodiment, in the cross section of the direction where a mounting surface spreads, the corner | angular part of the side wall surface of the housing | casing covered with a 1st water channel lid and the corner | angular part of a 1st water channel lid are R shape, a slope, etc. It is a gentle shape. That is, when FIG. 3 is seen, the corner | angular part 10a of the 1st water channel cover 10 and the corner | angular part 11a of the side wall surface 11 of the housing | casing 2 are gentle shapes. With this configuration, it is possible to prevent stagnation of the refrigerant flow, avoid separation of the refrigerant flow, and reduce the pressure loss of the refrigerant at the corners.

Embodiment 2. FIG.
The second embodiment is a form in which the shape of the refrigerant flow path is changed with respect to the first embodiment. FIG. 4 is a cross-sectional view of the in-vehicle power conversion device according to the second embodiment, and shows a cross-sectional view taken along C2-C2 in FIG. Similarly, FIG. 5 shows a C1-C1 sectional view of FIG. 4, FIG. 6 shows a BB sectional view of FIG. 4, FIG. 7 shows a C3-C3 sectional view of FIG. C4-C4 sectional drawing of is shown.

In the second embodiment, the first through hole 8 in the first embodiment is divided in the vertical direction in FIG. 4 to be a first through hole 8a and a first through hole 8b. The same applies to the second through hole 9.
As shown in FIG. 4, the first pedestal portion 6a has a first through hole 8a formed in the upper portion of the pedestal and a first through hole 8b formed in the lower portion of the pedestal. The second through hole 9a is formed in the upper part of the pedestal, and the second through hole 9b is formed in the lower part of the pedestal. The refrigerant flows in the first through hole 8a and the second through hole 9b in the direction from the back to the front in the first through hole 8a and the second through hole 9b by the refrigerant inlet and outlet, the first water channel lid, and the second water channel lid, which will be described later. In the first through hole 8b and the second through hole 9a, the refrigerant flows in a direction from the front side to the back side of the page.

  As shown in FIGS. 5, 6, and 7, as the second water channel lid, the second water channel lid 44 a includes an opening 40 a of the first through hole 8 a and an opening 41 a of the first through hole 8 b. Are connected. On the other hand, the second water channel lid 44b connects the opening 42a of the second through hole 9a and the opening 43a of the second through hole 9b.

  As shown in FIG. 5, the first water channel lid 10b connects the opening 40b of the first through hole 8a and the opening 42b of the second through hole 9a. As shown in FIGS. 6, 7, and 8, the opening 41 b of the first through hole 8 b and the opening 43 b of the second through hole 9 b are each covered with a lid 34. In order to solve the stagnation of the refrigerant flow, it is desirable that the lid 34 is convex toward the inside of the through hole to fill a dead space where the refrigerant stays.

  As shown in FIGS. 6, 7, and 8, the refrigerant introduction port 12 is provided in the first through hole 8 b, and the refrigerant discharge port 13 is provided in the second through hole 9 b. As shown in FIGS. 5, 7, and 8, the first water channel lid 10 b and the second water channel lids 44 a and 44 b are bowl-shaped, and the respective corner portions 10 a and 44 c have gentle shapes. Is desirable. Moreover, it is desirable that the corner portion 11a of the side wall surface 11 of the housing 2 covered with the water channel lid has a gentle shape.

  With this configuration, the refrigerant flows from the introduction port 12, and the first through hole 8b, the second water channel lid 44a, the first through hole 8a, the first water channel lid 10b, the second through hole 9a, the second The second water channel lid 44b and the second through hole 9b flow in this order and flow out from the outlet port 13. Note that the arrows shown in FIGS. 5 to 8 indicate the direction in which the refrigerant flows. Other configurations are the same as those in the first embodiment.

  As described above, according to the in-vehicle power conversion device of the present embodiment, since at least one through hole among the plurality of through holes is divided in the vertical direction, the cross-sectional area of the through hole can be reduced. The flow rate of the gas increases and the cooling performance improves. Moreover, it has the 2nd water channel lid which connects this divided through-holes by the same side wall surface of a housing | casing, and a 1st water channel lid is at least one of this divided through hole, and another through-hole. With the configuration in which the refrigerant is connected, the refrigerant flows through all the through holes. That is, the first through hole 8 and the second through hole 9 in the first embodiment are changed to the first through hole 8a, the first through hole 8b, the second through hole 9a, and the second through hole 9b, respectively. The first water channel lid 10b is connected with the openings of these through holes as the first water channel lid, and the second water channel lid 44a and the second water channel lid 44b are connected as the second water channel lid, thereby cooling. Improves.

  Here, when providing a through-hole in order to cool only the switching element 4 on the base parts 6a and 6b, it is not necessary to make a through-hole thick in an up-down direction. On the other hand, when the magnetic component 5 placed in the recess 16 formed by the pedestal portions 6a and 6b is also cooled by the through hole, the magnetic component 5 in the through hole is improved in order to improve the cooling performance of the magnetic component 5. It is necessary to increase the side area facing the. When the side area is increased, the cross-sectional area of the through hole is also increased, so that the flow rate of the refrigerant is decreased and the cooling performance is lowered. Therefore, the through-hole is divided in the vertical direction to increase the flow rate of the refrigerant, and the side area of the through-hole facing the magnetic part 5 is also secured, so that both the switching element 4 and the magnetic part 5 are provided. On the other hand, the cooling performance is further improved.

  In this embodiment, it is divided into two in the vertical direction, but is not limited to this, and may be divided into a plurality of three or more. 4 may be slightly shifted from each other in the left-right direction in FIG. 4, which is the direction in which the placement surface spreads, while dividing only the first through hole 8 in the vertical direction. In addition, two through holes are not necessarily arranged in the direction in which the placement surface spreads, and it is only necessary that two or more through holes are arranged and at least one of the plurality of through holes is divided in the vertical direction. A recess for placing the electronic component is provided between the divided through hole and the other through hole, and the electronic component is cooled.

  Moreover, in this Embodiment, although both the opening parts 40b and 42b of the 1st through-hole 8a and the 2nd through-hole 9a in the upper part of the bases 6a and 6b were connected with the 1st water channel lid 10b, The through holes in the lower part of the pedestal part are connected so that both the openings 41b and 43b of the first through hole 8b and the second through hole 9b in the lower part of 6a and 6b are connected by the first water channel lid 10b. Thus, a refrigerant flow path may be formed. Further, the through holes in the upper part of the pedestal part and the through holes in the lower part of the other pedestal part so that both openings 40b, 43b of the first through hole 8a and the second through hole 9b are connected by the first water channel lid 10b. The coolant channel may be formed by connecting the holes. The formation of the refrigerant flow path is appropriately determined in accordance with the arrangement of the inlet and outlet and the layout around the in-vehicle power converter.

  Moreover, you may provide the water channel cover which covers all the openings in the same side wall surface 11 of the housing | casing 2. FIG. In this case, this water channel lid serves as both the first water channel lid and the second water channel lid. At this time, the unevenness | corrugation which guide | induces the direction through which a refrigerant | coolant flows may be provided inside a water channel lid.

Embodiment 3 FIG.
The third embodiment is a form in which the number of pedestals and the shape of the refrigerant flow path are changed with respect to the second embodiment. FIG. 9 is a diagram illustrating a side wall surface of a housing of the in-vehicle power conversion device according to the third embodiment, which is viewed from the same direction as the cross-sectional views of FIGS. 2 and 4. FIG. 10 is a diagram showing a side wall surface facing the side wall surface shown in FIG.

  As shown in FIGS. 9 and 10, the switching element 4 is placed on a pedestal portion (not shown), and a magnetic part (not shown) is placed between the pedestal portions so as to be sandwiched between the pedestal portions. ing. In addition, a plurality of through holes are arranged in the direction in which the mounting surface on which the electronic component is placed spreads and in the vertical direction, that is, in the horizontal direction and vertical direction in the figure, and in the horizontal direction, the first water channel lids 10c and 10d pass through. The holes are connected, and in the vertical direction, the second water channel lids 50a, 50b, 50c, 50d, and 50e connect the through holes.

  The refrigerant flows in from the inlet provided in the through hole 51, flows through all the through holes in series, and flows out from the outlet provided in the through hole 52.

As described above, when the number of heat-generating electronic components increases, a new pedestal and a through hole that penetrates the pedestal are provided, and the electronic component is placed on the pedestal to cool the electronic component. Is possible. At this time, the magnetic parts placed between the pedestals are also cooled from both sides.
As described above, even if the form in which a plurality of through holes are arranged in the direction in which the mounting surface spreads and the form in which the through holes are divided in the vertical direction are combined, they are described in the first and second embodiments. It has the effect of.

Embodiment 4 FIG.
In the fourth embodiment, the shape of the housing is changed with respect to the second embodiment. FIG. 11 is a cross-sectional view of the in-vehicle power converter according to Embodiment 4, and corresponds to the cross-sectional views of FIGS. 2 and 4.

  As shown in FIG. 11, the switching element 4 a and the magnetic part 5 a constituting the power conversion circuit 3 and the switching element 4 b and the magnetic part 5 b constituting the second power conversion circuit 3 b are accommodated in the housing 2. The switching element 4a is mounted on the main surface 7 of the first pedestal portion 6a and the second pedestal portion 6b, and the switching element 4b is mounted on the main surface 7b of the third pedestal portion 6c and the fourth pedestal portion 6d. Is done. The magnetic part 5a is placed between the first base part 6a and the second base part 6b, and the magnetic part 5b is placed between the third base part 6c and the fourth base part 6d. The potting agent 20 is filled in the gap between the base part and the magnetic part. In this configuration, the second mounting surface includes a surface on which the main surface 7b and the magnetic component 5b are mounted.

  A first through hole 8a and a first through hole 8b are formed through the first pedestal portion 6a and the third pedestal portion 6c, and the second pedestal portion 6b and the fourth pedestal portion 6d. A second through hole 9a and a second through hole 9b are formed through the inside. Although the through hole is divided into upper and lower parts to increase the flow rate of the refrigerant, it may be a through hole that is not divided as in the first embodiment.

  With this configuration, the switching element 4a placed on the main surface 7 is cooled by the refrigerant flowing in series through all the through-holes, and the magnetic component 5a is actively cooled from both sides, and placed on the main surface 7b. The placed switching element 4b is cooled, and the magnetic part 5b is actively cooled from both sides.

  As described above, the second electronic component constituting the second power conversion circuit different from the power conversion circuit is provided, the second mounting surface is provided below the through hole, and the second electronic component is the second electronic component. By being mounted on the second mounting surface, not only the electronic components of the power conversion circuit but also the electronic components of the second power conversion circuit can be cooled by the refrigerant flowing through the refrigerant flow path. That is, since the lower surface of the in-vehicle power conversion device does not have an uneven shape due to constituting the refrigerant flow path 15, it is possible to easily form the mounting surface of the second power conversion circuit 3b on the lower surface, Since both the power conversion circuits share the housing 2 and the refrigerant flow path 15, the number of components of the in-vehicle power conversion device can be reduced and the size can be reduced. In this configuration, by storing the electronic components of the two power conversion circuits 3 and 3b in one housing 2, both the electronic components can be cooled by the single refrigerant flow path 15. Furthermore, in the present embodiment, there are no first water channel lid, second water channel lid and lid that form a refrigerant flow path on both mounting surfaces of the power conversion circuit 3 and the second power conversion circuit 3b. Even if the refrigerant leaks from the sealing portion between these and the casing, the refrigerant does not flow into both the mounting surfaces and leaks out of the apparatus, so that an electrical short circuit is not caused.

  Further, since one power conversion circuit is not arranged up and down, but separate power conversion circuits are arranged up and down, it is not necessary to connect upper and lower electronic components, and the circuit configuration is not complicated.

  The present invention is not limited to Embodiments 1 to 4 described above, and any configuration that satisfies the effects of the embodiments can be used in the in-vehicle power conversion device.

DESCRIPTION OF SYMBOLS 1 Vehicle-mounted power converter 2 Case 3 Power conversion circuit 3b 2nd power conversion circuit 4 Switching element 4a Switching element 4b Switching element 5 Magnetic body part 5a Magnetic body part 5b Magnetic body part 6a 1st base part 6b 2nd Base part 6c third base part 6d fourth base part 7 main surface 7b main surface 8 first through hole 8a first through hole 8b first through hole 9 second through hole 9a second through hole Hole 9b Second through hole 10 First water channel lid 10a Corner portion of first water channel lid 10b First water channel lid 11 Side wall surface 11a Corner portion of side wall surface 12 Inlet port 13 Outlet port 15 Refrigerant flow Path 16 Recess 16a Inner wall surface (of recessed portion) 20 Potting agent 30a Opening portion 30b (of first through hole) Opening portion 31a (of second through hole) Opening portion 31b (second through hole) Of through-holes) Opening 40a (first through-hole) opening 40b (first through-hole) opening 41a (first through-hole) opening 41b (first through-hole) opening 42a (second through-hole) Opening 42b (second through-hole) opening 43a (second through-hole) opening 43b (second through-hole) opening 44a second water channel lid 44b second Waterway lid

An in-vehicle power conversion device according to the present invention includes an electronic component constituting a power conversion circuit, a casing having a mounting surface on which the electronic component is mounted, and a casing below the electronic component mounted on the mounting surface. A plurality of through-holes that are formed integrally with the body, penetrate the inside of the housing, have openings on opposing side wall surfaces of the housing, and are arranged in the direction in which the mounting surface spreads, are different on the same side wall surface A first water channel lid that connects the opening of the through hole, and the refrigerant channel is configured by the through hole, the first water channel lid, and the side wall surface covered by the first water channel lid. The refrigerant introduction port and the outlet port communicate with the through hole, and the refrigerant that cools the electronic component placed on the first placement surface with the placement surface above the through hole as the first placement surface. All the through holes communicate with each other.

Claims (8)

Electronic components constituting the power conversion circuit;
A housing having a mounting surface for mounting the electronic component;
Provided below the electronic component placed on the placement surface, penetrates through the housing, has an opening on the side wall surface of the housing, and is arranged in a direction in which the placement surface spreads. A through hole,
A first water channel lid connecting the openings of the different through holes on the same side wall surface;
With
The inlet port and the outlet port communicate with the through hole by the through hole, the first water channel lid, and the side wall surface covered with the first water channel lid, and the first placement above the through hole. A vehicle-mounted power conversion device comprising a refrigerant flow path in which a refrigerant for cooling the electronic component placed on the surface flows through all the through holes. A recess for mounting the electronic component different from the electronic component mounted on the first mounting surface is provided between two of the plurality of through holes. The in-vehicle power converter according to claim 1. The in-vehicle power converter according to claim 2, further comprising a heat transfer material that fills a gap between the inner wall surface of the recess and the electronic component placed on the recess. The in-vehicle power converter according to claim 2, wherein the electronic component placed in the recess is housed below the first placement surface. At least one of the through holes constituting the recess is divided in the vertical direction,
A second water channel lid that connects the divided through holes with the side wall surfaces;
5. The in-vehicle power converter according to claim 2, wherein the first water channel lid connects at least one of the divided through holes and the other through hole. 6. The electronic component placed on the first placement surface is a switching element,
The in-vehicle power converter according to claim 2, wherein the electronic component placed in the recess is a reactor or a capacitor. The corner of the side wall surface and the corner of the first water channel lid covered by the first water channel lid have a gentle shape in a cross section in the direction in which the placement surface spreads. The in-vehicle power converter according to any one of claims 1 to 6. A second electronic component constituting a second power conversion circuit different from the power conversion circuit;
The second mounting surface is provided below the through hole, and the second electronic component is mounted on the second mounting surface. In-vehicle power converter.

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